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Wednesday, March 16, 2011

Chipworks reverse engineers the Apple A5 processor

By Nick Flaherty www.flaherty.co.uk

Chipworks has reversed engineered the Apple A5 processor used in the iPad2. 
They decapsulated the A5 a couple of days ago, but as you could see in those early pictures, you can’t tell much of a chip’s layout from the top metal – it’s all power and ground buses.  So they had to de-layer the chip down to a level to see the block layout of the chip; not an easy thing when there’s nine layers of metal!  In fact, these days it’s easier to go in from the back and remove the substrate silicon, and look at the gate level from below.  Then they identify the circuit blocks that make up the full device.
For the A5, a dual ARM core processor:
Apple A5 Polysilicon Die Photo with Annotations
Apple A5 Polysilicon Die Photo with Annotations
The ARM cores are in the right half of the die, with ~4.5 Mb of cache memory each.  You can also see the USB interface at the top, and the DDR SDRAM interfaces at the bottom right, for the memory in the top part of the package-on-package.  Other I/O blocks are strewn around the edge of the die.
It seems likely that Apple will actually be shipping TSMC-made parts later this year, since Samsung is a competitor with its Galaxy tablet series, but the current devices are made by Samsung, as shown by a cross section of the chip:

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Tuesday, March 15, 2011

Microcameras become disposable

By Nick Flaherty www.flaherty.co.uk

Researchers at the Fraunhofer Institute in Germany have developed a microcamera that is as small as a grain of salt and cheap enough to be disposable, opening up opportunities in medical and automotive applications.
Endoscopy has gone through amazing advancements in recent years. Microcameras on the tip of endoscopes supply images from the inside of the human body in ever higher resolution, which often makes it possible to identify tumors at an early stage. Endoscopes though have some downsides, since they are expensive and, because of their multiple usages, have to be put through time-consuming and exhaustive cleaning procedures every time they are used. 
This problem might be solved by the new microcamera that the Fraunhofer Institute for Reliability and Microintegration (IZM) in Berlin, Germany has developed together with Awaiba and with the support of the Fraunhofer Institute for Applied Optics and Precision Engineering IOF in Jena, Germany. 
“We can produce microcameras so inexpensively with our technology that doctors can dispose of endoscopes after using them only once,” said Martin Wilke, a scientist at the Fraunhofer Institute for Reliability and Microintegration. This is made possible by a new type of manufacturing process.
Digital camera systems consist of two components: a lens and a sensor that transforms the image into electrical signals. Electrical contacts on the sensor allow access to these signals and therefore also to the information of the image. Due to the way they are manufactured, these contacts are located between the sensor and the lens. The sensors are manufactured simultaneously in large numbers, like computer chips.
“You have to think of a book full of postage stamps where many thousand stamps are printed in one step," said Wilke. "If you want to use them, you have to separate one from another. Instead of a sheet of paper, with image sensors you have a circular disc of silicon that is known as a wafer.” 
About 28,000 image sensors fit onto one wafer and until recently, each and every one was sawed out, wired and mounted on the lens that was still missing. That means wiring them 28,000 times and mounting them just as often.
The researchers have streamlined this process by developing a new way to access the electrical contacts. Now, the wiring process is faster and the entire camera system is smaller. The trick lies in the fact that they do not reach the contacts of each individual image sensor via the side any more but rather, simultaneously, with all sensors via their reverse side while they are still connected as a wafer. 
That means that you no longer have to mount the individual lenses. Instead, you can connect them with the image sensor wafers as lens wafers. Only then is the stack of wafers sawed apart into individual microcameras. 
Another upside is the fact that it supplies razor-sharp pictures even with very thin endoscopes. To date, the camera systems built into them had to be divided because of their size. The lens was at the tip of the endoscope and the sensor at the other end of the glass fiber strand. The new microcamera is small enough for the tip of the endoscope. It has a resolution of 62,500 pixels and transmits the image information through the endoscope via an electrical cable and measures 1mm x 1mm x1mm.
It is not only medical technology, but also the automotive industry that is interested in this tiny camera. Presently, they are researching the possibility of replacing outside rearview mirrors on cars with microcameras. This would reduce flow resistance and energy consumption. Beyond this, installed in fittings, this camera would be able to calculate the driver’s eye movements and prevent him from nodding off for a few seconds. “Starting in 2012, using Fraunhofer’s expertise, we will be able to bring disposable endoscopes to market for only a few euros – we already have the prototype,” said Stephan Voltz, CEO of Awaiba.
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Monday, March 07, 2011

Xilinx looks to 400Gbit/s network development

Virtex-6 HXT FPGA Platform Eases 100G Development and looks beyond

By Nick Flaherty www.flaherty.co.uk

In a stunning move, programmable chip maker Xilinx is looking at the development for 400Gbit/s systems with its latest generation of FPGAs, citing the rapid growth of video sharing and internet mobile platforms over both wireless and wired networks is driving insatiable demand for bandwidth. 
It has launched an Optical Transport Network (OTN) Targeted Design Platform for supporting faster market implementation of 100G line cards and demonstrating the key technology for a smooth path to the development of future 400G line cards based on its Virtex-6 HXT FPGA and says network operators and service providers are quickly pursuing 100G adoption and looking for next generation platform 400G line cards.
System architects can use the OTN platform to quickly demonstrate and evaluate the flexibility, high-end performance and integration capabilities of Xilinx FPGAs for 100G OTN applications. They can later smoothly migrate their designs to the Virtex-7 HT FPGA family to evolve to 400G line card applications.
"In order for the communications industry to effectively answer the insatiable demand for bandwidth, optical communications equipment vendors must deliver more rapidly and more effectively the necessary levels of flexibility, integration and performance without raising power consumption or costs into their optical platforms," said Krishna Rangasayee, Corporate Vice President and General Manager of Xilinx's Communications Business Unit. "As part of Xilinx's recent acquisition of Omiino, we have created a new OTN Solution Delivery Centre that will include all of Omiino's deep OTN expertise plus their existing portfolio of OTN solutions and OTN development platforms to give our customers the most optimized and cost effective solution for their systems."
Xilinx claims to have the only FPGA on the market with 10 Gbps optical jitter compliant receivers, giving the OTN Targeted Design Platform pre-defined and implemented reference designs for different OTN solutions, such as 100G ODU switching, 100G Ethernet to OTU4 transponders and 10x10 to OTU4 transponders. The OTN platform also includes integrated features for ease-of-use, such as highly optimized IP 100G MuxSAR solution developed by Omiino.
The OTN Targeted Design Platform is also using OTN IP cores from Xilinx Alliance Program Members. The OTN Targeted Design Platform is also interoperable with optical module vendors, such as Avago Technologies, and optical tester vendor, such as JDS Uniphase Corp.
"OTN is surging in popularity, and is replacing the role held by SONET/SDH as networks transition to 40G and 100G," said Andrew Schmitt, Directing Analyst for Optical at Infonetics. "Equipment manufacturers seek flexible approaches to implementing hardware in a rapidly changing and growing market, and are looking towards soft solutions such as the OTN IP that are now part of Xilinx's library of communications IP."
Virtex-6 HXT
System bandwidth needs continue to evolve and further optical system density is required for the move to 400G slots that will sustain infrastructure growth over existing networks. Designers using 40nm Virtex-6 HXT FPGA OTN solutions to meet 100G challenges today will be able to migrate their designs in the future to the 28nm Virtex-7 HT family to meet impending 400G demands. This portability is largely due to the unified architecture between Virtex-6 and Virtex-7 devices, which offer the only 28 Gbps optical jitter compliant FPGA transceivers to connect to CFP2 modules -- up to sixteen 28 Gbps transceivers and seventy-two 13.1 Gbps transceivers to connect up to four next generation CFP2 optical modules (4x100G).
Virtex-6 HXT FPGAs offer both 6.6Gbps GTX transceivers and 11.18 Gbps GTH transceivers to enable next-generation packet and transport, switch fabric, video switching and imaging equipment. The devices are built on 40nm process using a third-generation FPGA architecture at a 1.0v core voltage with an available 0.9v low-power option.
Virtex-7 HT
Built with four to sixteen 28 Gbps transceivers complying with OIF CEI-28G, the Optical Internetworking Forum's Common Electrical I/O specification for 28 Gbps, Virtex-7 HT devices are designed to interface to next generation CFP2 and QSFP2 optical modules that will be used in next generation 100 – 400G system line cards. The devices also have up to seventy-two 13.1 Gbps transceivers and can offer up to 2.8 Tbps full duplex throughput.

Pricing and Availability
The Virtex-6 HXT FPGA OTN Kit is $25,000 without optical modules and is available for order in April 2011.
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Hard drive market consolidation continues as Western Digital acquires Hitachi GST in $4.3bn deal

Deal creates drive giant

By Nick Flaherty www.flaherty.co.uk

Western Digital is to acquire Hitachi Global Storage Technologies (Hitachi GST), a wholly-owned subsidiary of Hitachi, for approximately $4.3 billion. The deal creates a global giant that will outship the current #1 supplier, Seagate.

Apparently WD tried to buy Seagate late last year for a rumoured bid above $8bn while Seagate was in negotiation to sell to a private equity firm. The Hitachi deal gives WD the scale it need to compete and be sustainably profitable. The next challenge is managing the transition to Solid State Drives.     
"The acquisition of Hitachi GST is a unique opportunity for WD to create further value for our customers, stockholders, employees, suppliers and the communities in which we operate," said John Coyne, president and chief executive officer of WD. "We believe this step will result in several key benefits-enhanced R&D capabilities, innovation and expansion of a rich product portfolio, comprehensive market coverage and scale that will enhance our cost structure and ability to compete in a dynamic marketplace. The skills and contributions of both workforces were key considerations in assessing this compelling opportunity. We will be relying on the proven integration capabilities of both companies to assure the ongoing satisfaction of our customers and to bring this combination to successful fruition." 

"This brings together two industry leaders with consistent track records of strong execution and industry outperformance," said Steve Milligan, president and chief executive officer, Hitachi Global Storage Technologies. "Together we can provide customers worldwide with the industry's most compelling and diverse set of products and services, from innovative personal storage to solid state drives for the enterprise."

Hiroaki Nakanishi, president, Hitachi, Ltd. said, "As the former CEO of Hitachi GST, I always believed in the potential of Hitachi GST to become a larger and more agile company. This is a strategic combination of two industry leaders, both growing and profitable. It provides an opportunity for the new company to increase customer and shareholder value and expand into new markets. Additionally, it is important to us that WD shares common values with Hitachi GST to create a more global company that is well positioned to define a broader role in the evolving storage industry."

Deal details:
WD will acquire Hitachi GST for $3.5 billion in cash and 25 million WD common shares valued at $750 million, based on a WD closing stock price of $30.01 as of March 4, 2011. Hitachi will own approximately ten percent of Western Digital shares and two representatives of Hitachi will be added to the WD board of directors at closing. The transaction has been approved by the board of directors of each company and is expected to close during the third calendar quarter of 2011. WD plans to fund the transaction with a combination of existing cash and total debt of approximately $2.5 billion.

The resulting company will retain the Western Digital name and remain headquartered in Irvine, California. John Coyne will remain chief executive officer of WD, Tim Leyden chief operating officer and Wolfgang Nickl chief financial officer. Steve Milligan, president and chief executive officer of Hitachi GST, will join WD at closing as president, reporting to John Coyne.
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Friday, March 04, 2011

Processing demand skyrocket as Wind River releases 64bit VxWorks

Improves multicore support for ARM and gives exclusive Intel primitives

By Nick Flaherty www.flaherty.co.uk

In a sign that 64bit processing is more clearly needed in embedded designs, Wind River has launched a 64bit version of its VxWorks real time operating system (RTOS).

Version 6.9 (although suprisingly this isn't VxWork7.0) is one of the first commercial RTOSes delivering 64bit computing support and includes improved multi-core processing support. 

“The embedded market is facing skyrocketing demands for processing performance as systems become ever more complex and increasingly connected. The sheer amount of compute power, memory and data required for embedded applications continues to climb exponentially,” said Warren Kurisu, vice president of VxWorks product management at Wind River. “By providing 64bit computing capability, Wind River addresses the high-performance needs of our embedded market. VxWorks continues to be an innovation leader that delivers vital solutions to our customers.”

VxWorks now delivers 64bit support both in data and code execution that was once the sole domain of supercomputer and server markets. For telecommunications network infrastructure equipment manufacturers, 64bit computing is critical in keeping up with the stresses of increasingly exploding data. Other vertical industries are also demanding 64bit support, for example, for industrial and medical applications such as high-definition imagery, and aerospace and defense applications such as highly complex radar, sonar and sensors. Companies already running VxWorks can rapidly transition to 64bit computing with ease.

The latest VxWorks delivers greater multi-core processing performance in both symmetric multiprocessing (SMP) and asymmetrical multiprocessing (AMP) configurations. VxWorks platforms now bundle the Intel optimizing C++ compiler and the Intel Performance Primitives (IPP) library for Intel architectures only. This version of VxWorks now includes support for the ARM Cortex A9 processor, with a multi-core SMP and ARM Thumb-2 instruction set. This VxWorks release also provides enhanced networking capabilities, including new security features and increased Internet Engineering Task Force Request for Comments (IETF RFC) support. Additionally, software development on VxWorks continues to be enabled by the Wind River Workbench development tools suite.
The latest version of VxWorks will be available this month.

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Freescale Power Architecture microcontrollers for industrial market mark the end of ColdFire

By Nick Flaherty www.flaherty.co.uk

Freescale Semiconductor is moving its Power Architecture into microcontrollers that effectively marks the end of the ColdFire range for new designs.
The PX series of MCUs is based on Freescale’s e200 Power Architecture cores and is designed to meet the needs of the most complex industrial control applications, including motion control, power generation, clinical medical, aerospace and defence, motor drives, renewable energy, robotics and more.
“This addition to our industrial MCU portfolio is significant because the industrial electronics market can truly benefit from the capabilities of Power Architecture technology,” said Reza Kazerounian, senior vice president and general manager of Freescale’s Microcontroller Solutions Group. “The PX series of Power Architecture MCUs brings unparalleled performance to a broad range of industrial applications and provides the advanced technology and enablement our customers need for their industrial designs.”
The embedded safety architecture in the PX series of Power Architecture MCUs helps developers meet the safety, reliability and environmental requirements of industrial control applications. Integrated features simplify safety approvals for IEC61511 and IEC 61508 (SIL3), FAA DO-178B Level A and FDA Class II to III.
The single-core performance is up to 600 DMIPS, with multicore options and up to 4 MB of embedded flash memory make the PX series ideal for motion control and other complex, real-time control applications. A single chip can control up to six motors, process complex math algorithms and manage more than the typical three communications connections.
Freescale is also providing run-time software, reference designs and tools for rapid prototyping, advanced debug and system modelling. Customers can lower start-up costs by using Freescale run-time software, such as the free MQX RTOS, DSP and motor control libraries and Swell PEG (portable embedded GUI) development suite. Additionally, Freescale Power Architecture MCUs are supported by tools and the safety-certified INTEGRITY RTOS from Green Hills.
Freescale also offers tools for rapid prototyping with the PX series, including:
  • Modular Tower System hardware development platform with QuickStart code initialisation 
  • RAppID Toolbox with links to the MathWorks Simulink environment 
  • FreeMASTER debug GUI 
All families in the PX series are included in the Freescale product longevity program which ensures a minimum of 10 years of device availability (15 years for medical and automotive devices), providing peace of mind for the embedded designer. For more information, go to www.freescale.com/PXseries.





Related articles
Freescale Files for $1.15 Billion IPO (voices.allthingsd.com)
Freescale introduces intelligent sensor for car battery monitoring (physorg.com)
Freescale Boosts Share Of Tablet Processor Market (informationweek.com)


Tuesday, February 15, 2011

Problem hits Freescale Kinetis K60 family

By Nick Flaherty www.flaherty.co.uk

Development tool vendor IAR is warning that users can accidently, and permanently, lock up Freescale's Kinetis K60 microcontroller family. Chris Hills, Technical Director of Paedrus Systems, points to the IAR advisory note and says that a problem could be caused if the default linker configuration file was used and the code reached address 0x40C as Freescale have used that address for the NVFSEC register. Within the register two bits control the mass erase function and two more control flash security. If they are used in conjunction then the device can permanently and irreversibly lock, says Hills.
With the KickStart Kit, the default linker configuration file is "generic_cortex.icf", which ignores the Freescale idiosyncrasy. The kit also includes a device-specific file, K60X_Flash.icf, which can easily be selected, so it's only something that would happen by accident.




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ARM's Broadcom deal is bigger than Microsoft

BROADCOM AND ARM EXTEND RELATIONSHIP WITH STRATEGIC LICENSING AGREEMENT

By Nick Flaherty www.flaherty.co.uk

Broadcom has taken a broad license to all ARM's processor cores in a move that is fundamentally more important for the embedded market than the recent Microsoft announcement.

Broadcom now has access the entire range of ARM processors, from the smallest, lowest-power ARM CortexTM-M0 processor, through to the newly introduced, high-performance Cortex-A15 application processor and beyond. As Broadcom is pushing the system-on-chip approach strongly into the embedded market, this will see a lot more 32bit ARM cores in designs that traditionally used 16bit processors, as well as high end smartphone chips to take on Qualcomm and in highly integrated networking devices.
As part of the agreement Broadcom has access to both current and future ARM processors to use across product lines. This includes the Cortex-A15 processor for use in high performance mobile and networking applications, the specialized security hardened SC000 processor core for security applications, and the newly announced Cortex-R5 and Cortex-R7 processors for high performance real-time applications.
“ARM’s wide portfolio of cores enhances Broadcom’s strategy of designing cost- optimized high performance solutions for a wide range of applications from Bluetooth headsets to high-end application processors for tablets,” said Scott McGregor, President and CEO of Broadcom. “Broadcom and ARM have already established a successful partnership in smartphones and other exciting mobile devices. Today’s agreement will help expand that success into many new and exciting high-growth opportunities.”
 “The growing partnership with Broadcom brings new opportunities” said Warren East, CEO, ARM. “Broadcom’s strength across diverse markets and their expertise in highly integrated systems brings a breadth of knowledge to the ARM Partnership. Our expanded relationship shows the universal benefits that scalable, low-power ARM IP can bring to market leading solutions across a wide range of end devices and equipment.”
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Tuesday, February 01, 2011

Toumaz launches ultra-low power self-powered radio chip

1V ‘TELRAN’ TZ1053 aimed at wireless sensor networks, environmental monitoring and smart metering in the sub-1GHz ISM band

By Nick Flaherty www.flaherty.co.uk


Toumaz Technology has launched an ultra-low power radio chip aimed at wireless sensors in environmental and medical systems that can use solar or energy harvesting systems and so be self-powered. The chip can be used both for the sensor and in the hub that collects the data.
Toumaz has rejected using existing standards such as Zigbee and Low Energy Bluetooth and developed its own protocol to provide continuous power of under 3mW in the Industrial, Scientific and Medical bands under 1GHz .
"Bluetooth at 2.4GHz suffers from interference from Wifi and microwaves while we do not need the mesh capabilities of Zigbee and the ISM band gives us more range" said Paul Paddan, Head of Toumaz’s Low Power Radio Business Unit.  
Padden had already developed ultra low power systems for Toumaz' Sensium wireless 'plasters' that are undergoing clinical trials, and is extending the design ideas to other  industrial and medical areas.
The system-on-chip is built on Toumaz’s proprietary AMx Mixed Signal technology and includes an 8051 processor to make it easy to use and runs at 1V using a single button cell battery and consumes less than 3mW continuous use power consumption. "This is the worst case performance and with a duty cycle it is considerably better," said Padden.
“With this important addition to our ‘Connected Consumer’ portfolio, we are harnessing our strengths in ultra-low energy wireless healthcare to create solutions for high-volume consumer markets," said Professor Chris Toumazou, founder of Toumaz and now CEO after the departure of co-founder Keith errery. "TELRAN is uniquely placed to support the development of a range of new ultra-low energy wireless applications, and we are very excited by the product opportunities that we will be enabling for our customers with today’s launch.”
The TELRAN contains an enhanced 8051 running Toumaz’s Nanopower Sensor Protocol (NSP) allowing developers to program and control the TELRAN device easily with high level commands either over a standard interface eg UART or “over the air”. Target applications include the development of two-way communication remote controls for consumer electronic devices; wireless sensor networks based on TELRAN sensor nodes and basestations; environment monitoring and room temperature control; remote controls and toys/games; and smart metering, using TELRAN wireless sensor networks to connect multiple meters for the two-way transmission of status data and firmware upgrades.

Highlight features of the TELRAN IC include:
  • Fully integrated SoC comprising transceiver, baseband, embedded microprocessor and control logic
  • Ease of development – no compilers or specialist programming investment required
  • Simple over-the-air programming and reconfiguration
  • Quick and efficient customisation using application profiles
  • Support for networking and communication modes including P2P (Point to Point), star network (up to 8 sensor nodes) and basestation-to-basestation communication
  • Data rate of 50 kbps with a range greater than 100m line of sight using a high gain antenna, or 20m from a PCB or chip antenna in a body-worn environment.
  • Ability to directly connect SPI/I2C sensors

TELRAN TZ1053 devices will be available worldwide as engineering samples from the end of February 2011, with production devices in full availability from June 2011. A TELRAN developer kit will also be available at the end of February. The TELRAN Development Kit (TDK) includes a USB TELRAN basestation, TELRAN RF module and an accelerometer sensor board with demo and PC application. The TELRAN RF module (TZ1053RFM) is also available to customers for fast prototyping and production.

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Monday, January 10, 2011

Conexant sold off to SMSC

Creates group with 900 mixed signal engineers
By Nick Flaherty www.flaherty.co.uk


How are the mighty fallen. The once powerful embedded chip maker Conexant Systems - spin off of Rockwell and dominant supplier of modem chips - is to be sold off to up and coming chip maker SMSC of New York.
Conexant leaves the industry with a string of legacies through a number of spin offs, from foundry Jazz to telecom chip maker MindSpeed, but the core of chips for imaging, audio, embedded modem, and video surveillance applications will go to to SMSC in a deal valued at approximately $284 million including the assumption of Conexant’s net debt. The transaction has been approved by the boards of directors of both companies.
The company had been selling off parts of the business for several years, and last month sold property next to its Newport Beach, California, headquarters for $23m

Combined Company Highlights:
  • Creates a stronger analogue/mixed-signal R&D team with over 900 engineers globally,
  • Complementary connectivity product portfolios to target more expansive set of computing, consumer, industrial and automotive applications,
  • Serves key customers with more complete product solutions,
  • Combined company has the scale and resources to enhance SMSC’s finances with a combined revenue of $632m,
  • Anticipated cost cutting of $8 to $10m by the end of SMSC’s fourth quarter
The combination of Conexant’s imaging, audio, embedded modem and video products with SMSC’s broad connectivity solutions targeting the computing, consumer, industrial and automotive markets provides for a highly complementary merger of talent and technology. Conexant has approximately 600 employees worldwide, including over 230 in Asia.
“We believe that combining the growth potential of Conexant and SMSC will allow us to leverage complementary technology and engineering resources to provide our customers with expanded solutions in connectivity and content,” said Christine King, President & Chief Executive Officer of SMSC. “We plan to focus our resources on the areas of highest return and believe that our respective sales and supply chain relationships will help create a platform to grow our businesses. In addition, we expect to capture significant operating efficiencies that will position us to increase earnings growth. SMSC’s larger scale should position us to increase our R&D productivity and drive profitability and shareholder value.”
“In our industry, size and scope provide a significant advantage with customers and suppliers," said Scott Mercer, Conexant's Chairman and Chief Executive Officer. "SMSC and Conexant share similar core competencies in analog and mixed-signal design, possess complementary product portfolios, and count many customers in common. By joining forces, we get the opportunity to take advantage of economies of scale and drive profitable growth."
Sailesh Chittipeddi, currently President & Chief Operating Officer at Conexant, will join SMSC upon close of the acquisition as Executive Vice President, reporting to Christine King. Mr. Chittipeddi’s responsibilities will include all product lines and global marketing and engineering functions for SMSC.

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Friday, January 07, 2011

IPv6 provides path to secure deployment of next-generation Internet - uptake data

By Nick Flaherty www.flaherty.co.uk

Researchers at the National Institute of Standards and Technology (NIST) have issued a guide for managers, network engineers, transition teams and others to help them deploy the next generation Internet Protocol (IPv6) securely.
This is vital for the next generation of embedded devices as it provides a wider range of addresses and more security, but uptake has been slow - see graph


You can also go to http://v6asns.ripe.net/ and choose the list of countries you are interested in for the uptake data updated regularly.

Guidelines for the Secure Deployment of IPv6 (NIST Special Publication 800-119), describes the features of IPv6 and the possible related security impacts, provides a comprehensive survey of mechanisms to deploy IPv6 and suggests a deployment strategy for a secure IPv6 environment.
The ballooning popularity of devices, such as smart phones and netbooks, tied to the Internet is rapidly depleting the number of so-called IP addresses available under the current Internet Protocol version 4 (IPv4), so the networkers of the world are preparing to move to the next generation, IPv6. Among other improvements, IPv6 has a vastly greater number of potential addresses—several billion per each of the world's current population of about 6.9 billion people.
To ensure that the US government is prepared for IPv6, the Office of Management and Budget has mandated federal agencies to begin deploying the new protocol. NIST developed the IPv6 security guidelines in support of the Federal Information Security Management Act (FISMA). The publication is designed to help federal agencies avoid possible security risks that could occur during IPv6 deployment. It also could be useful for the private sector and other organizations.
"The Internet protocol pervades every aspect of computer communications," explains lead author Sheila Frankel, "so deploying IPv6 is a major task." With detailed planning, she says, organizations can navigate the process smoothly and securely. Most organizations will be operating IPv6 and IPv4 concurrently.
"Security will be a challenge, however, because organizations will be running two protocols and that increases complexity, which in turn increases security challenges," Frankel says. SP 800-119 describes the security challenges organizations may face as they deploy IPv6. Those challenges include fending off attackers that have more experience than an organization in the early stages of IPv6 deployment and the difficulty of detecting unknown or unauthorized IPv6 assets on existing IPv4 production networks. The publication provides information to be considered during the deployment planning process and makes recommendations to mitigate IPv6 threats.
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Thursday, January 06, 2011

Qualcomm's acquisition of Atheros key to Connected Home says iSuppli

Key to combat Broadcom 

By Nick Flaherty www.flaherty.co.uk

Qualcomm’s planned acquisition of Atheros Communications will position the combined companies to take on rival Broadcom in the burgeoning consumer electronics market for wireless connectivity semiconductors, according to market researchers iSuppli.
Qualcomm today confirmed it will buy Atheros in a deal estimated to be worth about $3.1 billion. Qualcomm is the world’s largest supplier of semiconductors for wireless products, accounting for an estimated 22.4 percent of global wireless semiconductor market revenue in the fourth quarter of 2010. Atheros ranks 12th in the market with an estimated share of 2.2 percent.

“With Atheros adding only 2.2 percentage points to Qualcomm’s portion of the wireless market, this acquisition is clearly not a market share play for Qualcomm. Rather, it’s a pure strategic play, designed to bolster its position in the fast-growing wireless connectivity space now dominated by Broadcom,” said Francis Sideco, principal analyst, wireless communications for iSuppli.
Atheros’ main allure is its global leadership in low-power semiconductor solutions that support the 802.11n high-throughput wireless local area network (WLAN) standard, a type of Wi-Fi technology suitable for the transfer of bandwidth-intensive data such as video.
After several quarters of effort, Atheros has experienced limited success selling its 802.11n semiconductors in the cell phone market. iSuppli’s Teardown Analysis service has identified Atheros chips in smart phones such as Samsung’s Galaxy 5 and Sony Ericsson’s XPERIA X10. But the company has enjoyed greater success in non-cell-phone products, with design wins in products including Apple’s iMac line, Hewlett-Packard’s Pavilion PC family, Acer’s Aspire PC line, the third-generation Amazon Kindle and Microsoft’s Zune MP3 player. Furthermore, Atheros has achieved strong design wins in home networking routers, positioning it for success in the connected home segment.
“While Qualcomm already has its own Wi-Fi technology, this deal bolsters its design capabilities and opens up more opportunities in non-handset devices such as tablets and consumer electronics devices, particularly those in the connected home,” Sideco said.
Broadcom currently dominates the market for wireless connectivity semiconductors for consumer electronics, the so-called connected home area. This represents a booming segment of the wireless semiconductor business, with shipments of video-oriented consumer electronics devices equipped with high-bandwidth wireless solutions expected to grow to more than 85.2 million units by 2014, up from 606,000 units in 2009.
“Connectivity has arrived on the consumer electronics market in a big way—and no semiconductor supplier can seriously tackle this market without extensive system-on-chip (SOC) design capabilities, including a vast portfolio of intellectual property,” said Lee Ratliff, senior analyst, broadband and digital home, for iSuppli. “Broadcom is the gold standard in this area—the king of the SOC solution. With the acquisition of the Atheros portfolio, Qualcomm now is better positioned to offer SOCs that can compete with Broadcom’s offerings for a slice of the connected consumer electronics market.”
Ratliff noted that Qualcomm is not alone in its efforts to position itself against Broadcom in this critical area. Other semiconductor suppliers eying the connected home market include Marvell Technology, Ralink Technology and Zoran.
Some of the most attractive opportunities for connected home products are televisions and set-top boxes.
The acquisition of Atheros’ technology also could help Qualcomm to simultaneously defend against and attack Broadcom in its core business in cell phone semiconductors.
“Broadcom has enjoyed major success with its connectivity solutions in cell phones, most notably the main WLAN slot in the iPhone,” Sideco observed. “iSuppli believes it is only a matter of time before an EvDO and/or LTE iPhone will be introduced. It is essential that Qualcomm be part of the baseband picture for those types of phones due to its virtual lock on the EvDO market. Because of this, the company could be trying to expand its footprint by winning this slot from Broadcom.”
Meanwhile, the Atheros acquisition will help Qualcomm address the fast-growing market for tablets.
“Only some tablets will have the kind of 3G or 4G connectivity that requires Qualcomm’s silicon,” Sideco said. “However, all tablets will have the kind of Wi-Fi capabilities that can be supported by Atheros. This acquisition will ensure that Qualcomm has an opportunity to sell its chips into all tablets, whether they are 3G, 4G or Wi-Fi/Bluetooth.”
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Wednesday, January 05, 2011

Embedded market research consolidation continues as NPD buys In-Stat

By Nick Flaherty www.flaherty.co.uk


Market research is an important tool in the development of embedded systems, and the firms that provide such data are seeing a key consolidation into just two large and relatively unknown conglomerates. This has happened before, with the Gartner Group taking over Dataquest in 1995, with the resulting loss of key semiconductor research and loss of confidence in the quality of the data and understanding of the embedded industry.
Now the NPD group is taking over In-Stat, joining it with screen hardware data supplier DisplayScreen purchased in 2005. “In-Stat will be a strategic addition to the NPD family of analyst businesses,” said Tim Bush, General Manager of The NPD Group’s Analyst Services, into which In-Stat will report. “By combining information and services from DisplaySearch and In-Stat, we will be able to offer the industry a complete view of the digital world, including analysis of how digital content is affecting the evolving hardware market.” 
Mark Kirstein, CEO of In-Stat sees it positively of course: “We are delighted to become a part of The NPD Group family. As part of The NPD Group’s Analyst Services we will be better able to serve our clients on a global basis, as well as leverage NPD’s complementary market information and scale.”
This mirrors the recent deals by IHS taking over supply chain researchers iSuppli and screen content data supplier Screen Digest last year.

IHS and NPD are relatively unknown in the embedded industry, unlike iSuppli, In-Stat, Screen Digest and DisplayScreen, and while all the organisations are keeping their own identity at the moment, the tendency, as shown by Gartner, is to combine them into a wider group.  
NPD supplies data to a bewildering selection of industries, including automotive, beauty, commercial technology, consumer technology, entertainment, fashion, food and beverage, foodservice, home, office supplies, software, sports, toys, and wireless. The specialist electronics skills of In-Stat are likely to become lost in this wide range, which would be a great shame.


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USB3.0 drives the 'zero client' computer with no internal processing power - CES

New Approach to Computing Powered by USB 3.0 at CES 2011
By Nick Flaherty www.flaherty.co.uk

The rise of the high speed USB3.0 technology, particularly the optical version, is leading to a renaissance in the thin client, driving the idea of the 'zero client', says VIA Labs.


The Zero Client concept is an evolution of the Thin Client computing model that takes Shared-Resource Computing to the next level with no independent hardware processing facilities. Through multiple zero clients, many users can be simultaneously connected to a single server, leveraging the abundant computing power and flexibility provided by today’s mainstream systems. In contemporary zero client implementations, the end user experience is often bandwidth dependant since each Zero Client requires video, audio, and data connections.
Before the speed and flexibility of USB 3.0, Zero Clients utilized USB 2.0 or Ethernet, and frequently offered inferior multimedia capabilities and a degraded user experience. VIA Labs is demonstrating a zero client based on the new USB 3.0 standard which offers massive bandwidth capacity with its portfolio of USB 3.0 Superspeed controllers where several client terminals can now simultaneously enjoy a full user experience including HD multimedia, using the optical version to get the distance to the terminal previously provided by Ethernet.
“The zero client concept exemplifies the benefits that higher bandwidth USB 3.0 technologies can offer,” said Gibson Chen, Vice President of Sales at VIA Labs. “USB 3.0 based zero clients can enjoy a full and immersive PC experience simultaneously across several client stations thanks to the far greater data throughput that our leading USB 3.0 controllers offer.”
VIA labs is the only company in the world to have a complete USB 3.0 solution with host, hub and device controller products that are quickly setting industry standards. With an emphasis on delivering leading bandwidth performance while also pursing aggressive power-savings, VIA Labs is paving the way forward for new applications and devices in the broader electronics industry.
Complying with USB 3.0, USB Battery Charging, and eXtensible Host Controller Interface specifications (xHCI) the VIA VL800 offers four downstream facing ports that enable the simultaneous operation of multiple peripheral devices and includes USB Battery charging support to rapidly charge smart phones, tablets, and other compatible devices.
The industry’s first USB 3.0 hub controller, the VIA VL810 is a highly integrated, single chip solution provides maximum data transfer rates of up to 5Gbps, or ten times the throughput available to USB 2.0 based devices. Enables up to four USB devices to be connected to a single downstream port of a host or hub.
The VIA VL700 USB 3.0 to SATA Controller is a highly integrated single chip solution that allows users to connect any SATA hard disk drive (HDD), solid state drive (SSD), and optical disc drive (ODD) devices to their PC over USB 3.0. Details can be found here: http://www.via-labs.com/en/products/vl700/index.jsp
The VIA VL750 USB 3.0 to NAND Flash Controller is the first of its kind in the world, featuring a 4-channel memory controller with interleaving support, the VIA VL750 offers consumers blisteringly fast data transfer speeds of 100MB/s or more on larger capacity ‘thumb’ drives and USB sticks.

Related articles
CES: USB 3.0 facing slow take-up from manufacturers (v3.co.uk)
USB 3.0: Everything You Need to Know (itexpertvoice.com)
You: Intel Confirms USB 3.0 on Chief River Notebook Platform (everythingusb.com)
USB-IF Announces Second Certified USB 3.0 Host Controller (eon.businesswire.com)
USB 3.0 Support in Windows 7 (devcurry.com)
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Monday, January 03, 2011

VIA Launches Embedded Industry’s First Dedicated Graphics Card with 3D and DDR3

By Nick Flaherty www.flaherty.co.uk


VIA eH1 card offers DX10.1 graphics and multi-screen HD video content for embedded systems

 VIA Technologies has developed a graphics card designed specifically for the embedded market. The eH1 is a DX10.1 compliant, multi-display card for the PCI Express slot that comes with the three year product longevity guarantee that is vital for embedded designs and is the most power-efficient discrete graphics and video solution on the market today. The VIA eH1 AIB uses the 64bit S3 Chrome 5400E GPU graphics chip for DirectX 10.1, OpenGL 3.1, OpenGL ES 2.0  and offers multi-stream 1080p HD video decoding and Stereoscopic 3D rendering capability alongside 512Mbytes of DDR3 memory. This makes it the ideal solution for a range of embedded applications that require advanced graphics and video on multiple displays.
 “The VIA eH1 hits a real sweet spot for the embedded industry as a whole,” said Daniel Wu, Vice President, VIA Embedded Platform Division at VIA Technologies. “Offering technologies like DX10.1, OpenGL/CL, plus multi-channel HD video playback on an extremely low power AIB will excite system integrators who want to bring the latest features to existing platforms.”

VIA eH1: Embedded Graphics and Video
The VIA eH1 is a low profile PCI Express add-in-board designed for next generation embedded applications in a range of segments including digital signage and advertising, POS, POI, gaming or any embedded application where graphics and HD video is streamed on two displays.

l            PCIe 2.0 Bus Interface
l            512MB DDR3
l            Low profile form factor
l            Dual-Link DVI and HDMI (with HDCP)
l            Fully programmable DirectX 10.1 Unified Shader Core
l            OpenGL 3.1 + OpenGL ES 2.0
l            GPGPU on OpenCL 1.0
l            H.264 and VC-1 support for Blu-Ray
l            Support for resolutions up to 2560x1600
l            1080p/1080i/720p HD-decode
l            Steroscopic 3D capable
l            Dual display support

The VIA eH1 can be used in conjunction with a number of VIA EPIA board products and can supplement any existing system that uses a x1, x4, x8 or x16 PCIe slot. Samples of the VIA eH1 are available now to project customers upon request.


Details regarding the S3 Chrome 5400E can be found at S3 Graphics

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