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Tuesday, November 06, 2018

Nanominiature contact doubles density and reduces packaging

By Nick Flaherty

TE Connectivity has launched a series of NanoRF modules and contacts that double the density of today’s VITA 67 RF modules for VPX embedded computing applications.

The high frequency nanominiature coax contact is engineered with smaller contacts and a higher RF contact density within a multi-position module. This design enables smaller packaging and saves valuable space. Half-size modules can support up to 12 RF contacts and full-size modules can support 18 contacts or higher, with the option to customise contact count and position.

The blind-mateable, float-mounted backplane contacts support module-to-module or box-to-box architecture. While they are designed for 0.047-inch coax cable, multiple cable types are available to fit the application’s needs. To bring high frequency capability into a high density modular package, the contacts support frequencies up to 70 GHz.

The NanoRF features a floating insert on the backplane side, with guide features to pre-align the array of contacts before they engage. This results in reliable mating and consistent RF performance up to 500 mating cycles.

“NanoRF offers high frequency coax contact density in a rugged modular package, providing reliable RF performance in harsh environments,” said Mike Walmsley, global product manager for TE’s Aerospace, Defense and Marine division. “It has been tested to VITA 72’s high vibration standards and is ready for VPX open architecture under VITA 67.3 — with a roadmap for expansion into other high-density packages.”

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