'On-the-fly' 3-D print system prints what you design, as you design it - video

By Nick Flaherty www.flaherty.co.uk

Researchers at Cornell University in the US have developed an interactive prototyping system that prints what you are designing as you design it; the designer can pause anywhere in the process to test, measure and, if necessary, make changes that will be added to the physical model still in the printer.

"We are going from human-computer interaction to human-machine interaction," said graduate student Huaishu Peng. Their system uses an improved version of an innovative "WirePrint" printer developed in a collaboration between Guimbretière's lab and the Hasso Platner Institute in Potsdam, Germany.

THIS WIRE FRAME PROTOTYPE OF A TOY AIRCRAFT WAS PRINTED IN JUST 10 MINUTES, INCLUDING TESTING FOR CORRECT FIT, AND MODIFIED DURING PRINTING TO CREATE THE COCKPIT.  CREDIT: CORNELL UNIVERSITY

In conventional 3-D printing, a nozzle scans across a stage depositing drops of plastic, rising slightly after each pass to build an object in a series of layers. With the WirePrint technique the nozzle extrudes a rope of quick-hardening plastic to create a wire frame that represents the surface of the solid object described in a computer-aided design (CAD) file. WirePrint aimed to speed prototyping by creating a model of the shape of an object instead of printing the entire solid. The On-the-Fly-Print system builds on that idea by allowing the designer to make refinements while printing is in progress.

The new version of the printer has "five degrees of freedom." The nozzle can only work vertically, but the printer's stage can be rotated to present any face of the model facing up; so an airplane fuselage, for example, can be turned on its side to add a wing. There is also a cutter to remove parts of the model, say to give the airplane a cockpit.

The nozzle has been extended so it can reach through the wire mesh to make changes inside. A removable base aligned by magnets allows the operator to take the model out of the printer to measure or test to see if it fits where it's supposed to go, then replace it in the precise original location to resume printing.

The software - a plug-in to a popular CAD program - designs the wire frame and sends instructions to the printer, allowing for interruptions. The designer can concentrate on the digital model and let the software control the printer. Printing can continue while the designer works on the CAD file, but will resume when that work is done, incorporating the changes into the print.

As a demonstration the researchers created a model for a toy airplane to fit into a Lego airport set. This required adding wings, cutting out a cockpit for a Lego pilot and frequently removing the model to see if the wingspan is right to fit on the runway. The entire project was completed in just 10 minutes.

By creating a "low-fidelity sketch" of what the finished product will look like and allowing the designer to redraw it as it develops, the researchers said, "We believe that this approach has the potential to improve the overall quality of the design process."

Irish researchers build 3D printed battery

By Nick Flaherty www.flaherty.co.uk

Researchers at the AMBER materials science centre at Trinity College, Dublin, have won €2.5 million to build a battery that can be produced on a 3D printer using new nanomaterials.

The “3D2DPrint” project focuses on creating a new type of extremely long lasting battery – one that can be embedded in any shape or size and within any type of material - whether that’s clothing, a mobile phone, a car dashboard or even implanted inside the body as an Implanted Cardiac Device. The funding will enable  Prof. Valeria Nicolosi to establish a multidisciplinary research group to develop this new class of energy storage devices. 

The batteries also have a longer lifetime using energy harvesting sources, lasting 50 times longer than the normal battery life. They will be custom made and formulated for whatever specific application needed. They will be able to be used for general fitness (e.g. within a 3D Printed smart fitness watch), as well as being manufactured and fully integrated within a 3D printed Implanted Cardiac Device. These batteries will also, compared to the current Li-battery technology, be fully non-harmful and non-flammable.

The aim of this project is to develop a new energy storage technology using a unique combination of Prof. Nicolosi’s novel 2-Dimensional nanomaterials and 3D printing processes. It is hoped that this innovative approach will produce a range of energy storage devices by exploiting 3D printing to develop complex material shapes, which may offer further performance enhancement at low cost.

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The supermarket of the future - video

By Nick Flaherty www.flaherty.co.uk

A very interesting video of Intel's view of the supermarket of the future. Using the grammar of a market stall, where you point at what you want, the stall recognises the gesture with the Intel'sRealSense 3D camera and pulls up the data about the product, from allergens to food miles. Demonstrated in Italy and built by consultancy Accenture, there's a lot of IoT and big data behind the interface.

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Panasonic, Samsung and Sony join forces for new standard for full HD wireless 3D glasses

 Development of Joint Licensing on Bluetooth enabled and IR 3D glasses

By Nick Flaherty www.flaherty.co.uk

Panasonic, Samsung Electronics, Sony and X6D (XPAND 3D) are to collaborate on the development of a new technology standard for consumer 3D active glasses called the "Full HD 3D Glasses Initiative."
The companies say they will work together on the development and licensing of radio frequency (RF) system 3D active glasses technology, including RF system protocols between consumer 3D active glasses and 3D displays such as televisions, personal computers, projectors and 3D theatres with XPAND active shutter glasses.

These glasses end a full HD image to each eye to give higher quality 3D but there are different standards, limiting the uptake by consumers.
The standardization will also include multiple types of infrared (IR) system protocols between 3D active glasses and 3D displays, ranging from the protocols jointly developed by Panasonic and XPAND 3D to the proprietary protocols of Samsung and Sony.
The licensing is targeted to be released in September 2011 and then the development of the new standard 3D glasses will begin. Universal glasses with the new IR/RF protocols will be made available in 2012, and are targeted to be backward compatible with existing systems.
"Panasonic has been working to standardize 3D glasses technologies, and in March, we announced a joint licensing of IR system protocols with XPAND, backed by several participant companies. We are very pleased that today's latest collaboration will incorporate our previous concept into these new standardization efforts," said Masayuki Kozuka, general manager of Media & Content Alliance Office, Corporate R&D Division, Panasonic Corporation. "We hope the expanded collaboration on this 3D standardization initiative will make a significant contribution toward accelerating the growth of 3D-related products."
"Today's announced collaboration underscores Samsung's promise to meet consumer needs among the ever-changing advancements of home entertainment and consumer electronics technology," said Jurack Chae, vice president, R&D Team, Visual Display Business, Samsung Electronics. "To-date, active 3D technology has proven to be the most popular choice for consumers in the 3D TV market. According to the NPD Group, Active 3D technology took an average of 96 percent share of the U.S. 3D TV market in the first half of this year; and this Full HD 3D Glasses Initiative will help further drive consumer adoption and understanding of active 3D—the technology that provides the clearest and most immersive 3D experience available."
"Through this alliance, we all look forward to addressing critical industry issues to enable a better consumer experience across products. We believe active 3D technology is the most suitable method to deliver full 1080p picture quality to each eye, giving consumers the 3D experience they most desire," said Jun Yonemitsu, deputy senior general manager, Home Entertainment Development Div., Sony Corporation.
"We are delighted to contribute our efforts and technologies to the Full HD 3D Glasses Initiative for both RF and IR technology that we announced today with Panasonic, Samsung and Sony. This initiative reinforces the consumer electronics industry's commitment to highest 3D quality and provides technology consumers and theater-goers with a simple but powerful solution to the challenge of interoperability," said Maria Costeira, XPAND 3D's CEO.
The Bluetooth SIG supports the industry's move to standardize on Bluetooth technology in 3D glasses.
"These market leaders are coming together to make the 3D experience better for the consumer. It makes perfect sense thatBluetooth technology would be a vital component of that solution, both for its mass market ubiquity and the freedom and convenience it provides," said Dr Michael Foley, executive director, Bluetooth SIG. "And while today's news is exciting, this is just the beginning—Bluetooth technology in the living room makes sense in 3D glasses, stereo surround systems, remote controls, and ultimately the hub of the living room—the TV."

The protocols jointly developed by Panasonic and XPAND were announced in March 2011 and supported by eight participant companies: Changhong Electric, FUNAI Electric, Hisense Electric, Hitachi Consumer Electronics, Mitsubishi Electric, Seiko Epson, SIM2 Multimedia and ViewSonic.

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Imagination Technologies teams with MIPS

Joint Solution Demonstrated in New 3D Chipset from Sigma Designs

Having had a close relationship (and joint venture) with ARM and an investment by Intel, Imagination Technologies has now teamed up is a strategic alliance with MIPS Technologies, with MIPS joining Imagination’s POWERVR Insider graphics developer ecosystem as a technology partner.

Together the companies are working to help SoC developers get to market quickly with optimized solutions combining processor IP from MIPS and graphics, video and other IP from Imagination.  

This helps cement Imagination's position in supplying 3D graphics IP particularly for set top box designs where MIPS dominates.

The first result of this is Sigma Designs’ new 3D media processor for IPTV, cable, and network player markets which incorporates Imagination’s POWERVR SGX 3D graphics IP and a high-performance MIPS32® 24Kf processor.

“We are impressed with the performance of our new 3D chipset that combines MIPS’ leading processors for the digital home with industry-leading graphics performance from Imagination,” said Thinh Tran, CEO of Sigma Designs. “With our new chip, we are continuing our trend of technology leadership and innovation in IPTV set-top boxes. Sigma and MIPS were the first to bring the Android™ platform—with full 1080p HD capability—to set-top box chips, and now we are pleased to offer 3D with OpenGL ES 2.0 graphics acceleration based on the market leading POWERVR SGX technology. Together with Imagination and MIPS Technologies, we are taking the lead in enhancing and enriching the consumer TV user experience.”

“This alliance between MIPS and Imagination brings together two IP industry leaders to address not only digital home solutions—where MIPS already holds a leadership position—but also mobile devices where we are seeing increasing traction,” said Sandeep Vij, president and CEO, MIPS Technologies. “Imagination is a leading provider of embedded multimedia and communications IP and we are working closely with them to offer integrated solutions that will offer our customers best-in-breed choices, differentiated devices and fast SoC integration. With MIPS and Imagination, our customers are creating some of the industry’s most innovative solutions for set-top boxes and beyond.”

“Next generation set-top box, television and other connected platforms will all use OpenGL ES 2.0 graphics technology for creation of 3D menus; advanced user interfaces, support for gaming and other advanced features,” said Hossein Yassaie, chief executive officer, Imagination Technologies. “We are seeing growing interest among our licensees in using MIPS Technologies’ IP in digital home markets alongside our industry-leading POWERVR graphics, video and display technologies as well as our communications IP solutions, and this extending to devices targeting mobile and embedded applications as well. We are pleased to work closely with MIPS to deliver comprehensive solutions our customers need for these innovative next generation products.”

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Sharp Develops 3D Touchscreen LCD for 3D without glasses

Sharp has developed a 3D touchscreen LCD for portable devices that has the industry’s highest brightness that can switch between 2D and 3D modes. Users can view 3D images without the need to wear special glasses, making this LCD ideal for mobile devices such as digital cameras, mobile phones, and smartphones, and there is speculation that it could be used for the next generation of Nintendo DS.
The newly developed 3D LCD uses a parallax barrier system to display 3D images. This parallax barrier, which has a series of vertical slits, is incorporated into an ordinary LCD to control the path of light reaching the right and left eyes, thus creating a sense of depth. However, the conventional 3D LCD with this system had difficulty in displaying high-quality images in 3D mode.
The 3D LCD developed by Sharp at this time significantly improves image quality by achieving both high brightness and low crosstalk through developments to its  CG-Silicon technology and optimization of the parallax barrier. This is an LCD process technology that uses high-performance, crystalline silicon with electron mobility up to 600 times faster than ordinary amorphous silicon and up to six times faster than low-temperature polysilicon that was developed jointly by Sharp and Semiconductor Energy Laboratory in Kanagawa, Japan.
Advances in the CG-Silicon technology have shrunk the wiring width within the LCD panel, allowing more light to pass and doubling the brightness (to 500 cd/m², the industry’s highest) compared to the conventional LCD. In addition, optimizing the parallax barrier design has increased the efficiency of light, thereby dramatically reducing crosstalk. Also, the thickness of the LCD module is about the same as conventional 2D displays even though it is a touchscreen display. As 3D images can be displayed in both portrait and landscape screen orientations, it is aimed at mobile devices such as smartphones.
Sharp has also developed a non-touchscreen 3D LCD version and will start its mass production in the first half of fiscal 2010.

	Conventional 3D LCD	Newly developed 3D LCD	Difference from conventional 3D LCD
Screen size	2.4 inches	3.4 inches	—
Screen resolution (pixels)	QVGA (240 x 320 pixels)	FWVGA (480 x 854 pixels)	Approx. double in both horizontal and vertical resolution
Brightness (2D mode)	250 cd/m2	500 cd/m2	Approx. double
Contrast ratio	100:1	1000:1	Approx. 10 times greater
Touchscreen function	Without touchscreen	With touchscreen / without touchscreen	—

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OpenGL4.0 launched

Open standard 3D API specification available immediately
Provides performance, quality and flexibility enhancements including tessellation and double precision shaders
Tight integration with OpenCL for seamless visual computing

The next generation of 3D API (application programming interface) that is deployed on all major desktop operating systems has been launched, along with a retrofit to allow the new capabilities on existing graphics processors. OpenGL is vital for desktop systems but also for smartphones with the OpenES standard and WebGL as an API for better Web graphics.
 The OpenGL 4.0 specification has been defined by the OpenGL ARB (Architecture Review Board) working group at Khronos, and includes the GLSL 4.00 update to the OpenGL Shading language in order to enable developers to access the latest generation of GPU acceleration with significantly enhanced graphics quality, acceleration performance and programming flexibility.  This new release continues the rapid evolution of the royalty-free OpenGL standard to enable graphics developers to portably access cutting-edge GPU functionality across diverse operating systems and platforms. The full specification is available for immediate download at http://www.opengl.org/registry .
OpenGL 4.0 further improves the close interoperability with OpenCL™ for accelerating computationally intensive visual applications.  OpenGL 4.0 also continues support for both the Core and Compatibility profiles first introduced with OpenGL 3.2, enabling developers to use a streamlined API or retain backwards compatibility for existing OpenGL code, depending on their market needs.
OpenGL 4.0 has been specifically designed to bring significant benefits to application developers, including:

• two new shader stages that enable the GPU to offload geometry tessellation from the CPU;
• per-sample fragment shaders and programmable fragment shader input positions for increased rendering quality and anti-aliasing flexibility;
• drawing of data generated by OpenGL, or external APIs such as OpenCL, without CPU intervention;
• shader subroutines for significantly increased programming flexibility;
• separation of texture state and texture data through the addition of a new object type called sampler objects;
• 64-bit double precision floating point shader operations and inputs/outputs for increased rendering accuracy and quality;
• performance improvements, including instanced geometry shaders, instanced arrays, and a new timer query.

Lastly, Khronos has simultaneously released an OpenGL 3.3 specification, together with a set of ARB extensions, to enable as much OpenGL 4.0 functionality as possible on previous generation GPU hardware; providing maximum flexibility and platform coverage for application developers.  The full OpenGL 3.3 specification is also available for immediate download at http://www.opengl.org/registry
“The release of OpenGL 4.0 is a major step forward in bringing state-of-the-art functionality to cross-platform graphics acceleration, and strengthens OpenGL’s leadership position as the epicenter of 3D graphics on the web, on mobile devices as well as on the desktop,” said Barthold Lichtenbelt, OpenGL ARB working group chair and senior manager Core OpenGL at NVIDIA. “NVIDIA is pleased to announce that its upcoming Fermi-based graphics accelerators will fully support OpenGL 4.0 at launch.”
“AMD sees the release of OpenGL 4.0 as another major accomplishment for the OpenGL ARB,” said Ben Bar-Haim, vice president of design engineering at AMD.  “AMD contributes to the Khronos workgroups, and we consistently find that Khronos is successful at developing healthy, thriving, and evolving open standards such as OpenGL and OpenCL.”
“OpenGL 4.0 continues the ARB’s schedule-driven roll-out of new functionality, and this significant major release enables developers to access leading-edge GPU functionality across multiple platforms with full backwards compatibility,” said Neil Trevett, president of the Khronos Group and vice president at NVIDIA.  “OpenGL continues to be a keystone in the Khronos API ecosystem, through driving innovation into OpenGL ES and WebGL to bring high-performance programmable graphics to mobile platforms and the Web, and by interoperating with OpenCL to create a seamless visual and compute platform for application developers.”

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Global 3-D TV Shipments Set to Soar to 78 Million Units in 2015

Boom with 80% CAGR, but concerns remain over 3D glasses

Global 3-D television shipments will soar to 78 million units by 2015, rising at a Compound Annual Growth Rate (CAGR) of 80 percent from 4.2 million in 2010, iSuppli predicts. Revenue from shipments of these sets will boom to $64.3bn in 2015, up by nearly a factor of nine from $7.4bn in 2010.

Figure 1 attached presents iSuppli’s worldwide forecast of 3-D TV unit shipments and revenue for the period of 2010 to 2015.

“While 3-D television has been all the rage in the consumer electronics industry, the market so far has been more talk than action,” said Riddhi Patel, director of television system research at iSuppli. “However, announcements made before and after the 2010 Consumer Electronics Show (CES) in January indicate that 3-D TV is becoming a reality. At the event, top television brands including Sony, LG, Panasonic and Samsung showcased upcoming offerings of full-featured 3-D TVs in the home. Furthermore, consumer electronics makers at CES announced 3-D Blu-ray players and home theater systems, providing critical support that will help 3-D to move beyond a niche market and enter the mainstream in the coming years.”

Because of this strong brand commitment, competition in the 3-D market is expected to be intense, causing prices to plunge. The global Average Selling Price (ASP) for 3-D TVs is set to drop to $825 by 2015, less than half the $1,768 ASP in 2010. This will make 3-D TVs attractive to worldwide consumers.

iSuppli’s forecast assumes that brands will roll out their initial 3-D televisions starting in the first quarter and continue through the second half of the year. Many of the initial 3-D TV sets, designed to test the waters of the market and gauge consumer interest, will command a price premium of $600 to $700 compared to 2D LCD-TVs using Light Emitting Diode (LED) backlighting.

iSuppli predicts that early adopters alone will purchase 3-D TVs in 2010 and 2011. However, by 2012 and beyond, sales will spread to a wider audience as content availability increases and prices drop—factors that will enable 3-D TVs to appeal to a wider audience.

Content is starting to become available this year from ESPN, DirecTV, BSkyB, SkyLife and other broadcasters and providers. ESPN, for example, will be broadcasting 85 games in 3-D this year. Moreover 40 to 50 gaming titles in 3-D are expected to be issued in 2010. 

Concern over glasses

One concern for the television industry is that special glasses are required for consumers to actually see 3-D images. These glasses raise a number of questions. Will eyewear be compatible with other sets, either from the same or from different brands? Do consumers want to wear the glasses for extended periods—or will extended wearing be uncomfortable? And beyond the price of the 3-D set, how much will the glasses cost? Some quarters surmise that the glasses could be as much as $300 a pair—which would prove prohibitive for an average family to afford.

One way that some OEMs are working around this issue is by including two pairs of glasses with their 3-D sets. These bundles would then take away the price of the glasses and give consumers the capability to view 3-D immediately.

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French focus on 3D packaging for consumer and wireless applications

Leti and R3Logic to Combine Expertise in Three-Year Lab Agreement 

French research lab Leti is teaming up with R3Logic, a leading US 3D IC EDA company to combine their expertise in 3D silicon integration and packaging in France to build 3D IC designs and methodologies for consumer and wireless applications.
3D ICs enable dramatically improved performances at a much lower cost than new, leading-edge CMOS technologies. The creation of these new ICs depends on the availability of new methodologies and skills that require a deep understanding of the overall semiconductor supply chain, including EDA, design technology and fabrication technology. This three-year Leti-R3Logic common lab is aimed at developing 3D-design solutions to accelerate developments in 3D chip-package co-design, including TSV placement and short-loop floor planning, allowing management of all aspects of the design flow in an integrated fashion. “With R3Logic’s presence in Grenoble and Leti’s leading design-and-process-technology research infrastructure, we have the full range of competencies of the ideal ecosystem working together,” said Laurent Malier, CEO of Leti. “We are confident this joint lab will accelerate the adoption of 3D-IC technologies by the semiconductor industry, which will better align its fabrication process, and by the mobile- and consumer-device industries, which will develop more-competitive products.”
“Being closer to world-leading design and technology teams will allow us to accelerate the adoption of our EDA tools,” said Lisa McIlrath, CEO of R3Logic, which opened an R&D centre in Grenoble last year. “We are collaborating with Leti for three reasons: their research and technology expertise will help us accelerate development of our tools, their business model allows us to better protect our IP, and finally, their immersion in a complete ecosystem that concentrates in the same region the full spectrum from R&D in advanced concepts to major global providers of mobile and consumer applications.”
As a major player in the MINATEC excellence centre, Leti operates 8,000-m² state-of-the-art clean rooms, on a 24/7 schedule, on 200mm and 300mm wafer standards. With 1,200 employees, Leti trains more than 150 Ph.D. students and hosts 200 assignees from partner companies and owns more than 1,400 patent families.  R3Logic, founded in 2000 in Massachusetts, specializes in the design of 3D integrated circuits and has developed a unique set of patented EDA tools for 3D integrated circuit design. R3Logic has created a new R&D centre in Grenoble, France, to develop and enhance its design tools for 3D heterogeneous system and system-in-package design. This center is part of a newly created French subsidiary, R3Logic-France, which when fully staffed over the next two years will employ over 20 engineers. The centre will also work in close collaboration with STMicroelectronics.

MPEGIF Launches “3D over MPEG” Campaign

The MPEG Industry Forum (MPEGIF) has formed a 3DTV Working Group with a “3D over MPEG” campaign. The new working group and campaign continue MPEGIF’s successful work in furthering the widespread adoption and deployment of MPEG-related standards including MPEG-4 AVC/H.264 video compression technology.

“3DTV is of keen interest to everyone in the video creation and delivery industries. The challenge we all face is that of sorting through the myriad technical options. Our common goal is to create a 3DTV ecosystem that delivers great new experiences to consumers.” says Dr. Sean McCarthy, chair of the newly formed 3DTV Working Group and Fellow of the Technical Staff at Motorola. “The 3DTV Working Group and the ‘3D over MPEG’ campaign are designed to provide focus and clear information to decision makers. 3DTV can be distributed today using MPEG-related standards. Existing broadband and broadcast services and infrastructures are 3D-ready, and ongoing works by standards bodies provide a compelling path for the future evolution of 3DTV.”

The 3DTV Working Group will provide a forum for free exchange of information related to this emerging technology, an industry voice advocating the adoption of standards and for consolidating the overall direction of the 3DTV industry. Its focus and constituency will be derived from video service providers, consumer electronics manufacturers, content owners, equipment manufacturers, system integrators, software providers, as well as industry advocacy groups, industry analysts, financial institutions and academic institutes.

“3D video is showing distinct commercial promise in theatrical releases and could thus transition to the advanced living room to follow High Definition and Surround Sound. As a result there is a growing array of competing technologies and work from various standards bodies”, said David Price, Vice President, MPEGIF and Vice President at video compression company Harmonic. “It has therefore become a major theme of the next MPEG Industry Forum Master Class being held at CES 2010 in Las Vegas in January featuring leading executives from HBO, AT&T, Microsoft and other industry luminaries”.