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Wednesday, November 13, 2019

PICMG finalises pin out for high performance COM modules

By Nick Flaherty www.flaherty.co.uk

The PICMG COM-HPC technical subcommittee approved the pinout of the new high-performance Computer-on-Module specification. 

The COM-HPC standard is now entering the home stretch for the ratification of version 1.0 of the specification, which is scheduled for the first half of 2020. Computer-on-Module manufacturers and carrier board designers who are active in the COM-HPC workgroup can now embark on first edge computing designs based on this pre-approved data, with the expectation to bring them to market in time with the launch of new high-end embedded processor generations from Intel and AMD next year.
"Within PICMG we are currently working on the next generation Computer-On-Module standard which is of utter importance for the embedded and edge computing world," said PICMG president Jessica Isquith. "Next to the physical footprint, the pinout is the most essential milestone. It could only be pre-approved so quickly because we managed to get all key market players, including semiconductor manufacturers such as Intel, around one table in the COM-HPC technical subcommittee, thereby also making sure that the standard will be the best fit possible for future processor generations.

"A new Computer-on-Module specification is a complex task that involves many stakeholders," said committee chairman Christian Eder, who says he is confident that the specification can be officially ratified before the next high-end embedded processors hit the market: 

"We officially started our work back in October 2018 and are on schedule to release new COM-HPC modules, carrier boards and solution platforms in time with the next high-end embedded processor generations. They will extend the existing PICMG COM Express module standards with new solutions that move in the direction of headless edge server and more multifunctional edge client solutions," he said.

With the adoption of the pinout, all committee members now have a solid working basis from which to offer interfaces supporting up to 100 GbE and PCIe Gen 4.0 and Gen 5.0 as well as up to eight DIMM sockets and high-speed processors with more than 200 watts on standardized COM-HPC modules, and to work on standard-compliant carrier board designs.

Members of the PICMG COM-HPC committee include the University of Bielefeld and Adlink, Advantech, Amphenol, AMI, congatec, Elma Electronic, Emerson Machine Automation Solutions, ept, Fastwel, GE Automation, HEITEC, Intel, Kontron, MEN, MSC Technologies, N.A.T., Samtec, SECO, TE Connectivity, Trenz Electronic and VersaLogic. Adlink, congatec and Kontron are also committee sponsors. e.

More information on the COM-HPC Computer-on-Module standard and its pinout is at www.congatec.com/COM-HPC

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