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Showing posts with label portable. Show all posts
Showing posts with label portable. Show all posts

Monday, June 21, 2010

Xilinx tackles FPGA power with 28nm Series-7

Scalable from low to high density with 28nm Virtex-7, Kintex-7, and Artix-7 families

By Nick Flaherty www.flaherty.co.uk

Xilinx is tackling two of the key barriers to using FPGAs - power and cost. It is reducing the power consumption of its new 7 Series devices families by 50% over the previous generation and has developed an architecture that wil scale across three families, helping to reduce costs. However, the idea of heading into mobile equipment with some of these parts is somewhat optimisitic - low power serves more purpose in increasing channel density in networking and telecoms applications.
“The 7 series represents a new juncture for Xilinx, and the FPGA industry in general, as we bring our technology portfolio to new markets by putting a significant emphasis on lowering power consumption,” said Xilinx President and CEO Moshe Gavrielov. “In addition to delivering what we and our customers expect from Moore’s Law in terms of capacity and performance with each new generation, we continue our focus on opening programmable logic to a broader audience by delivering design platforms targeted toward the specific needs of new users and markets.”The low static power comes from a HKMG (high-K metal gate) process optimized for low static power consumption (see “Xilinx Picks 28nm High-Performance, Low-Power Process to Accelerate Platforms for Driving the Programmable Imperative”) that lowers static power consumption by 50 percent compared to the alternative 28nm high-performance process. Xilinx then applied architectural enhancements to lower dynamic power consumption both for logic and I/O, while also introducing intelligent clock-gating technology with the release of ISE Design Suite 12. The result is an FPGA series that provides 50 percent lower total power consumption compared to Virtex-6 and Spartan-6 FPGAs and 30 percent lower than alternative 28nm FPGA device families.
Designers can take full advantage of up to 4.7TMACS in DSP performance symmetric mode (2.37TMACs in non-symmetric mode) and 2 million logic cells at clock speeds of up to 600MHz, and achieve up to 2.4Tbps high-speed connectivity all while staying within their power budgets.
All 7 series FPGAs share a unified architecture that enables customers to easily scale their designs up or down in capability to reduce cost and power or increase performance and capability, thereby reducing their investment in developing and deploying products across low-cost and high-performance families. The architecture is derived from the widely successful Virtex-series-based architecture and has been designed to simplify reuse of current Virtex-6 and Spartan-6 FPGA designs. It is also supported by the EasyPath FPGA cost reduction solution for the move to fixed silicon that further improves productivity by enabling a guaranteed 35 percent cost reduction with no incremental conversion or engineering investment.
Customers who need the lower power or increased system performance and capacity provided in the new 7 series FPGAs can begin designs in Virtex-6 and Spartan-6 FPGAs and move the designs when the time is right through the adoption of the AMBA AXI interconnect standard enabling plug-and-play IP usage to help customers improve productivity and development costs.
“Integrating 6-LUT architecture and working with ARM on the AMBA specification for these devices supports IP reuse, portability, and predictability,” said Andy Norton, CTO for Systems Architecture, Cloudshield Technologies, an SAIC company. “A unified architecture, new paradigm-changing processor-centric devices and hierarchical-based design flows in next-gen tools, will result in increased productivity, flexibility, system-on-chip capabilities and portability from previous generation architectures.”
The devices use the same logic architecture, Block RAM, clocking technology, DSP slices, and SelectIO™ technology and build on previous generations of devices delivered by Xilinx’s patented Virtex series ASMBL block architecture. This next generation ASMBL architecture provides unprecedented flexibility and scalability that enables customers to most effectively use the full range of logic densities.

Xilinx 7 Series FPGA Families:
Virtex-7 Family: 2X system performance improvement at 50 percent lower power compared to Virtex-6 devices, the ultra high-end Virtex-7 family sets new industry benchmarks with 1.8X greater signal processing performance, 1.6x greater I/O bandwidth, 2X greater memory bandwidth with 2133 Mbps memory interfacing performance, and delivers the industry’s largest density FPGA with 2 million logic cells, which is 2.5X greater density than any previous or existing FPGA. EasyPath-7 devices are also available for all Virtex-7 FPGAs for a guaranteed 35% cost reduction without requiring any design conversion. Virtex-7 devices enable 400G bridging and switch fabric wired communication systems that are at the heart of the global wired infrastructure, advance RADAR systems, and high-performance computer systems that require single-chip TeraMACC signal processing capabilities, as well as the logic density, performance, and I/O bandwidth required for next generation test and measurement equipment. The Virtex-7 family will include “XT” extended capability devices with as many as 80 transceivers supporting individual line rates up to 13.1Gbps and devices that provide up to 1.9Tbps serial bandwidth. Also, these devices offer up to 850 SelectIO pins enabling the industry’s greatest number of parallel banks of 72-bit DDR3 memory interfaces supporting 2133Mbps. Future devices will also feature 28Gbps transceivers.

Kintex-7 Family: Establishing a new category of FPGAs, the Kintex-7 family delivers Virtex-6 family performance at less than half the price for a 2x price/performance improvement while consuming 50 percent less power. The family includes high-performance 10.3Gbps or lower-cost optimized 6.5Gbps serial connectivity, memory, and logic performance required for applications such as high volume 10G optical wired communication equipment. It also provides a balance of signal processing performance, power consumption, and cost to support the deployment of Long Term Evolution (LTE) wireless networks, meet the aggressive power and cost requirements required for next generation high definition 3D flat panel displays, and deliver the performance and bandwidth needed for next generation broadcast video-on-demand systems.

Artix-7 Family: Delivering 50 percent lower power and 35 percent lower cost compared to the Spartan-6 family, the Artix-7 family uses small form-factor packaging and the unified Virtex-series based architecture to deliver the performance required to address cost-sensitive, high-volume markets previously served by ASSPs, ASICs, and low-cost FPGAs. This new family meets low power performance requirements of battery-powered portable ultrasound equipment, and addresses small form factor, low power requirements for commercial digital camera lens control, as well as the strict size, weight, power, and cost (SWAPc) requirements for military avionics and communications equipment.

Availability

Early access ISE Design Suite software supporting 7 series FPGAs is now available. Initial devices will be available in Q1 of next year.

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Thursday, June 03, 2010

Industry drives ARM-based Linux devices through Linaro

ARM, Freescale, IBM, Samsung, ST-Ericsson and Texas Instruments Form New Company to Speed the Rollout of Linux-Based Devices

By Nick Flaherty www.flaherty.co.uk

ARM, Freescale, IBM, Samsung, ST-Ericsson and Texas Instruments have created the not-for-profit company, Linaro, to provide new resources and industry alignment for open source software developers using Linux on the world’s most sophisticated semiconductor System-on-Chips (SoCs).
Linaro will invest resources in open source projects that can then be used by Linux-based distributions such as Android, LiMo, MeeGo, Ubuntu and webOS.
Linaro will provide a stable and optimized base for distributions and developers by creating new releases of optimized tools, kernel and middleware software validated for a wide range of SoCs, every six months.
Linaro’s base of software and tools will be applicable to a wide range of markets, helping reduce time-to-market for products such as smart phones, tablets, digital televisions, automotive entertainment and enterprise equipment. By providing the common foundations of tools and software for other distributions and stacks to build upon, Linaro enables greater operational efficiency for the electronics industry.
Linaro’s first software and tools release is due out in November 2010, and will provide optimizations for the latest range of ARM Cortex-A family of processors.
Traditionally, the Linux and open-source software communities focused on solving the software problems of enterprise and computing markets with a limited choice of processor platforms. The open source community is transitioning to create advanced Web-centric consumer devices using high profile open source based distributions and a wide range of high-performance, low-power ARM®-based SoCs. Linaro will make it easier and quicker to develop advanced products with these high profile distributions by creating software commonality across semiconductor SoCs, from multiple companies.
In addition to providing a focal point for open source software developers, consumers will benefit by the formation of Linaro. Linaro’s outputs will accelerate the abundance of new consumer products that use Linux-based distributions such as Android, LiMo, MeeGo, Ubuntu and webOS in conjunction with advanced semiconductor SoCs to provide the new features consumers desire at the lowest possible power consumption.
“The dramatic growth of open source software development can now be seen in internet-based, always-connected mobile and consumer products,” said Tom Lantzsch, executive officer of Linaro. “Linaro will help accelerate this trend further by increasing investment on key open source projects and providing industry alignment with the community to deliver the best Linux-based products for the benefit of the consumer.”
Linaro will work with the growing number of Linux distributions to create regular releases of optimized tools and foundation software that can be used widely by the industry, increasing compatibility across semiconductors from multiple suppliers. As a result, Linaro’s resources and open source solutions will allow device manufacturers to speed up development time, improve performance and reduce engineering time spent on non-differentiating, low-level software. Linux distributions, open source and proprietary software projects will benefit from Linaro's investment, with more stable code becoming widely available as a common base for innovation.
Linaro engineers will contribute to a wide range of open source projects covering areas such as tools, kernel, graphics and boot code. Linaro intends to work in partnership with the Linux Foundation to align on core operating principles.
In addition to ARM and IBM, four of the world’s leading application processor companies, Freescale, Samsung, ST-Ericsson and Texas Instruments, will align open source engineering efforts within Linaro.
“ARM and our partners have a long history of working with, and supporting, open source software development for complex SoCs based on the ARM architecture,” said Warren East, ARM CEO. “As a founding member of Linaro, we are working together with the broader open source community to accelerate innovation for the next generation of computing, focusing on delivering a rich connected experience across the diversity of devices in our daily lives.”
”Freescale is taking a leadership position in shaping the future of consumer electronics by enabling entirely new categories of smart mobile devices based on processors,” said Lisa Su, senior vice president and general manager of Freescale’s Networking and Multimedia Group. “Linaro represents an important step forward in developing the ecosystem for these smart mobile devices through dramatically speeding and simplifying software development cycles and leveraging the power and strength of the open source community.”
"IBM believes that leadership with Linux solutions begins with effective collaboration in the community, and IBM's ten year history of working with the Linux community has resulted in a strong, mutually beneficial relationship,” said Daniel Frye, vice president, open systems development, IBM. "IBM's ongoing collaboration has contributed to the widespread adoption of Linux throughout the data center. We are strong proponents of working with partners such as ARM to further our commitment, ensuring Embedded Linux is the leading platform for innovation in the mobile and consumer electronics markets."
“Samsung is an industry leader in high performance, low power application processors for mobile handset and other consumer devices. We fully appreciate the significance of having an optimized Linux software foundation and tools for our ARM CPU core base products, to support our customers’ needs with high quality solutions,” said Yiwan Wong, vice president, System LSI marketing, Samsung Electronics. “We are pleased to join Linaro as a foundation member and work together with ARM to serve the interests of our customers.”
“Open source has become an engine for innovation in the smart phone and consumer electronics market,” said Teppo Hemia, vice president, 3G Multimedia Platforms Business Unit of ST-Ericsson.” Being an active contributor in the open source community, we are excited to be one of the founding members of Linaro and expect our combined efforts to accelerate the development of Linux-based devices.”
“Linaro is intently focused on delivering critical open source components to enable developers building on ARM-based processors. An important element of that delivery is a more complete, higher quality development toolset that increases performance. In our leadership role, TI will support Linaro’s efforts by leveraging our open source expertise—evidenced by our participation in Linux kernel enhancement submissions and our support of popular industry development boards,” said Remi El-Ouazzane, vice president and general manager, OMAP Platform Business Unit, TI.

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Wednesday, November 25, 2009

MEMS microphones for a dollar from ST and Omron deal

ST Microelectronics has teamed up with Omron to drive the cost of micromachined, highly integrated silicon MEMS microphones.
The deal will see the devices falling to under $1, says ST, using Omron's sensor technology. ST is already the leading supplier of MEMS for consumer and portable applications and the third largest MEMS manufacturer overall. , but will use Omron's MEMS sensor technology.
The key is that ST is the only manufacturer that can mount and package multiple MEMS microphone devices at a time, facilitating high-volume production, using a proven packaging technology very similar to that used for motion sensors.
MEMS microphones can be made smaller than the most compact microphones and are less susceptible to mechanical vibration, temperature variations and electromagnetic interference, which is important in cell phones and other devices with an audio input, such as notebook computers, video recorders, digital cameras, as well as hearing aids or electronic stethoscopes.
“In the past, microphones were the domain of expert acoustics companies, but now it’s time for semiconductor MEMS players to drive the growth of this market. We’re aiming to increase the size of the MEMS microphone market by an order of magnitude,” said Benedetto Vigna, Group Vice President and General Manager of MEMS and Healthcare Division, STMicroelectronics. “This market can explode only with big and long-term committed suppliers, operating their own leading-edge MEMS fabs. Working together with our Japanese friends, we'll drive the microphone market growth as we have done in motion sensors.”

Samples of digital MEMS microphones that integrate ST’s electronic control circuit and OMRON’s micro-machined sensor in a single package will be available before the end of this year, at less than one dollar for large-volume orders.
According to iSuppli’s research dated September 2009, the market for micro-machined acoustic devices for consumer electronics and mobile handsets is forecast to grow at a revenue CAGR of 18% between 2008 and 2013, when it will exceed one billion parts per year.
MEMS microphone startup Akustica was acquired earlier this year by Robert Bosch, while another MEMS startup, Oligon, was bought by Wolfson Microelectronics to develop a range of highly integrated microphones.

Monday, November 16, 2009

32bit microcontrollers fall to 65cents


The latest family of 32bit ARM Cortex-M0 microcontrollers from NXP is driving real time oerating systems straight into the 8bit and 16bit space. The LPC1100 microcontroller family will be available from distributors in December from 65cents in 10K volumes. With 15 members initially, the family offers a seamless entry point for any 8/16-bit customers looking to start with the scalable ARM architecture throughout their entire range of product development.
This provides an excellent opportunity for RTOS vendors such as
Wittenstein
with the FreeRTOS and SafeRTOS. This is also a direct challeng to Texas Instruments with the new Coretex M0 family from recently acquired Luminary Micro.
“Existing 8-bit architectures have their origins in the early era of the semiconductor industry, resulting in limitations of address range, register restrictions, limited functionality, unsuitability for high-level languages, and little attention to power and scaling issues,” said Geoff Lees, vice president and general manager, microcontroller product line, NXP Semiconductors. “The Cortex-M0 processor core and system architecture take full advantage of today’s optimized low-power design tools, techniques, and the latest low-power, high-density silicon Flash process.”

With over 45 DMIPS of performance compared to the sub-DMIP performance typical of 8bit MCUs and 3 - 5 DMIPS for 16-bit MCUs, the LPC1100 can not only execute basic control tasks but also sophisticated algorithms, making even the most complex tasks within reach. Shorter time to do more tasks translates directly into lower energy consumption. This level of performance is delivered at 50 MHz, with extensive power optimization, at less than 10 mA. The industry standard Coremark benchmarks also show that the LPC1100 requires 40-50 percent smaller code for most common microcontroller tasks.
“It may be a big surprise to embedded users how much the LPC1100, a 32-bit microcontroller, outperforms in efficiency compared to 8- and 16-bit microcontrollers. If performance and energy consumption are important criteria for selecting a microcontroller, based on the results generated from EEMBC's CoreMark benchmark, embedded designers should check out the LPC1100 (especially with its $0.65 price tag) before committing to any 8- or 16-bit options with comparable features and pricing. The scores for the LPC1100 are already posted on CoreMark.org,” said Markus Levy, EEMBC President.

Features of the NXP LPC1100 family of microcontrollers include:
· 50 MHz Cortex-M0 processor with SWD/debug (4 break-points)
· 32 Vectored Interrupts; 4 priority levels; Dedicated Interrupts on up to 13 GPIOs
· UART, 1 or 2 SPI, I2C (FM+); 2 16-bit and 2 32-bit timers with PWM/Match/Capture
· 12MHz Internal RC Oscillator with 1% accuracy over temperature and voltage
· Power-On-Reset (POR); Multi-level Brown-Out-Detect (BOD); 10-50 MHz Phase-Locked Loop (PLL)
· 8-channel high precision 10-bit ADC with ±1LSB DNL
· Up to 28 or 42 fast 5V tolerant GPIO pins for HVQFN33 and LQFP48 respectively, high drive (20 mA) on select pins
· Single 1.8 – 3.6V power supply; over 5kV ESD for rugged applications

Future product features will include: Ultra Low Power options, CAN, 12-bit ADC and DAC, temperature sensor, high resolution timer features, and advanced sensor interface.

The LPC1100 family is supported by development tools from IAR, Keil, Hitex, Code Red, and many others. NXP will also offer an easy to use, comprehensive development tool platform for under US$30.
Recommended distribution unit pricing in 10,000 piece quantities for the 33-pin package is: LPC1111FHN33/101 at US$0.65, LPC1112FHN33/101 at $0.75, LPC1113FHN33/201 at $0.85, and LPC1114FHN33/201 at $0.95, with Flash sizes of 8K, 16K, 24K and 32K respectively. In addition, 48-pin LPQFP and PLCC44 packages will be available for socketed applications.

Bada emerges as OS for handhelds

Samsung is set to launch its Bada operatings system as a challenge to Android. Details and prospects at the Portable Multimedia blog.