. Custom RISC-V core for AC-DC power controller
. Italian chip for wall socket chargers
. UK to close down 3G to boost Open RAN
. CEO Interview: Nick Russel, Russel Industries
. Expedera raises $18m for edge AI accelerator IP
. Using gait to secure smartphones
. Deals bring PCIe 6.0 and HBM3 to FPGA prototyping for Data Centre and AI chips
. Siemens boosts human centric lighting
. Sensata acquires power measurement chip designer
. Volvo signs deal for battery cell R&D centre
. Microchip teams with Mersen for SiC reference design
. Third generation SiC MOSFETs available as bare die
. Two team for 660kW 1200V SiC intelligent power module
. Swedish carbon fibre heatsink IP for bitcoin cooling
. Plastic 60W DC-DC converter for medical designs
. 13.56MHz wireless power supply chipset provides 1W for smart glasses
. Hybrid polymer capacitors with enhanced ripple current
. Low loss 600V superjunction MOSFETs for server and telecom designs
. UK to close down 3G to boost Open RAN
. CEO Interview: Nick Russel, Russel Industries
. Expedera raises $18m for edge AI accelerator IP
. Using gait to secure smartphones
. Deals bring PCIe 6.0 and HBM3 to FPGA prototyping for Data Centre and AI chips
. Siemens boosts human centric lighting
. Sensata acquires power measurement chip designer
. Volvo signs deal for battery cell R&D centre
. Microchip teams with Mersen for SiC reference design
. Third generation SiC MOSFETs available as bare die
. Two team for 660kW 1200V SiC intelligent power module
. Swedish carbon fibre heatsink IP for bitcoin cooling
. Plastic 60W DC-DC converter for medical designs
. 13.56MHz wireless power supply chipset provides 1W for smart glasses
. Hybrid polymer capacitors with enhanced ripple current
. Low loss 600V superjunction MOSFETs for server and telecom designs
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