AMD has launched two new platforms that bring key functions from the desktop to the embedded market but with long term support and fanless operation.
The compact ASB2 platform and the high-performance AM3 platform offer combinations of power and performance with up to 74% (apparently, rather than 75%) improvement in performance-per-watt over previous generations. The embedded platforms consist of chipset and graphics solutions along with high-performance CPUs as low as 8W.
“The barriers to widespread adoption of x86 in the broad embedded market have traditionally been a combination of power, price and the physical footprint of the silicon,” said Buddy Broeker, director of the Embedded Solutions Division at AMD. “AMD’s embedded solutions have been steadily driving down those barriers while adding enterprise-class performance and features that may not have been readily available to designers in the past.
New Platform Features
- Faster memory with support for 2 channels DDR3
- Improved I/O for high-throughput and real-time applications with available HyperTransport 3.0 technology
- ECC for high-reliability applications like SMB/SOHO storage systems
- Multiple CPU options that offer wide choice of performance and power
- Power envelopes in 8, 12, 15, 25, 45, and 65 watts TDP
- Single-, dual- and quad-core
- Up to 2.8 GHz
- AMD 785E chipset with support for PCI Express 2.0
- New ATI Radeon HD 4200 graphics with DirectX 10.1, full 1080p display resolution support, HDMI, and power-savings capability with options to support multiple displays
- Socket AM3 package, compatible with socket AM2 when using DDR2 memory for increased design flexibility and scalability
- Lidless BGA package offers low-cost to manufacture, high reliability, and low z-height for small form factors and fan-less designs
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