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Monday, October 15, 2018

Power news this week

From eeNews Europe by Nick Flaherty

. Dialog cashes in on Apple relationship

. CellCube spins out its vanadium mines

. Ceres to build £7m solid oxide fuel cell plant


. Printable thermoelectric energy capture for IoT systems

. Stability boost for high efficiency perovskite solar cells

. Silicon solar cell breakthrough tops efficiency limit

. Cabot teams with SAFT on low-cobalt cathodes for lithium-ion batteries


. Battery management system supports ASIL-C safety spec

. GaN thin film transistors for flexible substrates

. National Instruments: Key considerations for powertrain HIL test

. UnitedSiC: Practical considerations when comparing SiC and GaN in power applications

Samsung first to 5G commercial call

By Nick Flaherty

SK Telecom has this week made the first commercial 5G call, a key milestone for the industry, using equipment from Samsung Electronics.

The jointly-developed 3GPP 5G Non-standalone (NSA) new radio (NR) standard and commercial 5G NR equipment was part of the SKT's 5G testbed located in its Bundang office building.

The first 5G NSA-NR calls used a 100MHz bandwidth in the 3.5GHz band on the 5G NR radio, along with 4G LTE radio and NSA core.

In NSA-NR architecture, 5G is supported by the infrastructure of legacy 4G LTE where mobile devices are connected to both 4G and 5G for data traffic, while using the 4G network for non-data traffic such as exchanging signals for mobility controls. This approach has been considered as one of the promising 5G architectures for the initial 5G deployments

Saturday, October 13, 2018

NXP pushes security in move from M3 to M33 microcontroller cores

By Nick Flaherty

NXP Semiconductors is pushing the embedded security requirements of IoT edge devices and cloud to edge connections with two new multi-core microcontrollers based around the Arm Cortex M33 core.

NXP is emphasising its multi-layered, hardware-enabled protection scheme that protects embedded systems with secure boot for hardware-based immutable root-of-trust, certificate-based secure debug authentication and encrypted on-chip firmware storage with real-time, latency-free decryption.

These are used alongside Arm TrustZone for Armv8-M and Memory Protection Unit (MPU) to ensure physical and runtime protection with hardware-based, memory mapped isolation for privilege-based access to resources and data. 
“The promise of the connected world through the Internet-of-Things is extraordinary,” said Geoff Lees, senior vice president and general manager of microcontrollers at NXP. “Through NXP’s in-depth security and processing expertise, software ecosystem and breadth of portfolio, we are uniquely positioned to bring innovative and accessible advancements in IoT security to all developers.”

The key to this is a ROM-based secure boot process that uses device-unique keys to create an immutable hardware ‘root-of-trust’. The keys can now be locally generated on-demand by an SRAM-based Physically Unclonable Function (PUF) that uses natural variations intrinsic to the SRAM bitcells. This permits closed loop transactions between the end-user and the original equipment manufacturer (OEM), thus allowing the elimination of third-party key handling in potentially insecure environments. Optionally, keys can be injected through a traditional fuse-based methodology.

NXP is also working with Dover Microsystems to introduce Dover’s CoreGuard technology in future platforms. This is a hardware-based active defense security IP that instantly blocks instructions that violate pre-established security rules, enabling embedded processors to defend themselves against software vulnerabilities and network-based attacks.

The security environment improves the symmetric and asymmetric cryptography for edge-to-edge, and cloud-to-edge communication by generating device-unique secret keys through innovative usage of the SRAM PUF. The security for public key infrastructure (PKI) or asymmetric encryption is enhanced through the Device Identity Composition Engine (DICE) security standard as defined by the Trusted Computing Group (TCG). SRAM PUF ensures confidentiality of the Unique Device Secret (UDS) as required by DICE. The newly announced solutions support acceleration for asymmetric cryptography (RSA 1024 to 4096-bit lengths, ECC), plus up to 256-bit symmetric encryption and hashing (AES-256 and SHA2-256) with mbedTLS optimized library.

“Maintaining the explosive growth of connected devices requires increased user trust in those devices,” said John Ronco, vice president and general manager, Embedded & Automotive Line of Business, Arm. “NXP’s commitment to securing connected devices is evident in its new Cortex-M33 based products built on the proven secure foundation of TrustZone technology, while incorporating design principles from Arm’s Platform Security Architecture (PSA) and pushing the boundaries of Cortex-M performance efficiency.”

NXP strategically chose the Cortex-M33 core for its first full-feature implementation of the Armv8-M architecture to provide security platform benefits and substantial performance improvements compared to existing Cortex-M3/M0 MCUs (over 15 to 65 percent improvement, respectively). One of the key features of the Cortex-M33 is the dedicated co-processor interface that extends the processing capability of the CPU by allowing efficient integration of tightly-coupled co-processors while maintaining full ecosystem and toolchain compatibility. 

NXP has used this capability to implement a co-processor for accelerating key ML and DSP functions, such as, convolution, correlation, matrix operations, transfer functions, and filtering; enhancing performance by as much as 10x compared to executing on Cortex-M33. The co-processor further leverages the popular CMSIS-DSP library calls (API) to simplify customer code portability.

The LPC5500 devices provide single and dual core Cortex-M33 in a 40nm process with integrated DC-DC that delivers industry-leading performance at a fraction of power budget, up to 90 CoreMarks/mA. The high density of on-chip memory, up to 640KB flash and 320KB SRAM, enables efficient execution of complex edge applications. Further, NXP’s autonomous, programmable logic unit for offloading and execution of user-defined tasks delivers enhanced real-time parallelism. 

The i.MX RT600 crossover Platform is aimed at real time machine learning and artificial intelligence by adding a 600MHz Cadence Tensilica HiFi 4 DSP and shared on-chip SRAM of up to 4.5MB to a 300MHz M33 with a wide operating voltage. The ML performance is further enhanced in the DSP with 4x 32-bit MACs, vector FPU, 256-bit wide access bus, and DSP extensions for special Activation Functions (e.g., Sigmoid transfer function). 

Related stories:

Thursday, October 11, 2018

5G Toolbox for MATLAB

By Nick Flaherty

MathWorks has launched a toolbox for its Matlab tool that standards compliant waveforms and reference examples for modeling, simulation, and verification of the physical layer of 3GPP 5G New Radio (NR) communications systems. 

This will allow engineers using 5G Toolbox can quickly design critical algorithms and predict end-to-end link performance of systems that conform to the 5G Release 15 standard specification, starting the move to commercial system rollout in 2019. They can now use the toolbox for link-level simulation, golden reference verification, conformance testing, and test waveform generation – without starting from scratch.

The 5G Toolbox joins other toolboxes for LTE and WLAN standards, simulation of massive MIMO antenna arrays and RF front end technologies, over-the-air testing, and rapid prototyping of radio hardware.

“When adopting 5G, wireless engineers need to verify that their product designs can conform or co-exist with a new, complex standard that will continue to evolve. Very few companies have adequate resources or in-house expertise to understand and implement a 5G-compliant design,” said Ken Karnofsky, senior strategist for signal processing applications, MathWorks. “Having seen how LTE Toolbox has helped teams quickly deploy pre-5G designs in radio test beds, we anticipate 5G Toolbox will have a similar impact for the mainstream wireless market.”

5G Toolbox is the foundation of a design workflow that helps wireless teams rapidly develop, prototype, and test designs. Companies with siloed tools for RF, antenna, and baseband design; limited experience with MIMO technologies; or that lack automation from simulation to prototyping can now rely on MATLAB as a common environment for simulation, over-the-air-testing, and rapid prototyping.

MATLAB has also been used for 5G standards development by serving as a common research & development environment for multiple companies involved in the 3GPP working groups.

There's also a Q&A with Convida Wireless, a joint venture between Sony Corporation of America and InterDigital that focuses on research into the future of wireless connectivity technology at
Related stories:

Tuesday, October 09, 2018

Sprayable, transparent antennas for the IoT

By Nick Flaherty

Researchers at Drexel University’s College of Engineering have developed a technique for spraying invisibly thin antennas, made from a type of two-dimensional, metallic material called MXene, that perform as well as those being used in mobile devices, wireless routers and portable transducers.

“This is a very exciting finding because there is a lot of potential for this type of technology,” said Kapil Dandekar, PhD, a professor of Electrical and Computer Engineering in the College of Engineering, who directs the Drexel Wireless Systems Lab, and was a co-author of the research. “The ability to spray an antenna on a flexible substrate or make it optically transparent means that we could have a lot of new places to set up networks — there are new applications and new ways of collecting data that we can’t even imagine at the moment.”

Spray-applied MXene antennas could open the door for new applications in smart technology, wearables and IoT devices.

MXene titanium carbide can be dissolved in water to create an ink or paint and the high conductivity allows the printed structures to transmit and direct radio waves.

“We found that even transparent antennas with thicknesses of tens of nanometers were able to communicate efficiently,” said Asia Sarycheva, a doctoral candidate in the A.J. Drexel Nanomaterials Institute and Materials Science and Engineering Department. “By increasing the thickness up to 8 microns, the performance of MXene antenna achieved 98 percent of its predicted maximum value.”

“This technology could enable the truly seamless integration of antennas with everyday objects which will be critical for the emerging Internet of Things,” said Dandekar. “Researchers have done a lot of work with non-traditional materials trying to figure out where manufacturing technology meets system needs, but this technology could make it a lot easier to answer some of the difficult questions we’ve been working on for years.”

Initial testing of the sprayed antennas suggest that they can perform with the same range of quality as current antennas, which are made from familiar metals, like gold, silver, copper and aluminum, but are much thicker than MXene antennas. Making antennas smaller and lighter has long been a goal of materials scientists and electrical engineers, so this discovery is a major step in reducing their footprint as well as broadening their application.

“Current fabrication methods of metals cannot make antennas thin enough and applicable to any surface, in spite of decades of research and development to improve the performance of metal antennas,” said Yury Gogotsi, professor of Materials Science and Engineering in the College of Engineering, and Director of the A.J. Drexel Nanomaterials Institute, who initiated and led the project. “We were looking for two-dimensional nanomaterials, which have sheet thickness about hundred thousand times thinner than a human hair; just a few atoms across, and can self-assemble into conductive films upon deposition on any surface. Therefore, we selected MXene, which is a two-dimensional titanium carbide material, that is stronger than metals and is metallically conductive, as a candidate for ultra-thin antennas.”

Drexel researchers discovered the family of MXene materials in 2011 and have been gaining an understanding of their properties, and considering their possible applications, ever since. The layered two-dimensional material, which is made by wet chemical processing, has already shown potential in energy storage devices, electromagnetic shielding, water filtration, chemical sensing, structural reinforcement and gas separation.

“The MXene antenna not only outperformed the macro and micro world of metal antennas, we went beyond the performance of available nanomaterial antennas, while keeping the antenna thickness very low,” said Babak Anasori, a research assistant professor in A.J. Drexel Nanomaterials Institute. “The thinnest antenna was as thin as 62nm — about thousand times thinner than a sheep of paper — and it was almost transparent. Unlike other nanomaterials fabrication methods, that requires additives, called binders, and extra steps of heating to sinter the nanoparticles together, we made antennas in a single step by airbrush spraying our water-based MXene ink.”

The group initially tested the spray-on application of the antenna ink on a rough substrate — cellulose paper — and a smooth one — polyethylene terephthalate sheets — the next step for their work will be looking at the best ways to apply it to a wide variety of surfaces from glass to yarn and skin.

“Further research on using materials from the MXene family in wireless communication may enable fully transparent electronics and greatly improved wearable devices that will support the active lifestyles we are living,” said Anasori.

Rugged AI system for hostile environments

By Nick Flaherty

General Micro Systems (GMS) has launched a rugged, conduction-cooled, commercial off-the-shelf (COTS) deep learning/artificial intelligence (AI) mobile system that offers real-time data analysis and decision in hostile environments.

The X422 “Lighting” integrates two Nvidia V100 Tesla data centre accelerators into a fully sealed, conduction-cooled chassis. It is designed as a dual co-processor companion to GMS Intel Xeon rugged air-cooled or conduction-cooled servers

GMC claims this is an industry first for deep learning and artificial intelligence, as the X422 includes no fans or moving parts, promising wide temperature operation and massive data movement via an external PCI Express fabric in ground vehicles, tactical command posts, UAV/UAS, or other remote locations. It uses the company’s patented RuggedCool thermal technology to adapt the GPGPUs for harsh conditions, extending the temperature operation while increasing environmental MTBF.

“No one besides GMS has done this before because we own the technology that makes it possible. The X422 not only keeps the V100s or other 250 W GPGPU cards cool on the battlefield, but our unique x16 PCIe Gen 3 FlexVPX fabric streams real-time data between the X422 and host processor/server at an astounding 32 GB/s all day long,” said Ben Sharfi, chief architect and CEO, General Micro Systems. “From sensor to deep learning co-processor to host: X422 accelerates the fastest and most complete data analysis and decision making possible.”

The X422, which is approximately 12x12 inches square and under 3 inches high, includes dual x16 PCIe Gen 3 slots for the GMS-ruggedized PCIe deep learning cards. Each card has 5120 CUDA processing cores, giving X422 over 10,200 GPGPU cores and in excess of 225 TFLOPS for deep learning. In addition to using Nvidia GPGPU co-processors, the X422 can accommodate other co-processors, different deep learning cards, and high-performance computers (HPC) based upon FPGAs from Xilinx or Altera, or ASICs up to a total of 250 W per slot (500 W total).
Another industry first brings I/O to X422 via GMS’s FlexVPX bus extension fabric. X422 interfaces with servers and modules from GMS and from One Stop Systems, using industry-standard iPass+ HD connectors offering x16 lanes in and x16 lanes out of PCI Express Gen 3 (8 GT/s) fabric for a total of 256 GT/s (about 32 GB/s) system throughput. X422 deep learning co-processor systems can be daisy-chained up to a theoretical limit of 16 chassis working together.

Unique to X422 are the pair of X422’s two PCIe deep learning cards that can operate independently or work together as a high-performance computer (HPC) using the user-programmable onboard, non-blocking low-latency PCIe switch fabric. For PCIe cards with outputs—such as the Titan V’s DisplayPorts—these are routed to separate A and B front panel connectors.

Monday, October 08, 2018

Power news this week

By Nick Flaherty

. TDK breaks ground on £1m UK EMC centre

. Reducing the power consumption of neuromorphic AI systems

. Solid state polymer readies for the big time

. Ilika ships first samples of millimetre solid state battery for medical designs

. Zinc air battery maker to start mass production.

. Self-powered acoustic sensor boosts AI recognition

. Flexible batteries open up wearable designs

. Solar cell combined with redox cell creates solar flow battery


. Ultra-slim resistive heaters in standard or custom configurations

. GE launches next generation onshore wind turbine

. Power meter for lasers handles 125,000 samples per second


. National Instruments: Key considerations for powertrain HIL test

. Coilcraft: An introduction to inductor specifications

Top ten trends for tech in 2019

By Nick Flaherty

Trendforce has identified ten key theme for tech in the coming year, from 3D memory chips and the 5G rollout to smart grids and smart speakers.


The memory industry will show acceleration and evolution, driven by next-generation products and advanced die-stacking technology. Manufacturers have applied through-silicon via (TSV) techniques for chip stacking, and launched High Bandwidth Memory (HBM) in order to increase the throughput within a single package, overcoming the limits of bandwidth. 

In addition to saving space in the package, next-generation products are also intended to meet the demand from edge computing applications, which require shorter reaction time and different structures. Compared with existing DRAM products, next-generation solutions may fit into different architectures, for example, in the embedded systems, memory products are closer to CPU. The solutions may also offer significant performance improvements, such as power saving resulted from the non-volatility of memory.

Commercial 5G rollout
Deployment of optical communication infrastructure, the foundation of 5G network, has been ongoing in the past years. The 5G architecture has been gradually expanded from backbone network to metropolitan area network and access network, providing 5G-compatible bandwidth at a low cost. Commercialization of 5G is expected to roll out in 2019, with 5G telecom services to be launched in United States, South Korea, Japan, and China. Smartphones and other devices supporting 5G technology are also expected to be available some time in 2019. 

The major advances in 5G mobile wireless solutions will support higher bandwidth and faster connection, enriching the telecom ecosystems. The arrival of 5G may also generate demand for a wider range of technology-based services, including high resolution (4K/8K) of video, mobile AR/VR gaming and immersive multimedia applications, industrial automation, telesurgery robots, massive Internet of Things, and automated control of vehicles, etc.
Foldable and 5G smartphones 

The global smartphone market expects specs upgrades in the coming year, with more models featuring all-screen design, narrower borders, a smaller notch, and subsequent smaller front-facing camera modules to fit the smaller notch. Moreover, the smartphone market will expect increasing penetration of biometric recognition, with triple cameras emerging. The advanced solutions for flexible AMOLED may allow brands to launch single-screen foldable smartphones next year, while 5G smartphones are also expected to be launched in 2019. Brands are now planning for the 5G-fueled market, expecting commercial 5G to open up more opportunities and growth momentum. Offerings combining 5G and foldable screen may also see great potential and would make a splash in the smartphone market.

Under-display fingerprint sensors

With increasing demand from smartphone vendors, design houses have invested heavily to increase the yield rates of fingerprint sensors and seek more cost-effective solutions. Optical under-display fingerprint sensors are normally found in flagship smartphones currently, but are expected to be embedded in mid and high-end Android models in the coming year. Ultrasonic in-display fingerprint sensors also have a chance to be adopted by Android phone vendors. 

TrendForce estimates that ultrasonic and optical under-display fingerprint sensors will account for 13% of all fingerprint sensor technologies in 2019, significantly up from 3% in 2018. Particularly, some design houses also consider moving the fingerprint sensors to the very edge of the screen, trying to break through the bottlenecks of technology and yield rates. The edge solutions may change the landscape of industry if they manage to hit the market in the next few years. However, the target market and acceptance of products remain to be seen.

MiniLEDs for consumer displays 

With advantages in brightness and contrast, Mini LED has a chance to compete with OLED in segments of cinema display and home theater display. Compared with self-emitting RGB LED digital display (video wall), Mini LED-based backlight units use blue LED as the basic light source, making it more cost-effective, so Mini LED has higher potential to make its way into the blue ocean of displays of consumer electronics, including smartphone, tablets, desktops, TVs, and automotive displays. The next two years (2019-2020) will likely see acceleration in the development of Mini LED, which may record a market value of US$1699 million in 2022.

Smart speakers

Smart speakers remain in the spotlight of the market in 2018, drawing attention to applications enabling voice interaction, such as vehicles, smart TVs, and smart headsets. Looking forward to 2019, increasing number of applications will enable voice interaction, including virtual assistant, voice recognition, voice shopping, etc. Companies will continue to develop new voice-activated applications to explore the market potential.

eSIMs for smartwatches

Driven by major companies like Apple, Huawei, and Qualcomm, eSIM has been introduced into the market, making smart devices more independent from smartphones and driving the growth of smartwatches at a pace faster than smart bracelets. The eSIM has been already embedded in smartwatches and always connected PCs to allow Internet connection, and more applications will adopt eSIM in 2019 to enable functions like streaming music, making calls, sending messages, and virtual assistant, etc.

More competition in the IoT

This year has witnessed a rapid growth of the Internet of Things (IoT) solutions, with the commercial use of low power wide area networks (LPWAN) becoming popular worldwide. Edge computing and AI have been integrated to IoT architectures, enabling transformation in vertical industries. With technology movements and global deployments in the following years, IoT is expected to come strong in operation of enterprises, making 2019 a key year for them to evaluate the outcome of adopting IoT in their businesses. Meanwhile, however, the competition is also intensified, thus enterprises are poised to consider whether investments in IoT operation are cost effective enough to enhance their profitability in the longer run.

New healthcare tech

Following the 21st Century Cures Act, the U.S. Food and Drug Administration (FDA) announces new regulations on next-generation sequencing (NGS) and digital medicine this year. The new technologies may change the landscape of biotechnology industry and attach increasing importance to software in the healthcare industry. Particularly, digital therapeutics has evolved, integrating ICT, software and drugs in treatment. Moreover, surgical robots and surgical navigation systems (SNS) are expected to integrate various medical imaging technologies including hybrid imaging, molecular imaging, AR and MR to optimize minimally invasive surgery. In terms of gene sequencing, NGS has been adopted in clinical application. FDA has been building genetic databases ClinVar and ClinGen, as well as PrecisionFDA that verifies the algorithms of sequencing. Gene sequencing data analysis and gene variants application will become the focus of the future NGS clinical market. In conjunction with new treatments, NGS will help achieve precision medicine in the future.

Smart grid, energy management and energy storage system to be keys of global photovoltaic market
This year witnessed constant expansion of installed PV supply capacity in China, but the policy updates by the Chinese government have led to oversupply in the market, resulting in global module price declines and cost pressures in the supply chain. Therefore, the global PV industry may expect a changing landscape in the upcoming year. On the other hand, the levelized cost of electricity (LCOE) of PV projects have seen significant decline, and grid-parity has been observed in the global PV market. With the constant decrease in PV feed-in tariff (FiT), smart grid, energy management and energy storage systems will become the key considerations for PV system developers. They will need to achieve effective energy storage to balance loads of power plants and stabilize the overall power quality in connection with grids and power plants.

Wind River shows edge computing for 5G on BT basestation

By Nick Flaherty

Wind River has been working with UK telecoms provider BT on edge cloud computing applications at the basestation rather than the data centre. 

It has developed a proof of concept platform with an edge cloud compute node using the Titanium Cloud virtualization platform running on a BT cellular basestation, with the local traffic offload capability coming from Athonet, a software-based mobile core provider. 

5G applications will require locating compute power and capacity close to where the traffic originates, whereas application logic has traditionally resided in the data centre. However, 5G applications such as those for autonomous driving or Industrial IoT, where physical controls require extremely low latency, will demand diverse network locations for their logic. In these cases, computing will often need to happen much closer to the end device.

“5G will demand ultra-low latency and dynamic compute architectures for the cloud,” said Charlie Ashton, senior director of business development for Telecommunications at Wind River. “Wind River provides a flexible and secure cloud-based infrastructure that can be deployed at any network location. In order to successfully meet changing market needs, it is important to work with leading operators who, like BT, are uniquely positioned to deploy cloud compute at the right edge locations to support growing 5G applications.”

“The rise of Edge Cloud Compute will require flexible cloud infrastructure and the deployment of dynamic applications wherever and whenever they are needed. BT’s network is evolving to meet these demands,” said Maria Cuevas, head of mobile core networks research at BT. “BT is working with industry partners like Wind River to tackle the technical challenges around Edge Cloud Compute and develop solutions that meet customers’ future needs.”

The proof of concept highlights multiple 5G edge cloud computing use cases, including those for next-generation connected automobiles and also for augmented/virtual reality:
• Remote vehicle control for traffic/route management
• Vehicle-to-vehicle and vehicle-to-infrastructure communication for collision avoidance
• Augmented reality for multi-person sessions without gameplay disruption

Friday, October 05, 2018

Alliance dumbs down Wi-Fi names

By Nick Flaherty

The WiFi Alliance is changing the way WiFi is labelled to make it less confusing for consumers and it says to enable users to easily differentiate between technologies.

While the move to Wi-Fi 6 as the name for 802.11ax will help the upgrade cycle, it risks minimising the impact of other technologies that embedded engineers rely on.

This is vitally important, as the Alliance points out that Wi-Fi carries more than half of the internet’s traffic in an ever-expanding variety of applications that billions of people rely on every day.

The generational terminology may also be used to designate previous Wi-Fi generations, such as 802.11n or 802.11ac, but doesn't necessarily take into account variations on the standard such as 11ad and the emerging 802.11ay for example, With 5G cellular moving to protocols that operate across a wider range of frequencies, Wi-Fi is already doing the same. Wi-Fi that operates in the millimetre band is very different from Wi-Fi 6 at 2.4GHz and 5GHz and potentially different again from Wi-Fi 6 at 7GHz.

The new naming system identifies Wi-Fi generations by a numerical sequence and can be used by product vendors to identify the latest Wi-Fi technology a device supports, by OS vendors to identify the generation of Wi-Fi connection between a device and network, and by service providers to identify the capabilities of a Wi-Fi network to their customers: 

Wi-Fi 6 to identify devices that support 802.11ax technology
Wi-Fi 5 to identify devices that support 802.11ac technology
Wi-Fi 4 to identify devices that support 802.11n technology

“For nearly two decades, Wi-Fi users have had to sort through technical naming conventions to determine if their devices support the latest Wi-Fi,” said Edgar Figueroa, president and CEO of Wi-Fi Alliance. “Wi-Fi Alliance is excited to introduce Wi-Fi 6, and present a new naming scheme to help industry and Wi-Fi users easily understand the Wi-Fi generation supported by their device or connection.”

This is a natural consequence of running out of letters at 802.11az. So almost certainly we will see more brand diversification with Wi-Fi 7 Max or Plus and we are effectively back to the days of Wi-Fi vs W-Gig.

In addition to describing the capabilities of the device, device manufacturers or OS vendors can incorporate the generational terminology in User Interface (UI) visuals to indicate the current type of Wi-Fi connection. The UI visual will adjust as a device moves between Wi-Fi networks so users have real-time awareness of their device connection. Certification programs based on major IEEE 802.11 releases will use a generational Wi-Fi name; Wi-Fi CERTIFIED 6 certification is coming in 2019.

Since 2000, the Alliance has completed more than 40,000 certifications to demonstrate interoperability, backward compatibility and the highest industry-standard security protection.

Naturally there's plenty of industry support for Wi-Fi 6 from consumer-facing organisations.

“Aerohive enthusiastically supports Wi-Fi Alliance’s new consumer-friendly Wi-Fi 6 naming convention in support of the emergence of IEEE’s new 802.11ax technology. Wi-Fi Alliance is now providing consumers the same type of generational Wi-Fi naming conventions to match what cellular technology has done since the beginning. Wi-Fi technology has evolved and improved over the last 21 years – from only a few megabits to several Gigabit speeds – yet this information is currently not provided. With Wi-Fi 6, consumers can easily identify the level of Wi-Fi provided and demand superior services. Additionally, we look forward to Wi-Fi Alliance’s launch of their Wi-Fi CERTIFIED 6 certification program next year, and will submit our latest generation of Aerohive devices for certification at the first opportunity.” said Perry Correll, product management director, Aerohive Networks

“Wi-Fi has evolved significantly since Aruba was founded 16 years ago – from its initial role as a secondary network within the enterprise enabling mobility to the mission-critical role it plays today as the primary connectivity method for billions of devices, users, and things. We applaud this effort by Wi-Fi Alliance to simplify the terminology used to differentiate between the different generations of technologies as it will help users more quickly and easily discern the technology their particular device or network supports,” added Lissa Hollinger, Vice President of Portfolio Marketing for Aruba, a Hewlett Packard Enterprise company

But there's also support from the IP and chip companies. 

“Consumers love Wi-Fi – nearly every Internet connected device has it and over 80% of all wireless traffic goes over it. The sixth generation of Wi-Fi - 802.11ax - is the most advanced ever, bringing faster speeds, greater capacity and coverage, and will make the user experience even more enjoyable. This simple, generational representation will let consumers differentiate phones and wireless routers based on their Wi-Fi capabilities, helping them pick the device that suits their needs best. When they see that their device contains Wi-Fi 6, they will know that they have the best wireless connectivity on the market,” said Vijay Nagarajan, senior director of marketing for Wireless Communications and Connectivity at chip designer Broadcom
“CEVA welcomes the introduction of the clear terminology. We have been licensing MAC and Modem IP for many years and across many generations of the technology spanning 802.11a/b/g/n/ac/ax. The new naming structure gives a simple and consistent framework to boost user awareness, which is especially important now at the dawn of Wi-Fi 6,” said Aviv Malinovitch, GM of the Connectivity BU at IP supplier CEVA.

Similarly Intel and Marvell have supported the move, although both keep referencing 802.11ax alongside Wi-Fi 6, highlighting the need for engineers to keep using the IEEE 802.11 names to be truly informed.

Monday, October 01, 2018

Power news this week

By Nick Flaherty at eeNews Europe Power

. Billion dollar battery plan from the World Bank

. Warning over fake wiring regulations
. iPhone XS teardown shows new battery design

. Volkswagen sees fuel cell breakthrough

. Lithium battery uses carbon dioxide emissions for power

. Dynamic power grid control centre is world first

. Power-over-distance wireless transmitter ships retail and devkit systems

. 15W multi-coil wireless charger is first for extended Qi power

. Integrated 12V breaker simplifies design and certification

TECHNICAL PAPERS . Pickering Electronics: Concise Technical Guide to Reed Relays

Top stories in September on the Embedded blog

By Nick Flaherty

Market stats are always popular, and data on embedded microcontrollers has been particularly of interest this month. The boom in the Internet of Things is driving the use of microcontrollers, as are security issues and the latest mbed open source stack with support for Bluetooth Low Energy. 

The Renesas acquisition of IDT, combined with Intersil, is creating a major player for the embedded infrastructure for data centres, from communications and timing to power management, while a wirelessly-powered LED that can kill cancer cells form inside the body has also captured the imagination this month.