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Monday, April 23, 2007
Elpida shows the way forward for chip packaging
Akita Elpida Memory has put together a Multi Chip Package (MCP) with 20 stacked dies, that measures just 1.4mm thick, making it the world's thinnest.
Akita Elpida is a new company established in July, 2006 by one of the leading global DRAM suppliers, Elpida, to focus on semiconductor back-end processes as part of the Hitachi group.
High density packages today can have 5 to 7 die in them, but these 20 die are ground down to 30µm thick, with 40 µm low loop wire bonding and technology for injecting resin into narrow gap. This all needs new specialist equipment for handling the ultra-thin die.
This is just for memory at the moment, but with 4Gbit memories you are now talking 10Gbytes in a single package, great for applications where weight and space are at a premium.
The real value is using this approach for other chips, which is where the connection with the Hitachi group (including chip supplier Renesas Technology) is important, putting processors and phone baseband and RF and memory in that package makes a compelling proposition.