By Nick Flaherty
www.flaherty.co.uk
10 Schaeffler is
looking to bring German automotive tier one suppliers Vitesco and Continental back together
in a
deal that simplifies the corporate structure. The two separated two years
ago.
9 GaN Systems
launches its fourth generation GaN power transistors as it becomes part of Infineon Technologies.
8 RISC-V pioneer SiFive
is to lay off around 130
staff, around 20% as it re-align its business in supplying IP to chip designers.
7 European chip designer Tachyum is to build a
supercomputer for a US customer that will be capable of 50 exaFLOP performance using its Prodigy chip that is set to
sample shortly.
6 Mathematics from the 18th
century is showing a way to simpler AI models compared to today’s models
with billions of parameters.
5 SemiDynamics in Spain is showing the
first fully coherent RISC-V Tensor unit for
AI chip design
4, 3 IEDM coverage was also popular in October. Micron showed a DRAM-like non-volatile memory for
AI, while Intel, TSMC both reported on stacked complementary FETs (CFETs) that are expected to be the
successor to gate all around (GAA) devices for sub-1nm process. The conference
also saw a compound semiconductor
design from imec achieving record 1.46THz frequency for 6G
applications.
2 TSMC looks to
standardise chiplet protocols in a move that could shake up the
development of complex chips.
1 Raspberry Pi launched its Pi 5 board with a new architecture
and there are moves to unify the peripheral interfaces with Arduino.
