Record efficiency of 26.81% for large silicon solar cells
Chinese solar cell developer Longi Green Energy Technology is claiming a new record efficiency for its full sized monocrystalline silicon cell …
Leti, Intel look to quadruple hybrid bonding speeds
CEA-Leti in France has been working with Intel on a hybrid die-to-wafer process that could quadruple production speeds for chiplet-based assembly …
Marc Biron, CEO of Melexis talks the chip shortage and the EU Chips Act
Belgian fabless chip maker Melexis has been at the heart of the chip shortage, and sees no sign of it slowing for automotive …
Infineon Technologies is preparing to launch TSMC’s Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology in its next generation of automotive Aurix microcontrollers …
GaN power semiconductor 2023 predictions
€2bn BMW battery plant for Hungary
BMW is building a high-voltage battery assembly in Hungary for its sixth generation battery pack for electric vehicles of…
Researchers at Microsoft have identified vulnerabilities in the software development kits (SDKs) of semiconductors are leaving electricity grids vulnerable to Chinese hackers…
TDK patents thermal sensing for modular 800W power supply
TDK-Lambda in the UK has developed a configurable 800W power supply that is half the size of its previous generation …
First long reach single pair power over ethernet for smart factory automation
Analog Devices has developed the first Single-pair Power over Ethernet (SPoE) Power Sourcing Equipment…
ABB E-mobility raises $200m as $2.5bn spinout delayed
IGBT module boost for 352kW solar inverters
Infineon Technologies has developed a single IGBT power module for 1500V inverters …
Compact industrial 15W DC-DC converters in metal cases
Traco Power has launched two isolated DC-DC converters in 16pin DIP metal packages …
ARM-based PDU for data centre power management
nVent has developed an ARM-based low profile power distribution unit (PDU) for intelligent control in data centres…
OpenLight launches electronic and photonic PDK
US spinout OpenLight has released its unified process design kit (PDK) for photonics chips ...
Sony aims for lowest power IoT combo chipset
Sony Semiconductor Israel has launched a chipset for massive IoT networks with 5G, satellite and LPWAN connectivity …
Infineon, Fingerprints team for biometric payment cards
Infineon Technologies has signed a key development and commercialization deal with Swedish biometric card supplier Fingerprints …
A Novel Approach to Reuse Firmware for Verification of Controller based Sub-Systems using PSS
Researchers from Samsung Semiconductors in India and Korea demonstrate a novel approach to minimize the development time for complex blocks
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