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See the latest stories on quantum computing from eeNews Europe

Monday, May 13, 2019

Siemens $30bn power spinout ... $1bn SiC boost at Cree ... Integrating sensors onto a GaN power chip ... first defect free 2in AlN wafer

Power news this week by Nick Flaherty at eeNews Europe Power www.flaherty.co.uk

. Siemens spinout to create $30bn power giant


. Romeo teams with BorgWarner for battery cell and pack production


. $1bn silicon carbide boost at Cree

POWER TECH TO WATCH
. X-Fab teams for first substrate analysis tool for high voltage designs

. GaN single chip integrates sensors for the first time

. First defect-free AlN power wafer

NEW POWER PRODUCTS

. 1200V IGBT family reduces automotive inverter size

. Three pin packages boost 650V silicon carbide FETS

. Power density boost of 48x from new 8x8mm package

TECHNICAL PAPERS
. Using precision current sensing to optimize system performance


. Infineon: Semiconductor solutions for robotics
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About Flaherty Publishing

By looking across all the different technologies and markets in the embedded space, this blog pulls together trends and opportunities through exclusive news, video and comment that you might not have seen from sites dedicated to individual topic areas. The labels below allow you to select your own interest areas, and please look through the archive.

The Embedded Blog is one of the services from Flaherty Publishing Ltd, which include SouthWest Innovation News and the High Tech news channel at TechSpark.co covering news from the tech hotspot in the southwest UK, editorial and marketing services, the High Tech Sector group of the West of England Local Enterprise Partnership, media training specifically for tech companies and Bristol-based tech startup enchantd.

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