NXP has developed an IoT-on-a-chip device that compbines an ARM-based i.MX applications processor, Wi-Fi and Bluetooth into small footprint with security and connectivity.
IoT-on-a-Chip brings together the pre-integrated features from NXP’s i.MX applications processor family and Wi-Fi/Bluetooth solutions for consumer and industrial developers to quickly build compact IoT products. It uses an Arm Cortex-A7 applications processor with dual-band 802.11ac Wi-Fi and Bluetooth 4.2 as a reference Wi-Fi certified module with proven Wi-Fi/BT software stacks.
The i.MX applications processors provide advanced security implementation for secure boot, tamper detection and response, and high throughput cryptography, and the IoT-on-a-chip can be expanded with its custom inter-chip interface to include a secure element without increasing the package footprint
The 14mm x 14mm x 2.7mm solution includes applications processor and Wi-Fi/BT in a single footprint and the package design allows DDR memory direct connect via pass-through board layout simplifies PCB design and provides additional space savings.
Different levels of i.MX performance in the same 14x14 body size, using the same inter-chip interface. Footprint compatible top-modules provide a range of Wi-Fi/BT options suited to your application.
“Representing a major step in the evolution from on-board offerings to the future vision of IoT-on-a-Chip, our highly integrated solution completely demystifies the Internet of Things,” said Martyn Humphries, vice president of i.MX applications processors for industrial and consumer markets with NXP. “NXP’s forward-looking design approach will provide customers with far greater efficiencies across their systems, allowing them to accelerate their time to market for products – at no additional cost.”
NXP’s first IoT-on-a-Chip product, based on the i.MX 6ULL applications processor, will be available in late 2018. i.MX 7 and i.MX 8 processor configurations will be available in 2019.