Siemens $30bn power spinout ... $1bn SiC boost at Cree ... Integrating sensors onto a GaN power chip ... first defect free 2in AlN wafer

Power news this week by Nick Flaherty at eeNews Europe Power www.flaherty.co.uk

. Siemens spinout to create $30bn power giant


. Romeo teams with BorgWarner for battery cell and pack production


. $1bn silicon carbide boost at Cree

POWER TECH TO WATCH
. X-Fab teams for first substrate analysis tool for high voltage designs

. GaN single chip integrates sensors for the first time

. First defect-free AlN power wafer

NEW POWER PRODUCTS

. 1200V IGBT family reduces automotive inverter size

. Three pin packages boost 650V silicon carbide FETS

. Power density boost of 48x from new 8x8mm package

TECHNICAL PAPERS
. Using precision current sensing to optimize system performance


. Infineon: Semiconductor solutions for robotics