All the latest quantum computer articles

See the latest stories on quantum computing from eeNews Europe

Sunday, July 24, 2016

Energy harvesting IoT market to break $1.5bn by 2022

The market for energy harvesting devices in the wireless sensor networks is expected to grow 19% a year by 2022 to reach $1576.9m.

By Nick Flaherty

The data comes from a new report from Research & Markets that looks at the different sensor options such as temperature, pressure, flow, level, humidity, position and motion and infrared, as well as the different harvesting technologies such as light, vibration and thermal energy.

Microchip's solar energy harvesting development  kit for wireless sensor nodes in the Internet of Things

All of this is being driven by the demand for safe and durable power sources and the increasing implementation of Internet of Things (IoT) for building automation. The report looks at building & home automation, industrial, transportation infrastructure, railways, aerospace, automotive, and security. The building and home automation segment is expected to hold the leading position by 2022 in the energy harvesting for wireless sensor network market.

You might also like: Microchip adds independent peripherals to PIC32

The growth of the building and home automation application is prominent in North America and Europe owing to the growing adoption of smart homes and also that of energy harvesting systems.

The geographic segmentation categorizes the market on the basis of the main geographic regions into North America, Europe, Asia-Pacific (APAC), and Rest of the World (RoW). North America is expected to hold the leading position by 2022 owing to the growing building automation and smart home market in countries such as the U.S. and Canada. Europe has the second-highest rate of installation of wireless sensor network with energy harvesting systems in new building constructions and for industrial automation.

The report includes coverage of key embedded technology companies such as ABB (Switzerland), Convergence Wireless (U.S.), Cymbet (U.S.), EnOcean (Germany), Fujitsu (Japan), Honeywell (U.S.), Microchip Technology (U.S.), STMicroelectronics (Switzerland), Cypress Semiconductor, Linear Technology (U.S.) and Lord Microstrain (U.S.).

No comments: