All the latest quantum computer articles

See the latest stories on quantum computing from eeNews Europe

Monday, November 27, 2017

Power news this week

By Nick Flaherty www.flaherty.co.uk

. Solliance pushes up roll-to-roll perovskite solar cell efficiency


. World's largest lithium ion battery system powers up


. Mitsubishi aims to dominate the power device business

TECHNOLOGIES TO WATCH
. Swiss researchers develop 3V solid state sodium battery


. Three electrode fuel cell creates hydrogen from solar power


. Revolutionary solid state rechargeable aluminium-sulfur battery project starts


NEW POWER PRODUCTS
. First surface mount solid state battery


. 600V superjunction MOSFET cuts resonant losses


. Lightweight PCB-mounted heatsink targets power resistors


TECHNICAL PAPERS


. Intersil: Inside a new architecture for USB Type-C applications


. TI: Using a motor driver for a low power isolated full-bridge DC-DC conversion

MediaTek targets IoT with narrowband chipset

By Nick Flaherty www.flaherty.co.uk

Taiwanese chip developer MediaTek has launched the industry's first dual-mode chip to combine GPRS and narrow band IoT (NB-IoT) Release 14 (R14) technology.

The highly power efficient MT2621 chipset brings dual-mode cellular technologies for the INternet of Things (IoT). It supports the developments of a broad range of connected devices including fitness trackers and other wearables, IoT security sensors, smart meters and various industrial applications.

The MT2621 requires only a single SIM and antenna to cover both cellular networks, with dual standby functionality (SSDS). This allows a single UICC and mobile number for both networks, even while operating simultaneously, resulting in a cost-efficient, simplified design that enables manufacturers to bring their devices to market faster. The chipset integrates a wideband front-end module that provides support for all ultra-low, low and mid bands across the globe.

At its core, the MT2621 is powered by an efficient Armv7 processor core paired with internal Flash and PSRAM. The chipset supports sight and sound interfaces for peripherals, and comes with built-in Bluetooth 4.2 for connecting to other devices nearby.

https://www.mediatek.com/products/nbIot/mt2621

Related stories:

US lab builds ARM-based supercomputer

A major US research laboratory is developing a supercomputer based on ARM's 64bit chips, writes Nick Flaherty on eeNews Europe.

The US Department of Energy’s (DOE) Argonne National Laboratory is working with Hewlett Packard Enterprise (HPE) on software and a development ecosystem for its high-performance computing (HPC) system called Comanche.

Reducing the power consumption of HPC systems is a key objective of the project. Over the last decade, Argonne has been partnering with industry vendor IBM, and more recently, Intel and Cray, to produce custom architectures optimized for scientific and engineering research. These architectures not only feature custom processor systems, but new interconnects, software stacks and solutions for power and cooling.

“Inducing competition is a critical part of our mission and our ability to meet our users’ needs,” said Rick Stevens, associate laboratory director for Argonne’s Computing, Environment and Life Sciences Directorate.

Argonne is working with HPE to evaluate early versions of Cavium's ThunderX2 64bit ARM processors as a cost-effective and power-effective alternative to x86 architectures based on Intel CPUs. The lab is installing a 32-node Comanche Wave prototype ARM64 server platform (above) in its testing and evaluation environment, the Joint Laboratory for System Evaluation, in early 2018. Argonne researchers from various computing divisions will run applications on the ecosystem and provide performance feedback to HPE and partnering vendors.

“We have to build the pipeline for future systems, too,” said Stevens. “Industry partnerships are critical to our ability to do our job — which is to provide extreme-scale computing capabilities for solving some of the biggest challenges facing the world today.”

“By initiating the Comanche collaboration, HPE brought together industry partners and leadership sites like Argonne National Laboratory to work in a joint development effort,” said HPE’s Chief Strategist for HPC and Technical Lead for the Advanced Development Team Nic DubĂ©. “This program represents one of the largest customer-driven prototyping efforts focused on the enablement of the HPC software stack for ARM. We look forward to further collaboration on the path to an open hardware and software ecosystem.”

There's more at US lab to build ARM-based supercomputer | EETE Power Management


Thursday, November 09, 2017

TI drives down microcontroller cost to 25 cents for IoT sensors

By Nick Flaherty at www.flaherty.co.uk

25 functions for 25 cents with new MSP430 microcontroller for sensor designs in the Internet of Things (IoT)

Texas Instruments (TI) has launched a low cost, low power low power microcontroller for sensing applications. Developers can now implement simple sensing solutions through a variety of integrated mixed-signal features in this family of MSP430 value line sensing MCUs, available for as low as US$0.25 in high volumes.

Additions to the family include two new entry-level devices and a new TI LaunchPad development kit for quick and easy evaluation.

Developers now have the flexibility to customise 25 common system-level functions including timers, input/output expanders, system reset controllers, electrically erasable programmable read-only memory (EEPROM) and more, using a library of code examples.

The common core architecture, tools and software ecosystem and extensive documentation including migration guides make it easy for developers to choose the appropriate MSP430 device for their design.

Designers can also scale from the 0.5-KB MSP430FR2000 MCU to the rest of the MSP430 sensing and measurement portfolio for applications that require up to 256 KB of memory, higher performance or more analogue peripherals.

The MSP430FR2000 and MSP430FR2100 MCUs (with 0.5 KB and 1 KB of memory, respectively) and the new development kit join the MSP430 value line sensing family which includes the MSP430FR2111, MSP430FR2311, MSP430FR2033, MSP430FR2433 and MSP430FR4133 microcontroller families and their related development tools and software.

The MSP430FR2433 LaunchPad development kit (MSP-EXP430FR2433) is available from the TI store and distributors for US$9.99, although it is available now for $4.30.

Wednesday, November 08, 2017

Module simplifies 802.11ac designs in the IoT

By Nick Flaherty at www.flaherty.co.uk

Skyworks Solutions has launched a family of highly integrated wireless networking solutions for mobile and Internet of Things (IoT) ecosystems. 

The SkyOne WiFi suite combines Skyworks' front end radio and 802.11ac technology to provide customers with a comprehensive front-end module in a single placement, compact footprint. Specifically, these new products incorporate all key radio frequency blocks between the Wi-Fi system-on-chip (SOC) and the antenna, avoiding the need for complex RF design challenges, while reducing time to market. 

The SKY85812-11 is dual-band front-end module incorporating a 5 GHz bypass low noise amplifier with single-pole, double-throw transmit/receive switch and a 2.4 GHz bypass low noise amplifier with single-pole, triple-throw switch with Bluetooth port that allows for Wi-Fi antenna sharing. The SKY85812-11 also includes a 2 GHz LTE coexistence filter and diplexer - all designed into a 16-pin 3 x 3 mm package.

The platform significantly improves the Wi-Fi system performance when compared to other standard single chip designs and further mitigates interference with other radios, extending range and increasing throughput to greatly improve the user experience. The SKY85812-11 is currently shipping in flagship platforms globally with a top tier smartphone OEM.
"Today's mobile and IoT devices are now supporting up to 20 bands and require both seamless and robust Wi-Fi functionality to meet growing requirements from carrier offload, voice over IP and other bandwidth-intensive applications," said David Stasey, general manager and vice president of Diversified Analog Solutions at Skyworks. 

According to ABI Research, more than 20 billion Wi-Fi chipsets are expected to be shipped between 2016 and 2021, particularly as Wi-Fi solutions expand beyond their traditional usage applications, frequency bands, device types and performance requirements. They also expect more than 95 percent of devices shipped in 2021 to support 5 GHz Wi-Fi, signifying increased spectrum sharing with cellular technologies.

The SKY85812-11 is currently available for sampling and production. 

Related stories:

Tuesday, November 07, 2017

Multiprotocol boost for IoT designs

By Nick Flaherty at www.flaherty.co.uk

Silicon Labs has developed new dynamic multiprotocol software for its Wireless Gecko system-on-chips (SoC) and modules for simultaneous operation of Zigbee and Bluetooth low energy (LE).

The multiprotocol software adds key capabilities for the Internet of Things (IoT) applications without adding an additional chip, reducing the wireless subsystem bill-of-materials (BOM) cost and size by up to 40 percent.

Dynamic multiprotocol software allows users to commission, update, control and monitor Zigbee mesh networks directly over Bluetooth with smartphone apps. The software also makes it easier to deploy scalable indoor location-based service infrastructure by extending Zigbee-based connected lighting and building automation systems with Bluetooth beacons. By adding Bluetooth LE features to Zigbee mesh networks, developers can create next-generation IoT applications that are easier to deploy, use and update.

The dynamic multiprotocol software is powered by highly optimized wireless protocol stacks and an advanced radio scheduler running on Micrium OS. The software development kit (SDK) is available in Simplicity Studio and includes a connected lighting demo supported on selected Wireless Gecko starter kits and mobile app reference designs.
"Multiprotocol technology is the future of wireless connectivity for the IoT. Silicon Labs' multiprotocol software and Wireless Gecko SoCs enable Schneider Electric to create products that support Bluetooth LE and a variety of mesh wireless standards," said Nico Jonkers, Senior Vice President of the SmartSpace line of business at Schneider Electric. "This flexibility lets consumers and installers use familiar tools like smartphones and tablets to interact with connected devices for installation and updates while maintaining the integrity of Zigbee mesh networks. Our smart home offering, Wiser, takes full advantage of this flexibility to deliver simple installation and a robust mesh network."

In residential lighting, consumers can use smartphone apps to simplify  device installation/setup, while commercial lighting systems based on Zigbee can be extended to transmit Bluetooth beacons to enable indoor location services or asset tracking. Installers and maintenance teams can commission Zigbee devices, update software or perform diagnostics on a specific device via a Bluetooth smartphone or tablet. End users can use smartphones to control a group of lights and receive beacons to assist with indoor navigation.
IoT products in the smart home can connect to popular home automation platforms and voice assistants that support Zigbee while also supporting direct connectivity to smartphones for simple setup and local control and monitoring. For example, a connected door lock can be remotely accessed via the mesh network and unlocked locally via a smartphone app. Bluetooth beacons that include location can be used to enhance smartphone apps and provide additional context for automation applications.

Commercial building automation systems powered by Zigbee can be extended, enabling employee interaction using Bluetooth enabled smartphones, tablets or smart tags. For example, connected HVAC systems can automatically adjust based on occupancy or user preferences set in employee profiles. Silicon Labs' multiprotocol wireless technology simplifies the implementation of beacon infrastructure and transforms buildings into connected, intelligent spaces.

"Leveraging our Wireless Gecko SoCs and modules with dynamic multiprotocol software, developers can transform connected devices into intelligent, multifunction applications that drive automation, accelerate smart device adoption and deliver next-generation capabilities for the IoT," said Daniel Cooley, Senior Vice President and General Manager of IoT products at Silicon Labs. "Providing multiprotocol Zigbee and Bluetooth connectivity on a single chip also reduces design costs, simplifies software development, improves life-cycle management and accelerates time to market."

The multiprotocol software is available now to customers using Silicon Labs' EFR32MG12 and EFR32MG13 Wireless Gecko SoCs and associated modules. 

Friday, November 03, 2017

Top stories on the Embedded blog in October

By Nick Flaherty at www.flaherty.co.uk

October has seen a reduction in the hype on artificial intelligence in embedded systems (although the Qualcomm purchase below is interesting), perhaps as the funding season is coming to an end. But there was significant interest in the expansion of the open source MIPS replacement RISC-V, with SiFive adding Linux support. We've covered Foghorn earlier, so it was good to see a successful round of $30m for rolling out its analytics tech into the IoT.  Security continues to be a big challenge for IoT and embedded designs, generating lots of interest with Intel looking to automate the security chain (around its architecture, of course).

Posts