Portable Multimedia: Just seven smartphone apps drive hardware designs

Portable Multimedia: Just seven smartphone apps drive hardware designs

By Nick Flaherty www.flaherty.co.uk

Wireless Tire Pressure Monitoring Systems in Cars May Pose Security Threat

Researchers spoof wireless monitoring systems 
By Nick Flaherty www.flaherty.co.uk

Reseachers in the US have 'spoofed' cars with wireless tire pressure monitoring systems, giving a false rading on the dashboard and potentally causing cars to stop. The reseachers at Rutgers University in New Jersey and the University of South Carolina also say that the new wireless technologies in cars may compromise a driver’s privacy and pose a security threat.

Modern cars are increasingly equipped with wireless sensors and devices, such as systems that monitor air pressure inside tires and trigger dashboard warnings if the tire pressure drops, which is a vry useful feature. However, the Rutgers researchers have shown that these wireless signals can be intercepted 120 feet away from the car using a simple receiver despite the shielding provided by the metal car body.

Since signals in tire pressure monitoring systems (TPMS) include unique codes from each wheel sensor, this raises concerns that drivers’ locations could be tracked more easily than through other means, such as capturing images of license plates.

TPMS wireless transmissions also lack security protections common in basic computer networking, such as input validation, data encryption or authentication. The researchers demonstrated how a transmitter that mimics, or “spoofs,” the sensor signal can easily send false readings and trigger a car’s dashboard warning display. This could prompt a driver into stopping his or her car when there is actually nothing wrong with the tires.

 “We have not heard of any security compromises to-date, but it’s our mission as privacy and security researchers to identify potential problems before they become widespread and serious,” said Marco Gruteser, associate professor of electrical and computer engineering and a member of the university’s Wireless Information Network Laboratory (WINLAB).

He notes that tire pressure monitoring is the first widespread use of in-car wireless networking, and because of the increasing cost and complexity of wired electronic systems, it’s reasonable to expect other aspects of automobile operation to come under wireless control.

“A spoofed signal could potentially cause serious safety concerns if stability control or anti-lock braking systems relied on the data,” he said. “So we are sounding the alarm right now.”

Gruteser acknowledged that intercepting and spoofing signals is not a casual effort. But the fact that people with college-level engineering expertise could carry out those actions using publicly available radio and computer equipment costing a few thousand dollars shows that systems are vulnerable.

Tire pressure monitoring was widely implemented starting around 2000 using systems that measure and compare wheel rotation speeds. A mismatch infers that a tire is underinflated. This method wasn’t accurate enough to meet U.S. regulatory requirements that took effect later in the decade, so automakers started installing systems that directly monitor air pressure inside the tires and transmit that information to a control unit. The two systems that Rutgers examined are commonly used in vehicles manufactured during the past three years.

“While we agree this technology is essential for driver safety, more can be done to improve security, such as using input validation or encryption,” said Wade Trappe, a collaborator on the project who is an associate professor of electrical and computer engineering and associate director of WINLAB.

The researchers’ South Carolina collaborators, led  by Wenyuan Xu, a former doctoral student at WINLAB and now an assistant professor at the University of South Carolina, were able to intercept a signal more than 30 feet from the car using a simple antenna and more than 120 feet away by adding an amplifier. They were able to analyze the radio signal and reverse-engineer the code using common laboratory instruments. With that knowledge, they built a transmitter that spoofed a sensor’s wireless message.

In tests using their own cars, the researchers were able to send false signals from one car and trigger a “low tire pressure” light in another while driving next to each other at 35 miles per hour. They were also able to trigger the dashboard “check tire pressure” light while driving next to each other at 65 miles per hour.

The researchers also found that at least one tire pressure system could be damaged through spoofed wireless signals.

Related articles

• Hackers Deflate Auto Tire-Pressure Sensors (informationweek.com)
• Wireless Car Sensors Vulnerable to Hackers (technologyreview.in)
• Hackers spoof car warning system (go.theregister.com)
• Cars hacked through wireless tire sensors (arstechnica.com)

OIF project to shrink tunable laser modules for 100G networks

By Nick Flaherty www.flaherty.co.uk

The Optical Internetworking Forum (OIF) is developing a specification for a micro-integrable tunable laser assembly (uITLA). This new form factor for tunable lasers is needed as the industry moves to an XFP form factor with reduced power dissipation.
The new uITLA project will propose changes to the assembly electrical interfaces, optical specifications, and mechanical specifications and provide an alternative laser solution for ITLA customers contemplating the integration of a specific vendor “gold box” laser on the host PCB due to space constraints. The aim is to cut the real eastate used on the base plate area by half compared to today's ITLA-MSA-1.2 modules.

Related articles

• Tunable quantum cascade laser (physorg.com)
• The OIF Approves 100G Coherent Receiver Implementation Agreement (eon.businesswire.com)
• The OIF Hosts 100G Components Showcase at OFC/NFOEC (eon.businesswire.com)
• Intel Brings Integrated Silicon Optics Closer (spectrum.ieee.org)
• The OIF Starts Two New 100G Projects (eon.businesswire.com)

Intel changes track on healthcare - video comment

Combines units with GE to focus on telehealth 

By Nick Flaherty www.flaherty.co.uk

Intel is merging its Digital Health group with GE Healthcare’s Home Health division to create a new healthcare technology company focused on telehealth and independent living. The new company will be owned equally by GE and Intel, with Louis Burns, currently vice president and general manager of Intel’s Digital Health Group, as CEO of the new company, and Omar Ishrak, senior vice president of GE and president and CEO, GE Healthcare Systems, as chairman.
If it weren't for Burns taking over as CEO, this would look like Intel getting out of the healthcare business - instead, it's an acknowledgment that this is becoming a system level 'sell' that needs back end communications and sofware support as much as the innovative terminal designs that Intel had been selling previously.
The deal builds on the GE-Intel healthcare alliance announced in April 2009 around independent living and chronic disease management. Both see technology as a way to bring more effective healthcare into millions of homes, and with the dramatic increase of people living with chronic conditions, and a global aging population, there is a need to find new models of healthcare delivery and extend care to the home and other residential settings.
Once formed by the end of the year, the new company will develop and market products, services and technologies that promote healthy, independent living at home and in assisted living communities around the world. It will focus on three major segments: chronic disease management, independent living and assistive technologies. GE Healthcare and Intel will contribute assets in remote patient monitoring, independent living concepts and assistive technologies, such as the Intel Health Guide, Intel Reader and GE Healthcare’s QuietCare.
“New models of care delivery are required to address some of the largest issues facing society today, including our aging population, increasing healthcare costs and a large number of people living with chronic conditions,” said Intel President and CEO Paul Otellini. “We must rethink models of care that go beyond hospital and clinic visits, to home and community-based care models that allow for prevention, early detection, behavior change and social support. The creation of this new company is aimed at accelerating just that.”
GE Chairman of the Board and CEO Jeff Immelt said “Controlling healthcare costs while bringing quality care to an increasingly aging population is one of the largest global challenges we face today. We think this joint venture will offer great potential to address these challenges by improving the quality of life for millions while lowering healthcare costs through new technology. This new company is the next step forward in a healthcare partnership that combines the complementary expertise and capabilities of GE and Intel to accelerate the development of innovative home health technology.”
Under the terms of the agreement, the new company will combine an experienced team, home health assets, technology development, products, sales and marketing. With the combined talent, capabilities and capital sharing, the new company will also provide the focus required to speed innovation and delivery of products to market.
The new company will have headquarters in the greater Sacramento area of California.
Comments by Steve Agritelley of Intel's Digital Health Group

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• Intel, GE Announce Telehealth Joint Venture (informationweek.com)
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Open source hardware gets an updated definition

Open source hardware gets an updated definition - The Inquirer

Version 3.0 for open source hardware designs

60GHz LAN chips take off

Startups and partnerships to drive 60GHz networks

By Nick Flaherty www.flaherty.co.uk

The development of chips for 60GHz networking is taking off, with UK startup Blu Wireless already developing a radio and baseband digital signal processing, and US WiFi chip maker Atheros joining with Wilocity for a 60GHz chipset.
The driver for this is the establishment of the WiGig Wireless Gigabit Alliance specification for networking, distinct from the WirelessHD 60GHz format for wireless HDMI short range links. This avoids the problems of multiple competing standards that killed UltraWideband (UWB), and the leader in 60GHz WirelessHD, SiBeam, is also developing parts for WiGig.
Blu Wireless has developed a 60GHz RF chip in 40nm and is now working on the underlying DSP, with 2Gbit/s and 4Gbit/s chips in a 10 x 10mm package due next year, volume production in 2012 and a target price of $10 in 2013. My story from the Wireless2.0 conference is here. 
At the same time, Wilocity, a leading Israeli developer of 60 GHz multi-gigabit wireless chipsets for the mobile computing, consumer electronics and peripheral markets, and WiFi chip maker Atheros Communications are collaborating to build tri-band wireless solutions that combine the ubiquity and coverage of Wi-Fi with the multi-gigabit performance of WiGig. Such “tri-band” capabilities will enhance the performance and functionality of wireless devices to enable a variety of new computing and entertainment applications.
Many devices and networks use dual-band 802.11n, which operates in the 2.4 GHz and 5 GHz bands, to share broadband connections, videos, music, photos and other content throughout a home or enterprise. Advanced 60 GHz technologies offer multi-gigabit speeds to complement existing Wi-Fi capabilities and enable new cutting-edge wireless applications. Tri-band devices that leverage all three bands will also maintain compatibility with the hundreds of millions of Wi-Fi products in use today, ensuring a seamless and simple user experience.
Atheros and Wilocity are jointly developing tri-band solutions based on both the IEEE 802.11n standard and the new WiGig multi-gigabit wireless specification. By integrating and optimizing Wi-Fi and WiGig solutions, the two companies aim to accelerate the design of tri-band wireless products and enable the next-generation wireless ecosystem.
Atheros serves on the board of directors for both the WiGig Alliance and Wi-Fi Alliance; Wilocity serves on the WiGig board and chairs its Marketing Work Group.

Related articles

• Atheros and Wilocity embrace 'tri-band' wireless wares, 60GHz wireless PCIe (engadget.com)
• Wireless Gigabit Spec Published, Gains Cisco Support (pcworld.com)
• Wi-Fi, WiGig To Deliver 60 GHz Wireless (informationweek.com)
• Wireless Gigabit set to become next-gen Wi-Fi? (go.theregister.com)
• Wi-Fi, WirelessHD Cozy up to WiGig Standard (pcworld.com)
• WiGig promise 7 Gbps wireless with WiFi b/g/n compatibility (slashgear.com)

Arqiva pilot long-range radio for smart meter network

Arqiva pilot long-range radio for smart meter network - 07/07/2010 - Electronics Weekly

Hmm, very interesting

Surprisingly 2.5G Drives Cell Phone Baseband - chart

Portable Multimedia: Surprisingly 2.5G Drives Cell Phone Baseband - chart

Great, useful data on baseband players in the market

Find out the latest on the mobile industry

By Nick Flaherty www.flaherty.co.uk

The international wireless industry meets in Bristol this week with 2010's Wireless2.0 conference on Friday July 9th at @Bristol, www.siliconsouthwest.co.uk

Market data direct from Will Strauss of Forward Concepts, future directions for the handset from Sony Ericsson, how to get good 2Mbit/s broadband into rural areas from Deltenna and a host of other speakers, from the ex CTOs of Orange and Microsoft Europe to the latest high speed connectivity in the home. If you are in mobile, you have to be there.

There's also a chance to meet the speakers at dinner on the 8th - see the website www.siliconsouthwest.co.uk for details.

• Keynotes – Multimedia in the hand
9.15 Welcome, Nick Flaherty, Editorial Director, Silicon South West
• 9.30 Joakim Nelson, General Manager, Head of Industry Collaboration & Asset Management, CTO, Sony Ericsson Mobile Communications – the future of mobile handsets
• 10.00 Will Strauss, President, Forward Concepts – market analysis of mobile multimedia
• 10.30 Simon Knowles, VP Strategy, Icera

11.00 Coffee

Multimedia in the street
11.30 Chair: Walter Tuttlebee, CEO, MobileVCE
• 11.45 Ray Williamson, Motorola - Video; the implications for mobile networks
• 12.15 Pete Keevil, CTO, Ubiquisys – Extending the reach of femtocells
• 12.45 Dr. Tim Wilkinson, VP Technical Marketing, IPWireless

1.15 Lunch

Multimedia In the home
• 2.15 Chair: Gurpritpal Singh, CTO, Cingular Consulting Services
• 2.30 Prof. David Bull, CTO, ProVision Communications – Research in video
• 3.00 Tim Haysom, CMO, OMTP / Bondi – The rise of the Widget
• 3.30 Peter Claydon, VP Sales & Marketing, Deltenna – Extending broadband coverage to rural areas
• 4.00 Mark Barrett, CEO, Blu Wireless – high speed connectivity in the home
4.30 Close Nick Flaherty, Silicon South West 
 

Related article

• WiBE Shared Hotspot Pitched For Rural Broadband in UK (tech.slashdot.org)
• Mobile firms test TV broadcast service (guardian.co.uk)

Lattice and Affarii put remote radio head on FPGA

COMPLETE RRH HARDWARE FOR WIRELESS INFRASTRUCTURE

By Nick Flaherty www.flaherty.co.uk

Lattice Semiconductor and Affarii Technologies have demonstrated the industry’s lowest cost, low power Remote Radio Head (RRH) solution at 1300mW per antenna. The integration of all RRH processing has been achieved on a single LatticeECP3-150 device.
The single chip solution supports 2x2 MIMO configurations for WCDMA, LTE and WiMAX applications and is part of an overall RRH hardware evaluation platform jointly
developed by Lattice and Affarii. The platform is comprised of the RF front-end, high-speed
data conversion devices and the digital signal processing portion. The functionality of the full
signal path package includes DDC/DUC, DPD, CFR and CPRI IP cores, supports multi-carrier
waveforms up to 20MHz bandwidth and is compatible with Class AB and Doherty amplifiers
using LDMOS and GaN transistors.
All features of this RRH solution, both hardware and soft IP, are fully integrated and supported by Lattice’s latest generation of design tools.
The RRH solution is built using Affarii’s digitalTRX technology that includes Digital Up/Down Converter (DUC/DDC), Crest Factor Reduction (CFR) and Digital Pre-Distortion (DPD) functionality. When used with industry standard Doherty amplifiers the Digital Pre- distortion solution provides up to 30dB of ACLR correction with PA output efficiencies exceeding 40%, allowing flexible and efficient RRH designs. The solution is fully customizable, with end applications including WCDMA, LTE, WiMAX, and DVB-T/S/H.
The RRH solution is supported by a development and test environment that includes GUI-based design simulation, performance analysis and a production test API with design examples.

Related articles

• Lattice Semi seeks a comeback; HD Plus secures funding: Silicon Forest week in review (oregonlive.com)
• Directory indexing over 17,000 blocks, FPGA devices (ciol.com)

Que? That’s Spanish for “Where The Hell is My E-Reader,” Right?

Que? That’s Spanish for “Where The Hell is My E-Reader,” Right?

Story from WSJ on the cancellation of pre-orders for Plastic Logic's Que reader, and no date for shipping - opps, not a good sign, and a real shame for a UK startup!

Updated: Yorkshire silicon resonator firm raises £3m - 25/06/2010 - Electronics Weekly

Updated: Yorkshire silicon resonator firm raises £3m - 25/06/2010 - Electronics Weekly

IBM, Samsung and GLOBALFOUNDRIES Set To Produce 28nm Chips with STMicroelectronics

Three Tier Two suppliers aiming to boost into next generation process technology - ST the beneficiary

Portable Multimedia: Toshiba aims to standardise WiFi in an SD card

Portable Multimedia: Toshiba aims to standardise WiFi in an SD card

Not just for portable multimedia communications but a quick and easy way toadd WiFi to all manner of embedded and industrial devices via an SD slot

Xilinx tackles FPGA power with 28nm Series-7

Scalable from low to high density with 28nm Virtex-7, Kintex-7, and Artix-7 families

By Nick Flaherty www.flaherty.co.uk

Xilinx is tackling two of the key barriers to using FPGAs - power and cost. It is reducing the power consumption of its new 7 Series devices families by 50% over the previous generation and has developed an architecture that wil scale across three families, helping to reduce costs. However, the idea of heading into mobile equipment with some of these parts is somewhat optimisitic - low power serves more purpose in increasing channel density in networking and telecoms applications.
“The 7 series represents a new juncture for Xilinx, and the FPGA industry in general, as we bring our technology portfolio to new markets by putting a significant emphasis on lowering power consumption,” said Xilinx President and CEO Moshe Gavrielov. “In addition to delivering what we and our customers expect from Moore’s Law in terms of capacity and performance with each new generation, we continue our focus on opening programmable logic to a broader audience by delivering design platforms targeted toward the specific needs of new users and markets.”The low static power comes from a HKMG (high-K metal gate) process optimized for low static power consumption (see “Xilinx Picks 28nm High-Performance, Low-Power Process to Accelerate Platforms for Driving the Programmable Imperative”) that lowers static power consumption by 50 percent compared to the alternative 28nm high-performance process. Xilinx then applied architectural enhancements to lower dynamic power consumption both for logic and I/O, while also introducing intelligent clock-gating technology with the release of ISE Design Suite 12. The result is an FPGA series that provides 50 percent lower total power consumption compared to Virtex-6 and Spartan-6 FPGAs and 30 percent lower than alternative 28nm FPGA device families.
Designers can take full advantage of up to 4.7TMACS in DSP performance symmetric mode (2.37TMACs in non-symmetric mode) and 2 million logic cells at clock speeds of up to 600MHz, and achieve up to 2.4Tbps high-speed connectivity all while staying within their power budgets.
All 7 series FPGAs share a unified architecture that enables customers to easily scale their designs up or down in capability to reduce cost and power or increase performance and capability, thereby reducing their investment in developing and deploying products across low-cost and high-performance families. The architecture is derived from the widely successful Virtex-series-based architecture and has been designed to simplify reuse of current Virtex-6 and Spartan-6 FPGA designs. It is also supported by the EasyPath FPGA cost reduction solution for the move to fixed silicon that further improves productivity by enabling a guaranteed 35 percent cost reduction with no incremental conversion or engineering investment.
Customers who need the lower power or increased system performance and capacity provided in the new 7 series FPGAs can begin designs in Virtex-6 and Spartan-6 FPGAs and move the designs when the time is right through the adoption of the AMBA AXI interconnect standard enabling plug-and-play IP usage to help customers improve productivity and development costs.
“Integrating 6-LUT architecture and working with ARM on the AMBA specification for these devices supports IP reuse, portability, and predictability,” said Andy Norton, CTO for Systems Architecture, Cloudshield Technologies, an SAIC company. “A unified architecture, new paradigm-changing processor-centric devices and hierarchical-based design flows in next-gen tools, will result in increased productivity, flexibility, system-on-chip capabilities and portability from previous generation architectures.”
The devices use the same logic architecture, Block RAM, clocking technology, DSP slices, and SelectIO™ technology and build on previous generations of devices delivered by Xilinx’s patented Virtex series ASMBL block architecture. This next generation ASMBL architecture provides unprecedented flexibility and scalability that enables customers to most effectively use the full range of logic densities.

Xilinx 7 Series FPGA Families:
Virtex-7 Family: 2X system performance improvement at 50 percent lower power compared to Virtex-6 devices, the ultra high-end Virtex-7 family sets new industry benchmarks with 1.8X greater signal processing performance, 1.6x greater I/O bandwidth, 2X greater memory bandwidth with 2133 Mbps memory interfacing performance, and delivers the industry’s largest density FPGA with 2 million logic cells, which is 2.5X greater density than any previous or existing FPGA. EasyPath-7 devices are also available for all Virtex-7 FPGAs for a guaranteed 35% cost reduction without requiring any design conversion. Virtex-7 devices enable 400G bridging and switch fabric wired communication systems that are at the heart of the global wired infrastructure, advance RADAR systems, and high-performance computer systems that require single-chip TeraMACC signal processing capabilities, as well as the logic density, performance, and I/O bandwidth required for next generation test and measurement equipment. The Virtex-7 family will include “XT” extended capability devices with as many as 80 transceivers supporting individual line rates up to 13.1Gbps and devices that provide up to 1.9Tbps serial bandwidth. Also, these devices offer up to 850 SelectIO pins enabling the industry’s greatest number of parallel banks of 72-bit DDR3 memory interfaces supporting 2133Mbps. Future devices will also feature 28Gbps transceivers.

Kintex-7 Family: Establishing a new category of FPGAs, the Kintex-7 family delivers Virtex-6 family performance at less than half the price for a 2x price/performance improvement while consuming 50 percent less power. The family includes high-performance 10.3Gbps or lower-cost optimized 6.5Gbps serial connectivity, memory, and logic performance required for applications such as high volume 10G optical wired communication equipment. It also provides a balance of signal processing performance, power consumption, and cost to support the deployment of Long Term Evolution (LTE) wireless networks, meet the aggressive power and cost requirements required for next generation high definition 3D flat panel displays, and deliver the performance and bandwidth needed for next generation broadcast video-on-demand systems.

Artix-7 Family: Delivering 50 percent lower power and 35 percent lower cost compared to the Spartan-6 family, the Artix-7 family uses small form-factor packaging and the unified Virtex-series based architecture to deliver the performance required to address cost-sensitive, high-volume markets previously served by ASSPs, ASICs, and low-cost FPGAs. This new family meets low power performance requirements of battery-powered portable ultrasound equipment, and addresses small form factor, low power requirements for commercial digital camera lens control, as well as the strict size, weight, power, and cost (SWAPc) requirements for military avionics and communications equipment.

Availability

Early access ISE Design Suite software supporting 7 series FPGAs is now available. Initial devices will be available in Q1 of next year.

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Toshiba Launches Industry’s Largest Embedded NAND Flash Memory Modules

32nm Embedded Memory up to 128GB NAND and Controller in a Single Package

By Nick Flaherty www.flaherty.co.uk
Toshiba has launched a 128-gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The module is fully compliant with the latest e•MMC standard, and is designed for application in a wide range of digital consumer products, including smartphones, tablet PCs and digital video cameras. Samples will be available from September, and mass production will start in the fourth quarter (October to December) of 2010.

The new 128GB embedded device integrates sixteen 64Gbit (equal to 8GB) NAND chips fabricated with Toshiba's cutting-edge 32nm process technology and a dedicated controller into a small package only 17 x 22 x 1.4mm. Toshiba is the first company to succeed in combining sixteen 64Gbit NAND chips, and applied advanced chip thinning and layering technologies to realize individual chips that are only 30 micrometers thick.

Toshiba's modules now range from 2GB to 128GB and integrate a controller to manage basic control functions for NAND applications, and are compatible with the JEDEC e•MMC Version 4.4 and its features. New samples of 64GB chips will also be available from August.

Demand continues to grow for large density chips that support high resolution video and deliver enhanced storage, particularly in the area of embedded memories with a controller function that minimizes development requirements and eases integration into system designs.

New Product Line-up

Product Number	Capacity	Package	Sample Shipment	Mass Production
THGBM2T0DBFBAIF	128GB	237Ball FBGA 17x22x1.4mm	Sep. 2010	4Q, 2010 (Oct.-Dec.)
THGBM2G9D8FBAIF	64GB	237Ball FBGA 17x22x1.4mm	Aug. 2010	4Q, 2010 (Oct.-Dec.)

Key Features

1. The JEDEC e•MMC V4.4 compliant interface handles essential functions, including writing block management, error correction and driver software. It simplifies system development, allowing manufacturers to minimize development costs and speed up time to market for new and upgraded products.

2. Embedded in a system, the module can record up to 2,222 hours of music at a 128Kbps bit rate, 16.6 hours of full spec high definition video and 38.4 hours of standard definition video

3. The 128GB device stacks sixteen 64Gbit chips fabricated with leading-edge 32nm process technology. Application of advanced chip thinning, layering and wire bonding technologies has allowed Toshiba to achieve individual chips only 30 micrometers thick, and to layer and bond them in a small package. The result is an embedded NAND flash memory module with the industry’s highest density.

4. The new products are sealed in a small FBGA package only 17 x 22 x 1.4mm and has a signal layout compliant with the JEDEC e•MMC V4.4.

Specifications

e•MMC

Interface	JEDEC e•MMCTM V4.4 standard HS-MMC interface
Power Supply Voltage	2.7V to 3.6V (memory core); 1.65V to 1.95V / 2.7V to 3.6V (interface)
Bus width	x1, x4, x8
Write Speed*	21MB per sec. (Sequential/Interleave Mode) 21MB per sec. (Sequential/No Interleave Mode)
Read Speed*	46MB per sec. (Sequential Mode/Interleave Mode) 55MB per sec. (Sequential/No Interleave Mode)
Temperature range	-25degrees to +85degees Celsius
Package	153Ball FBGA （+84 support balls）

Related articles

• Toshiba hits 128GB with new NAND flash memory (crunchgear.com)
• Samsung Introduces High-speed 512GB SSD Utilizing New Toggle-mode DDR NAND Memory (eon.businesswire.com)
• Toshiba To Test Sub-25-nm NAND Flash (hardware.slashdot.org)
• Samsung and Toshiba squeeze NAND market (go.theregister.com)

Shipments of Short Range Wireless ICs Expected to Increase 18% in 2010, Says ABI Research | Business Wire

Shipments of Short Range Wireless ICs Expected to Increase 18% in 2010, Says ABI Research

Short range wireless ICs, including Bluetooth, NFC, UWB, 802.15.4 and Wi-Fi have been widely adopted in computing, communication, and consumer products in recent years.

“The market for short range wireless ICs is booming in 2010, says ABI Research analyst Celia Bo. “Total shipments will increase approximately 18% compared to 2009.”

Bluetooth ICs, which lead the short range wireless IC market, are expected to exceed 55% of total Short Range Wireless IC shipments in 2010. The cellular handsets segment is seen to be maintaining the highest unit shipment of Bluetooth-enabled products, followed distantly by the notebook and UMD segment.

Bluetooth-enabled home entertainment products form an emerging market that is forcing an increase in the Bluetooth IC shipments, and the networked and handheld game consoles and will also see wide adoption. Bo concludes, “Bluetooth Low Energy wireless technology opens an absolutely new and very significant market opportunity for products and devices which need low cost and low power wireless connectivity.”

ABI Research’s market data product “Short Range Wireless ICs: Bluetooth, NFC, UWB, 802.15.4, and Wi-Fi Market Forecasts” (http://www.abiresearch.com/research/1003745), addresses marketing and technical analysis of Bluetooth, NFC, UWB, 802.15.4, Wi-Fi and Combo Wireless Connectivity ICs. The forecast information is broken down by applications, including computers, communication devices and consumer electronic products. The study is included in two of the firm’s Research Services: Short Range Wireless (http://www.abiresearch.com/products/service/Short_Range_Wireless_Research_Service) and Semiconductors (http://www.abiresearch.com/products/service/SE-RFPD).

Engineers build 3D printer for making plastic parts | News | The Engineer

Engineers build 3D printer for making plastic parts | News | The Engineer

Fast 3D printer from the SPRINT project

Portable Multimedia: Tiny pico projector for cell phones and cameras

Portable Multimedia: Tiny pico projector for cell phones and cameras

By Nick Flaherty www.flaherty.co.uk

Very nice little unit, 4cc, 6mm high for embedding in cameras although still a bit large for use in smartphones

Portable Multimedia: First standard 1.8in solid state drive modules

Portable Multimedia: First standard 1.8in solid state drive modules

Nice little modules from Apacer, SATA interface up to 64Gbyte capacity with the latest JEDEC standard