Thursday, October 22, 2015
Coming hard on the heels of Dialog's acquisition of Atmel and Western Digital acquiring SanDisk, Microsemi wants to acquire PMC-Sierra in a $2.4bn deal that highlights the accelerating consolidation in the embedded industry.
This consolidation is somewhat hidden by the tech bubble involving software and apps, but highlights the change in the semiconductor cycle into a downturn. The industry avoided taking too much of a hit in 2008 as the semiconductor cycle was at its peak, but the current cycle is set to coincide with the bursting of the tech bubble.
This is important as the Microsemi and Sandisk deals are very much geared to the growth in data centres that is driven by the players in the tech bubble. "This Complements optical and switching portfolios, accelerates existing data center growth effort ," said Microsemi. This deal in particular is a sign of the peak of the cycle, as PMC-Sierra was set to acquire Skyworks, and the current deal aims to change that.
This is the same kind of deal that happened at the peak of the property market in the UK, where a buyer comes in with a higher offer, called gazumping.
The PMC deal is valued at $11.50 per PMC share, representing a premium of approximately 50 percent to the closing price on October 5th, 2015, the last trading day prior to the announcement of PMC's proposed acquisition with Skyworks. Microsemi believes its $2.4bn cash and stock proposal would provide PMC shareholders with a substantial premium and immediate cash value, as well as the opportunity to participate in the significant upside potential of a global analogue and mixed-signal leader with a highly diversified platform for growth and profitability.
"Based on extensive discussions with PMC over the past 18 months and comprehensive analysis, we believe this transaction offers compelling strategic and financial benefits for the shareholders of both Microsemi and PMC," said James J. Peterson, Microsemi's chairman and CEO. "This acquisition will provide Microsemi with a leading position in high performance and scalable storage solutions targeted for data center and cloud applications, while also adding a complementary portfolio of high-value communications products.Microsemi has a strong track record of integrating acquisitions and driving profitability, and we will benefit from increased scale, industry-leading margins, diversified market exposure, consolidated infrastructure and substantial cost savings in a combination with PMC."
The transaction with Microsemi will only be subject to domestic regulatory approvals (as opposed to approvals by foreign government entities including China, which is required under the Skyworks merger agreement and likely to result in additional uncertainty and delays) and customary closing conditions, as well as the approval of PMC's shareholders.
This comes as Qualcomm absorbs Cambridge Silicon Radio (CSR) after last years acquisition, Dialog bids to acquire Atmel for $4.6bn and Western Digital looks to take over SanDisk. The $19bn SanDisk deal allows WD to use the silicon and embedded software for solid state disk drives, particularly for the data centre. This comes hot on the heels of the $67bn acquisition of enterprise drive supplier EMC by Dell.
AMD is making another move into the embedded market with its latest Merlin Falcon system on chip. This time the company has integrated the south bridge into the chip to include all the I/O support and reduce the footprint in embedded designs.
The company has also paid attention to security, adding an ARM Cortex A50 processor with ARM's TrustZone technology to provide the start of a secure chain for connecting to the Internet. It is also qualifying parts for the higher temperature range needed for embedded and industrial applications.
The Embedded R-Series SOC processors include third generation Radeon graphics processor units (GPUs), aiming at small form factor boards for graphic-intensive and video applications, particularly in commercial gaming systems and medial applications. The GPUs allow a hardware-enabled H.265 (HEVC) decoder and DirectX 12 to be used for 4K video.
The family uses newest AMD 64-bit x86 CPU core, called Excavator, along with a new approach to power management for reduced energy consumption. This allows the processor to 'move' functions between the GPUs and the processor to keep the device within a specified power envelope. This envelope is between 12W and 35W in 1W steps to keep the cost of thermal management to a minimum.
The ARM core supports a secure boot with AMD Hardware Validated Boot (HVB) and initiates trusted boot environment before starting the x86 cores.
The device is also designed for the industry's unified memory architecture that shares the memory between the CPU and GPUs, making application development (and the power management) easier. The devices have the first Heterogeneous Systems Architecture (HSA) 1.0 certification, and support for the latest dual channel ECC DDR4-2400 memory as well as existing DDR3-2133 designs so that sysems can be easily upgraded for higher performance in the future.
The R-Series SOCs offer 22 percent improved GPU performance over the second generation AMD Embedded R-Series APU and AMD claims to have a 58 percent advantage against the Intel's Broadwell Core i7 when running graphics-intensive benchmarks.
Thursday, September 17, 2015
One of the biggest challenges with developing software for embedded systems is deadlocks, where processors hang or stall as a result of complex interactions of the data. While this is traditionally tackled at the board level with a probe and logic analyser, it's a nightmare when the system is all inside a chip.
So when Cambridge-based tool developerUltraSoC adds deadlock detection capabilities into its embedded system-on-chip (SoC) analysis, profiling and debug, it's a big thing. The new analysis features allow embedded SoC architects, developers and debug engineers to detect and diagnose those hard-to-find corner cases which can cause complex SoCs to hang or stall intermittently and unpredictably, sometimes after days of continuous normal operation.
“Our customers tell us that intermittent deadlock and stall conditions are amongst the hardest problems to solve in their SoC designs,” said Gadge Panesar, chief technology officer of UltraSoC. “These conditions are a major contributor to the current crisis in the SoC industry. Conventional approaches either ignore the problem, or attempt to deal with it by generating massive, unmanageable data sets. UltraSoC takes a smarter approach, focusing on generating meaningful, actionable information; for the first time chip design teams can truly understand the behaviour of today’s complex SoCs.”
Bus deadlocks occur when a processor is waiting for a response from another sub-system via an on-chip bus such as AXI or OCP, but the response never arrives. Traditionally, the only way of isolating such problems has been to attempt to continuously trace and output all bus activity, requiring a high-bandwidth off-chip connection to gather the data, and difficult offline analysis software of huge data-sets. The UltraSoC technology uses a “smart” on-chip bus monitor that is protocol-aware and can be triggered when the time taken for a bus transaction exceeds a programmable limit. When triggered by a deadlocked transaction, the system identifies the complete transaction ID and address, guiding the engineer’s attention to both the master and slave of the problem.
This allows chip designers to efficiently and intelligently “look inside” their products, at wire speed, during normal operation, rather than having to pull out a trace of all the activity and go over millions of data points. The new deadlock detection capabilities are targeted at particularly difficult conditions that can cause devices to fail intermittently and unpredictably, including bus and software deadlocks.
Software deadlocks are increasingly common in today’s SoCs. In a typical scenario, two different software processes might use a locking mechanism to govern shared access to common on-chip resources: for example another core, hardware peripherals or the capabilities of another software process. Problems can arise when each CPU believes that the other has locked its access to the shared resources. In this case UltraSoC provides an on-chip status monitor which can be used to detect the fault condition, halt the processors and initiate data capture to isolate the problem. As multi-core systems and heterogenous architectures become more common this becomes ever more important. A key advantage is that UltraSoc is not tieed to any one architecture, supporting many different bus protocols and processor families (including ARM, MIPS, Xtensa, CEVA and others), making it possible to solve these situations.
SoC debug and silicon validation are key challenges facing the global electronics industry today. UltraSoC’s technology creates an on-chip debug infrastructure that enables pre- and post-silicon debug, reducing the risks in chip design, improving time-to-market, increasing quality and reducing costs.
Wednesday, August 19, 2015
By Nick Flaherty www.flaherty.co.uk
The three “Your IoT” design contest winners include Christian Klemetsson, Hoang Nhu and Ekawahyu Susilo.
• Christian Klemetsson designed his “DeviceRadio” industrial automation solution to connect the real world to applications through virtual wires specifically within the industrial automation market. The goal of this product design is to deliver a custom IoT device on a solderless breadboard and controlled through the Internet in three minutes or less.
• Hoang Nhu developed a platform for extending the IoT through all parts of the home, from medication reminders to smart power plugs. The Apple HomeKit SmartHome and Wellness IoT Development Platform monitors home environments/energy consumption and daily activities to optimize home appliance settings as well as make recommendations and reminders for optimal wellness.
• Ekawahyu Susilo rounded out the winners with “Snappy,” (below) - a modular robotics platform designed to help teachers engage students through science, technology, engineering and math (STEM) education. Snappy can be used for a variety of science project applications such as determining altitude with water bottle rockets, measuring collision impact in physics experiments, and building a simple local/Internet-connected weather station with humidity and temperature sensors.
The competition was backed by distributor Digi-Key and chip designer Silicon Labs. Digi-Key supplied $10,000 worth of Silicon Labs components to each winner, who will select the Silicon Labs components they need (microcontrollers, wireless chips, sensors, boards and more) to bring their prize-winning IoT ideas to market as commercially viable products.
“The IoT is the engine driving the growth and future of electronic component usage,” said David Sandys, director of technical marketing for Digi-Key. “Digi-Key could not be happier with the level of participation in the contest and being able to partner with Silicon Labs. The excitement really begins now, when we get to see where the winners will take their designs.”
“Developing connected ‘things’ for the IoT requires a combination of technical prowess, innovative design, and energy-friendly components and application development resources,” said Peter Vancorenland, vice president of IoT engineering at Silicon Labs. “We applaud the three contest winners for their outstanding IoT designs and wish them great success in bringing their inventive ideas to market using semiconductor and software solutions from Silicon Labs and Digi-Key.”
See the winners here
Thursday, January 08, 2015
"This year has seen the software at the very highest point in the Internet of Things stack -- analytics -- becoming tightly coupled with the embedded devices at the edge of the network, leading to many different approaches and providers. Being able to monitor and use the data that comes from the Internet of Things is a huge potential challenge with different providers using different architectures and approaches, and different chip and equipment vendors teaming up in a range of different ways."
Slideshow on EETimes by Nick Flaherty www.flaherty.co.uk
Tuesday, December 02, 2014
Blimey! Cypress and Spansion are to merge in a $4bn deal that will change the landscape of the embedded market and potentially mark more consolidation. The key area for this deal is of course memory - Spansion was the spin off of AMD's flash memory business, while Cypress started out making SRAMs and has since moved into other controller-based devices.
As a result the combined company will have annual turnover of $2bn and be the leader in SRAM and in NOR flash, and be a major player in microcontrollers - Cypress is well established in ARM-based microcontroller designs alongside its PSoC capacitative touch screen controller, while Spansion has recently been adding ARM cores to its memory devices.
Although the deal is pitched as 50/50 - which is itself often a problem for deciding the direction going forward - it actually looks like a Cypress takeover. Cypress founder and long term CEO TJ Rodgers will be CEO of the merged company while Ray Bingham of Spansion will be non-executive chairman and the company will be called - wait for it - Cypress Semiconductor.
“This merger represents the combination of two smart, profitable, passionately entrepreneurial companies that are No. 1 in their respective memory markets and have successfully diversified into embedded processing,” said Rodgers, Cypress’s founding president and CEO. “Our combined company will be a leading provider of embedded MCUs and specialized memories. We will also have extraordinary opportunities for EPS accretion due to the synergy in virtually every area of our enterprises.”
The merger is expected to achieve more than $135 million in cost synergies on an annualized basis within three years and to be accretive to non-GAAP earnings within the first full year after the transaction closes. The combined company will continue to pay $0.11 per share in quarterly dividends to shareholders.
“Bringing together these high-performing organizations creates operating efficiencies and economies of scale, and will deliver maximum value for our shareholders, new opportunities for employees and an improved experience for our customers,” said John Kispert, CEO of Spansion. “With unparalleled expertise, global reach in markets like Japan and market-leading products for automotive, IoT, industrial and communications markets, the new company is well positioned to deliver best-of-breed solutions and execute on our long-term vision of adding value through embedded system-on-chip solutions.”
The closing of the transaction is subject to customary conditions, including approval by Cypress and Spansion stockholders and review by regulators in the U.S., Germany and China. The transaction has been unanimously approved by the boards of directors of both companies. Cypress and Spansion expect the deal to close in the first half of 2015.
What other consolidation will happen remains to be seen but memory companies particularly will be vulnerable - the most notable recent deal was Global Foundries being paid to take on IBM's semiconductor business. I expect to see some other 'mergers' based around the Internet of Things as companies position themselves for growth i the next few years.
Wednesday, October 29, 2014
By Nick Flaherty www.flaherty.co.uk
Glasgow-based USB chip designer FTDI is facing a storm of criticism after a new driver was released for its FT232R USB-to-UART bridge chip, but the problem was not with FTDI's chip.
Instead it was with counterfeit devices that people had bought over the Internet thinking they were genuine FTDI parts. The driver did not work with fake chips, effectively "bricking" people's USB interfaces, and highlighting the problem that many embedded chip maker face with counterfeit parts.
FTDI has responded well. "We have temporarily suspended the driver from being downloaded. We will investigate what is happening in the current driver and, in the fullness of time, reinstate the driver download, and if there's something we need to alter in the driver, we will do that," said Gordon Lunn, global customer engineer support manager at FTDI.
He points out that mainstream customers haven't had a problem and that this becomes an opportunity to remove fake devices from the supply chain and replace them with genuine parts. "We want to take the positives from this and work with people that want to buy genuine parts, and we are sorry if we have inconvenienced people who thought they were buying genuine parts, and we'd like to work with people to stop it at the source," he said. "We take each case on an individual basis. If a customer is willing to work with us and help us track down the source, then perhaps we would enter negotiations on a goodwill basis. I can't rule out working with individuals. It has to be considered."
- Watch That Windows Update: FTDI Drivers Are Killing Fake Chips
- FTDI admits to bricking innocent users' chips in silent update
- Counterfeit Goods: What You Can Do to Protect Your Brand
- FTDI yanks chip-bricking driver from Windows Update, vows to fight on
- FTDI drivers brick counterfeit chips with latest Windows Update
- EEVblog #676 - RANT: FTDI Bricking Counterfeit Chips!
- FTDI's anti-counterfeiting efforts sit between a rock and a hard place
- Windows Update driver bricks counterfeit FTDI USB-to-serial chips
Friday, May 23, 2014
|English: Comparison of an Overo COM and a coin (Photo credit: Wikipedia)|
a range of operating systems, starting with a Microchip-based chipKIT WiFire board from Digilent.
utilize in the development process. The chipKIT WiFire is only available through Digilent and builds on the previous chipKIT development boards with a significant processor performance increase over the previous generation.
PIC32MZ and MPLAB Harmony software framework were designed for high-end, next-generation embedded applications that require high levels of performance, memory and advanced-peripheral integration. The addition of FlowCloud provides even more value for IoT and cloud applications.”
Thursday, May 01, 2014
By Nick Flaherty www.flaherty.co.uk
Wednesday, April 30, 2014
Heartbleed challenges the Internet of Things
By Nick Flaherty www.flaherty.co.uk
Wednesday, April 09, 2014
"The benefit for our users is greater feature velocity from open source," said Daniel Owens, product manager for software development tools at ARM. "The ARM v8 backend is in open source today as it goes into open source first, then we pull it back in for integration and testing in DS-5. V8 will be supported out of the gate and then V7A and R and that will happen by the end of this year and then following on is V7M and that's probably 2015 so Keil will stay with V7 through that time, he said.
More on this story at ARM moves to LLVM open source for future compilers - Electronics Eetimes
By Nick Flaherty www.flaherty.co.uk