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Tuesday, January 19, 2016

Top 25 passwords still the main security vulnerability

By Nick Flaherty www.flaherty.co.uk

Despite years of problems, passwords remain the major vulnerability for systems and that is set to get even worse with the smart home and the Internet of Things. Webcams and other smart devices are frequently compromised by weak passwords.

The latest top 25 passwords from Splash Data in 2015 (compared to 2014) will have you holding your head in amazement and despair for the future of the industry, as it seems only the length of the password that is changing:


1. 123456 (Unchanged)
2. password (Unchanged)
3. 12345678 (Up 1)
4. qwerty (Up 1)
5. 12345 (Down 2)
6. 123456789 (Unchanged)
7. football (Up 3)
8. 1234 (Down 1)
9. 1234567 (Up 2)
10. baseball (Down 2)
11. welcome (New)
12. 1234567890 (New)
13. abc123 (Up 1)
14. 111111 (Up 1)
15. 1qaz2wsx (New)
16. dragon (Down 7)
17. master (Up 2)
18. monkey (Down 6)
19. letmein (Down 6)
20. login (New)
21. princess (New)
22. qwertyuiop (New)
23. solo (New)
24. passw0rd (New)
25. starwars (New)


"Given all the recent and historical news on data breaches of personal e-mail accounts, social media accounts and even phone account passwords, it is every wonder therefore that we are still using password combinations that are incredibly easy to guess," said Richard Cassidy, Technical Director for Europe at Alert Logic. "The challenge is Cyber Criminals are well aware that many of their targets still fail to employ a strong password policy and as such will “pre-load” their dictionary attacks for brute-force access with the combinations listed; which in turn means almost instant access to a substantial number of users personal data. Passwords such as these are dangerous because they are the first attempted combinations in the arsenal of attackers brute-force access tools."

"Unfortunately however, even with complex passwords we are almost fighting a losing battle; this is because cyber criminals can access botnet ecosystems to crack encrypted files or password protected data (through hashes of the password, or direct brute force attack) or make use of underground “cracking rigs” that use GPU’s Processors in rigs that can quite literally attempt billions of combinations per second. This means your average 8 character password (mandated by many online systems today) can be cracked in days. A great deal of research has gone into the minimum password length recommended; all users should be choosing passwords of at least 12 characters (alphanumeric with special characters) that are completely random and that would challenge even the most sophisticated decryption rigs for service out there on the cyber criminal underground," he said.
Overall there are two approaches to protecting your data, says Cassidy. First is access to data stores (e-mail, social media, online file sharing) with a minimum of 12 character passwords and second, encrypted key data files with strong cipher algorithms. 

Part of the challenge is devising and managing passwords, says Andy Green, Technical Specialist at Varonis. “People are bad at coming up with their own passwords," he said. "For convenience, we make them obvious or short or both. Hackers are good and getting better all the time at breaking them, either though brute force guessing or dictionary-style attacks if the hackers have access to the password hash. Keep in mind that a password with only six characters can be one of around 200 billion combinations – not a large number in the current era of big data. By increasing your password by only two characters, you’ve increased the possible combinations to almost a quadrillion – which will result in a serious computation challenge for attacker. 

He has some tips. "Sure, you should have at least 8 characters, but better yet use the ‘correct horse battery staple’ method. What’s that?  Essentially, it’s a memory trick where each letter of the password represents a word in a story. So  ’I just wrote a comment about passwords for the press’ becomes ‘Ijwacapftp’.  That’s an unguessable password  for hackers but one that you’ll never forget!”


Wednesday, January 13, 2016

RF360 to be a major new player in the Internet of things

By Nick Flaherty www.flaherty.co.uk

Qualcomm and TDK form Joint Venture for RF Front-End modules

Qualcomm and TDK have formed a joint venture for RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more.

TDK's highly integrated Rf module with diplexers
Majority owned by Qualcomm, RF360 will be nominally based in Singapore with its headquarters in Munich, Germany, and combine TDK’s capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm’s expertise in advanced wireless technologies to serve customers with leading-edge RF solutions into fully integrated systems.

In addition to creating RF360 Holdings, Qualcomm and TDK will expand their collaboration around key technology fields, including sensors and wireless charging.

“TDK is a leading electronic components manufacturer with cutting-edge expertise in RF filters and modules, and we are looking forward to deepening our collaboration and together accelerating innovation and better serving the ecosystem for next-generation mobile communications,” said Steve Mollenkopf, CEO of Qualcomm. “The joint venture’s RF filters will bolster Qualcomm RF360 front-end solutions to enable Qualcomm Technologies to deliver a truly complete solution to the ecosystem. This will enable us to expand our growth opportunity by allowing us to accelerate our strategy to provide OEMs across our business segments with fully integrated systems that will enable them to deliver at scale and on an accelerated timeframe.”

“The joint venture with Qualcomm is a win for both companies,” said Mr. Takehiro Kamigama, President and CEO of TDK. “This will further strengthen TDK’s position in key growth business segments and open new and exciting business opportunities. In this context, it was a major objective to ensure that our customers can continue to expect a seamless supply of discrete filters and duplexers, as well as modules.”

Module solutions will be essential to supporting this increasing complexity in the RF front end, with support for dozens of frequency bands for 2G, 3G and 4G LTE, while offering connectivity for wireless LAN, satellite navigation, Bluetooth, and more. In addition, the convergence of 4G mobile communications and the IoT means that manufacturers of wireless solutions for mobile IoT devices must achieve new levels of miniaturization, integration and performance as well as add in 5G frequencies.

RF360 and QTI will design products from the modem/transceiver to the antenna in a fully integrated system using RF360's filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) to support the wide range of frequency bands being deployed in networks across the globe. 

RF360's modules will also include front-end components designed and developed by QTI using CMOS, SOI and GaAS Power Amplifiers, switches enhanced via the recent acquisition of Antenna Tuning and Envelope Tracking for power optimisation.

RF front end modules are a $18bn market by 2020, and even though TDK is a major player shipping over 25 million filter functions per day, it still is only $1bn of this. It holds design wins at all major handset OEMs, including leading premium tier smartphones, and TDK and RF360 say they are are committed to investing in capacity increases to meet the growing industry demand. 

In addition to the joint venture, Qualcomm and TDK have agreed to deepen their technological cooperation to cover a wide range of cutting-edge technologies for next-generation mobile communications, IoT and automotive applications, including passive components, batteries, wireless charging, sensors, MEMS and more.

Tuesday, January 12, 2016

New £50m UK compound semiconductor centre backed by wafer maker IQE

From SW Innovation News www.swinnovation.co.uk


Compound Semiconductor Applications Catapult centre aims to be world first to drive innovation in multi-billion pound embedded market

The centre is backed by wafer maker IQE and Cardiff University who set up the £20m Compound Semiconductor Centre, which will form a key resource to the new Catapult. The partnership will help transform leading edge research at Cardiff University’s new Institute for Compound Semiconductors (ICS)  to be built on the University’s new £300m Innovation Campus.
“The launch of the £50m Compound Semiconductor Catapult will help provide the critical mass to launch the first Compound Semiconductor hub of its kind in the World, taking great academic research and seamlessly turning it into high-volume manufacturing, securing a global industrial and manufacturing platform for Wales and the UK,” said Dr Drew Nelson, CEO and President of IQE.

In November, the Welsh Government announced a £12m funding package to support the construction, fit-out, and purchase of capital equipment for Cardiff University’s Institute for Compound Semiconductors (ICS). The UK’s Research Council Partnership Investment Fund has invested £17.3m to support the Institute.
    The Catapult for semiconductors will be the 11th Catapult centre. Catapults already exist in:

    They are overseen by Innovate UK and join entrepreneurs, engineers and scientists with state-of-the-art facilities that allow them to create new products and services.

    Monday, January 11, 2016

    ST launches 100W USB-C controller

    By Nick Flaherty www.flaherty.co.uk

    Low power microcontrollers and an efficient high power process technology are coming together for STMicroelectronics, allowing a controller for the reversible USB Type-C connector that can support up to 100W of power and data rates up to 10Gbit/s.

    Manufactured using ST’s 20V process technology, the STUSB16 interface IC integrates short-circuit, over-voltage, over-current protection, eliminating the need for external circuitry. Additionally, it offers plug power support (VCONN) with up to 600mA programmable current capability and, per the USB Power Delivery specification, it integrates Bi-Phase Mark Coded (BMC) Physical Layer (PHY) coding and decoding logic.

    ST sees a huge potential market for a connector with this power range, clearing the “Rat’s Nest” of cables in the office and living room currently used to charge and connect computers, smartphones, tablets, TVs, set-top boxes, gaming platforms, and a broad range of consumer, industrial, and IoT smart devices.

    Interoperability is a key issue, as has already been shown by some of the early Type-C connectors. "Knowing well the frustration of being surrounded by numerous different cables with very limited interoperability, ST is working aggressively to build a strong and flexible portfolio of USB Type-C and power delivery solutions that include our STM32 microcontroller, ESD protection devices, and power-management products," said Andrea Onetti, Group Vice President and General Manager Volume MEMS Division, STMicroelectronics. “The new STUSB16 family embeds higher levels of circuit protection and a customer-configurable non-volatile memory, which enables IC configuration at power-up without software support. Overall, the ST portfolio delivers a low BOM cost and flexible hardware/software solution capable of meeting every power-profile requirement and customization need.”

    ST has enabled the migration to the USB Type-C port through the simple addition of an STUSB16 companion chip to existing MCU-based designs, while minimizing MCU-resource requirements compared to alternate solutions. Together these features simplify software development and reduce time-to-market while allowing customers to focus on their own added-value differentiators.

    The first member of the STUSB16 family, the STUSB1600QTR, is sampling to lead customers now at $0.95 in 1000 quantities so will be even more cost effective for higher volumes.


    Updated: Amazon pushes the trend for vertical integration

    By Nick Flaherty www.flaherty.co.uk

    The launch of ARM-based embedded chips by a subsidiary of e-commerce giant Amazon has highlighted the growing trend back towards vertical integration: a year on from the first family of processors, the Consumer Electronics Show (CES) offers a glimpse of how these devices are being used.

    Amazon bought Annapurna Labs back in January 2015, and the Israel-based company has now launched the Alpine series of platform-on-chip and subsystems product line that enables original equipment manufacturers and service providers to deliver next-generation digital services for home gateways, WiFi routers and storage devices.

    In  January 2016, Annapurna launched 32bit and 64bit chips with the ARMv7 and 64-bit ARMv8 architectures and a rich set of peripherals for high performance for UHD video streaming, secure storage, application virtualization, and cloud applications, all of which are provides by Amazon Web Services (AWS) for its own e-commerce and video-on-demand services. Amazon is now offering the chips to other OEMs and service providers, although the chances of selling them to large data centre operators such as Facebook or Microsoft is small.

    This highlights the trend back to having control of the silicon as a key element of a global business plan. For many years electronics companies such as Sony, Hitachi and Panasonic have been reducing the amount of semiconductor activity within their vertically integrated organisations on the basis that it allows the systems divisions to buy the best-in-class devices rather than the ones from the vertical organisations.

    That changed with fabless chip design becoming mainstream, allowing equipment companies to buy teams of designers, which on the whole are cheaper than having to build a chip making plant.  Apple buying PA Semiconductor (who were behind the original StrongArm high performance chips) to acquire the designers of its own ARM-based A-series chips was a very clear demonstration of this trend.

    Software companies such as Facebook have moved into hardware with open source designs for data centre equipment, so expect more moves into the silicon side of the data centre, as Facebook has a vested interest in making sure that key components are not supplied by a key competitor.
    Instead the Alpine chips will appeal to other embedded designers of Wi-Fi routers, NAS, and gateways for the connected home that enable them to support a wide range of devices and rapidly deliver innovative in-home services to consumers.
    Today, in-home gateways and Wi-Fi routers are severely limited by the lack of network and compute resources, constraining what services can be offered on devices in the home and forcing consumers to acquire multiple devices for networking, storage, media management, backup, and internet connectivity. This is because the standard processor for an in-home networking or storage device has limited general-purpose compute capability and depends significantly on hardware acceleration and deep software optimizations to reach target performance. This architecture slows delivery of new services to consumers by requiring changes to hardware or months of software optimizations to accommodate new features.
    Alpine helps to eliminate these challenges for service providers and OEMs by providing up to four cores of high performance general–purpose compute, advanced storage interfaces, PCIe Gen3, and multimode Ethernet connectivity of up to 10G to allow Alpine-based products to support many devices with services needed in the connected home including storage management, multimedia, IoT management, and cloud connectivity. With enterprise-class performance and features like DDR4 and 2MB of L2 cache, Alpine enables service providers and OEMs to rapidly roll out new consumer services, leverage open source or third-party applications, and meet performance demands without the need for hardware acceleration or custom software optimizations.
    "In the fast-growing home application marketplace, new use cases and consumer needs are rapidly invented and adopted. To stay competitive, OEMs and service providers therefore need to quickly add support for the new features that give consumers the ability to enjoy the latest applications without changing hardware or waiting for months to get updated software," said Gary Szilagyi, Vice President of Annapurna Labs. "Our Alpine platform-on-chip and subsystems product line gives service providers and OEMs a high-performance platform on which they can design hardware that will support growing consumer demands for innovative services, fast connectivity, and many connected devices."
    Annapurna maintains Alpine support in the Linux and FreeBSD open source projects. These standard open source operating systems allow third parties to easily run their applications and drivers on the Alpine platform and quickly qualify updated software on Alpine-based products. Multiple third party applications for the home segment run on the Alpine platform, including video streaming, security, and cloud connectivity. Drivers for components used in home devices have been ported and tested to run on Alpine including drivers for Wi-Fi chips, multimode Ethernet PHYs, and Ethernet switches.
    The Alpine platform works with a variety of standard open source libraries and development models including Data Plane Development Kit (DPDK), OpenWRT, and open source hypervisor and container frameworks. Running DPDK on Alpine delivers 10G performance with low resource usage to enable high throughput on the network, while still running many services on the devices. Alpine platform’s support for common open-source hypervisor and container frameworks allows isolation of applications from critical networking and storage services enabling rapid application deployment and upgrades without impacting basic services.
    Home gateway, Wi-Fi router, and NAS product designs based on Alpine are currently available from multiple original device manufacturers (ODMs) to give OEMs and service providers a choice of partners and to speed the development of new products and product refreshes. In addition, Annapurna offers a hardware development kit (HDK) for Alpine-based designs, which includes schematics files, layout files, thermal guidelines, and a bill of material (BoM). The HDK enables OEMs to leverage their own in-house resources, contract manufacturers, or other ODMs.
    The Alpine platform is designed to bring enterprise-class reliability to the home by integrating thermal sensors, and parity/error correcting code (ECC) on internal buses, external buses, and memory. Further, Alpine provides power savings with configurable core power states, PCIe power states for on-chip components, and support for multiple wake up methods including Wake on LAN (WoL), wake on event, and wake on interrupt.
    "There is significant growth in the home Wi-Fi segment with most of the demand occurring on high-performance routers. As a leading provider in this segment, we are committed to providing our customers with high performing solutions," said Tenlong Deng, Vice President of ASUS Networking & Wireless Devices Business Unit. "The increased demand for new applications and use models requires additional compute and more flexibility. We are collaborating with Annapurna on these technologies and believe that they have one of the most advanced and flexible silicon solutions in the marketplace."
    "In the home network, consumers are asking for more services like media processing, HD video streaming, better security, and tighter integration of cloud services. Our router, gateway, and NAS product lines provide exceptional user experience and integrate many of the services needed by our customers," said Richard Jonker, General Manager & Vice President at NETGEAR. "Our recently announced ReadyNAS 214 is based on Annapurna's Alpine quad-core and packs in a rich set of services including PLEX media server with live transcoding capabilities, a private cloud for the home, 5 levels of security and a seamless backup solution for all connected devices. Using the Alpine quad core chip, we are able to run all of these services at very high performance. We like the Annapurna architecture and plan to collaborate with Annapurna on future projects."
    "We offer rich functionality and applications in our NAS devices. With the powerful dual and quad-core Alpine processors product line, our customers can benefit from high-performance NAS products with cutting-edge solutions," said Meiji Chang, General Manager of QNAP Systems. "We have launched the dual-core 2-bay TS-231+ and 4-bay TS-431+, and the 5-bay quad-core TS-531P NAS products that support Docker and Linux container virtualization. Our NAS products also support PLEX media server for affordable optional multimedia applications. We are working closely with Annapurna Labs to further strengthen our product portfolio in 2016."
    "We believe in building powerful, high-value storage solutions for homes and businesses that need to manage rapid data growth nowadays," said Jones Tsai, Hardware Design Director of Synology, an award winning NAS provider. "We have launched several products including the Synology DiskStation DS2015xs, DS1515, DS715, and DS416 using the Alpine chips. These enable our customers to enjoy features such as excellent encryption performance and built-in 10G support at a competitive price, making sure they are provided with a very effective approach to file management, sharing, and protection."



    Monday, January 04, 2016

    ST teams with ClevX for wireless security for IoT

    By Nick Flaherty www.flaherty.co.uk

    Claim World’s First Wireless User-Authentication Technology Platform for IoT-Device Security
    STMicroelectronics has teamed up with US encrypted flash-drive supplier ClevX to allow encrypted portable storage that is accessed with Bluetooth Smart wireless user authentication.
    This means users can interact with secure portable storage (full-disk, XTS-AES 256-bit encryption) from their smartphones or wearable devices where all user data on the drive is encrypted and can be locked/unlocked using single- or multi-factor authentication. The technology is ideally suited for consumer and industrial applications such as healthcare, home automation and security, secure-access control systems, and portable data storage by providing a secure central repository for data.
    “IoT-device authentication has long required trade-offs among security, convenience and mobility. The ClevX DataLock BT-secured portable storage provides the capability to actually enjoy the best of all worlds,” said Luca Difalco, VP of Marketing at STMicroelectronics’ Americas Region. “While we’re demonstrating the capability in an easy-to-use hardware-encrypted secure USB-Drive, the elegance and versatility of the solution is provided by an application that we can add to our BlueNRG device to make lock-down security accessible via Bluetooth Smart.”
    ST and ClevX have reference designs for secure portable storage media, including Flash, hard-disk, and solid-state disk drives. These designs use ST’s BlueNRG Bluetooth Smart chips and ARM Cortex-M0+-based STM32L0 microcontroller that includes an AES encryption engine.The designs and software are immediately available for licensing and partnerships, including both ST/ClevX-based hardware and firmware in addition to the related smartphone and wearables apps.

    The ST/ClevX reference designs are OS-host agnostic. USB drives with the DataLock BT technology operate across all computer platforms and embedded systems while providing various easy-to-use security layers (including a wireless lock/unlock mechanism, phone as an authentication factor, phone + PIN, or phone + PIN + userID/location/time). The reference designs support USB Remote Management, which can be critical for corporate deployments and remote password resets, drive disabling and erasing, and successful implementation of corporate-wide policies. 
    “With the sensitive personal and corporate information that people carry on their USB drives, loss can easily lead to substantial financial penalties and undesired public disclosure,” said Lev Bolotin, Founder and CEO of ClevX. “Using ST and ClevX technologies, the DataLock BT Security solution protects data on a USB. Consumers, healthcare workers, mobile professionals, and corporations can improve their productivity and security on-the-go by using their phones to authenticate themselves to their USB drives and change security options, as required.”
    Founded in 2005, ClevX is a Seattle-based IP/Technology development and licensing company with a secure, portable USB storage platform that is OS-agnostic, hardware-encrypted and bootable, as well as FIPS 140-2 Level 3 Certified devices and portable software applications.

    Tuesday, December 29, 2015

    Mergers shake up the semiconductor industry

    Review of the year

    By Nick Flaherty www.flaherty.co.uk

    This year has seen a staggering consolidation within the semiconductor industry. With deals ranging from the merger of NXP and Freescale through Broadcom and Avago to Qualcomm and CSR, Infineon and International Rectifier and Intel absorbing Altera (which completed today), the field of suppliers in the embedded industry will change significantly by the end of next year as a result.
    Other deals are continuing, with Dialog Semiconductor's acquisition of Atmel still in play, and TDK taking over Micronas.
    This is highlighted in the recent figures from market researcher IC Insight. Bill McClean sees the integrated device makers (IDM) overtaking the fabless chip makers briefly, partly as a result of the mergers and partly from currency fluctuations. But it does shake up the list of the top suppliers considerably.
    As shown in Figure 1, only three of the top-10 IDM semiconductor suppliers are forecast to register growth in 2015 and, in total, the top-10 IDMs are expected to display flat growth this year. says McClean.  Intel remains the dominant player, and Altera's $460m fabless business will barely make a bump in the figures as the new Programmable Solutions division. The combined NXP/Freescale is now moving up to challenge Texas Instruments, although the majority of the NXP basis is moving to fabless rather than IDM.
    Top 10 IDMs for 2015 post merger. Source: IC Insights


    Although flat growth by the top-10 IDMs would typically be considered poor performance, it is still forecast to be a much better result than is expected from the top-10 fabless semiconductor suppliers (Figure 2).  In order to make direct comparisons for year-over-year growth, IC Insights combined the merged, or soon to be merged, companies’ 2014 and 2015 semiconductor sales regardless of when the merger occurred, providing a more accurate figure. However, how well the companies execute on the merger will impact on this potential growth.

    Figure 2: Fabless semiconductor vendors are seeing the effects of consolidation more strongly than IDMs. Source: IC Insights 

    As shown, the top-10 fabless semiconductor suppliers are forecast to register a 5% decline in sales this year, five points worse than the top-10 IDMs.  It should be noted that essentially all of the decline expected for the top-10 fabless suppliers in 2015 could be attributed to the forecasted decline in Qualcomm/CSR’s sales this year, which comes from Samsung’s increasing use of its internally developed Exynos application processor in its smartphones instead of the application processors it had previously sourced from Qualcomm.

    Figure 3: Flat growth in 2015 shows the semiconductor market moving into its negative cycle, with consequences for the embedded market. Source: IC Insights
    All this highlights the turn in the market in figure 3. From positive growth last year to flat sales this year, the market is heading into its downward trend. This will make life difficult for embedded developers as the top ten companies in both areas cut costs and product lines to compensate, and drive more consolidation through 2016.

    Sunday, December 20, 2015

    Market for the Internet of Things to double by 2019 to 30bn connections

    By Nick Flaherty www.flaherty.co.uk

    Internet of Things integrated circuit sales expected to grow 15.9% a year over the next four years, with MCUs and SoC processors seeing the strongest growth according to one of the most reliable market researchers. 

    Between 2015 and 2019, worldwide systems revenues for applications connecting to the Internet of Things will nearly double, reaching $124.5 billion in the final year of this decade, according to Bill McClean of IC Insights in his 2016 edition of the IC Market Drivers report.  During that same timeframe, new connections to the Internet of Things (IoT) will grow from about 1.7 billion in 2015 to nearly 3.1 billion in 2019 - that's more than five for every person on the planet, but that's still one of the more conservative forecasts. 

    Figure 1: Growth in IoT connections to 2019

    The new IC Market Drivers report shows about 30.0 billion Internet connections are expected to be in place worldwide in 2020, with 85% of those attachments being to web-enabled “things” — commercial, industrial, and consumer systems, distributed sensors, vehicles, and other connected objects, all with embedded silicon controllers and transceiver. The remaining 15% is in electronics used by humans to communicate, download and receive streams of data files, and search for online information.  This marks a complete reversal from the Internet boom of 2000, when 85% of 488 million Internet connections providing human users with online access to the World Wide Web and the remaining 15% serving embedded systems, remote sensing and measurements, control, and machine-to-machine communications.

    Strong double-digit increases in the Internet of Things market will drive up IC sales in IoT applications by a compound annual growth rate (CAGR) of 15.9% between 2015 and 2019 to about $19.4 billion in the final year of this decade (Figure 2), according to the new report.  IoT applications will also fuel strong sales growth in optoelectronics, sensors/actuators, and discrete semiconductors (O-S-D), which are projected to rise by a CAGR of 26.0% between 2015 and 2019 to $11.6 billion in four years.  The new IC Market Drivers report shows microcontrollers and system-on-chip microprocessors topping integrated circuit sales growth with a CAGR of 22.3% in the next four years, followed by memories at 19.8%, application specific standard products (ASSPs) at 16.4%, and analog ICs at an annual growth rate of 12.7%.

    In the forecast, wearable systems are projected to be the fastest growing IoT application with sales increasing by a CAGR of 59.0%, thanks in great part to a 440% surge in 2015 due to the launch of Apple’s first smartwatches in 2Q15.  Sales of IoT-connected wearable systems are expected to reach $15.2 billion in 2019 compared to $1.5 billion in 2014 and about $8.1 billion in 2015.
    Meanwhile, connected vehicles (passenger cars and light trucks) are expected to be the second fastest market category for IoT technology with revenues growing by a CAGR of 31.5% between 2014 and 2019 to $5.3 billion in the final year of this decade.



    Friday, December 11, 2015

    Powering a personal wireless network with urine

    By Nick Flaherty www.flaherty.co.uk

    I've been following the development of miniaturised microbial fuel cells (MFCs) at the Bristol Robotics Laboratory for a couple of years now, and it's great to see a prototype with a good use case.

    Microbial fuel cells (MFCs) replicate biological processes to generate energy, and researchers at UWE in Bristol have embedded the technology in a pair of socks. The key is that the MFCs take in urine and produce enough energy to power a wireless transceiver, creating a personal area network (PAN) link without having to use batteries.  This is the first self-sufficient system powered by a wearable energy generator based on microbial fuel cell technology and the research paper, ‘Self-sufficient Wireless Transmitter Powered by Foot-pumped Urine Operating Wearable MFC’, is published in Bioinspiration and Biomimetics.

    The paper describes a lab-based experiment led by Professor Ioannis Ieropoulos, of the Bristol BioEnergy Centre at the University of the West of England (UWE Bristol). The Bristol BioEnergy Centre is based in Bristol Robotics Laboratory, a collaborative partnership between the University of the West of England (UWE Bristol) and the University of Bristol.

    Researchers at UWE have developed socks that convert urine into energy to
    power a wireless transceiver for a personal area network without batteries
    Soft MFCs embedded within a pair of socks was supplied with fresh urine, circulated by the human operator walking.  Normally, continuous-flow MFCs would rely on a mains powered pump to circulate the urine over the microbial fuel cells, but this experiment relied solely on human activity, which is a key step forward (pun intended). The manual pump was based on a simple fish circulatory system and the action of walking caused the urine to pass over the MFCs and generate energy. Soft tubes, placed under the heels, ensured frequent fluid push–pull by walking. The wearable MFC system successfully ran a wireless transmission board, which was able to send a message every two minutes to the PC-controlled receiver module.

    “Having already powered a mobile phone with MFCs using urine as fuel, we wanted to see if we could replicate this success in wearable technology. We also wanted the system to be entirely self-sufficient, running only on human power – using urine as fuel and the action of the foot as the pump,” said Professor Ieropoulos. “This opens up possibilities of using waste for powering portable and wearable electronics. For example, recent research shows it should be possible to develop a system based on wearable MFC technology to transmit a person’s coordinates in an emergency situation. At the same time this would indicate proof of life since the device will only work if the operator‘s urine fuels the MFCs.”

    The challenge now is how the MFC cells are refuelled with urine.

    Microbial fuel cells (MFCs) use bacteria to generate electricity from waste fluids. They tap into the biochemical energy used for microbial growth and convert it directly into electricity.  This technology can use any form of organic waste and turn it into useful energy without relying on fossil fuels, making this a valuable green technology. Parts of this work were funded by the UK Engineering & Physical Sciences Research Council (EPSRC) and the Bill & Melinda Gates Foundation.

    The research is important in other areas of robotics as it would allow autonomous systems to generate power from waste materials to operate for days or even months at a time.

    Thursday, December 10, 2015

    Can WiFi work for the Internet of Things?

    By Nick Flaherty www.flaherty.co.uk

    Enhanced Low-Power (ELP) Wireless MCUs Provide Multi-protocol Support and Quadruple Battery Life in Sensors

    If you are Broadcom, shortly to be subsumed into Avago, then the answer seems to be no.

    The launch of a family of low power devices under the WICED brand to offer low power would seem to be a route forward - after all, WICED ((Wireless Internet Connectivity for Embedded Devices) is built on Broadcom's WiFi technology. But the new CORE enhanced low power (ELP) use other technologies to achieve the power reduction.

    Using low power WiFi to connect sensors for the Internet of Things is a bit of a 'holy grail' as it means that sensor nodes can be easily added to the home network. Unfortunately, the WiFI protocols suck the power from the battery. This is why Zigbee and now Bluetooth Smart (Bluetooth Low Energy 4.0 and 4.1, with 4.2 emerging soon) have emerged as viable technologies. The trouble is that Zigbee and other 802.15.4 technologies need a gateway to link the sensors to the home network (usually via WiFi). Bluetooth smart held promise as the sensors could connect directly to a smartphone but still mostly need a gateway device.

    So a pin-compatible family of 802.15.4 and Bluetooth Smart devices is a great step forward, it's just not the one we hoped for.

    The WICED CORE ELP Bluetooth family delivers advanced technology for a wide range of IoT applications, including simultaneous multi-protocol support, the industry's first 40nm flash memory in a communications SoC, low-power consumption and a common development platform. By integrating a host of features including increased processor speed, FPU and DSP libraries, more applications RAM and significant flash memory on a chip the size of a fingernail, Broadcom enables OEMs to create more complex applications and employ a wireless MCU that scales across a much wide product set. "Broadcom further separates itself from the competition with our new WICED CORE ELP family," said Brian Bedrosian, Senior Director of Product Marketing for Wireless Connectivity at Broadcom. "In addition to enabling multi-protocol support, we support more complex IoT applications for OEMs and developers, all while consolidating our low-power solution in a small package."
    There are three different multi-protocol devices, all sharing an ARM Cortex CM4 core with floating point and digital signal processing extensions to get that lower power and enable the same software to be used across the different devices:
    • BCM20719 which supports both Bluetooth and Bluetooth Smart protocols
    • BCM20729 which supports Zigbee and 6LoWPAN protocols
    • BCM20739 which supports Bluetooth, Bluetooth Smart and IEEE 802.15.4 protocols
    The family of devices supports: 
    • 512 KB RAM for complex applications
    • 1MB flash memory for program and data storage including support for over-the-air updates
    • Integrated Bluetooth and Bluetooth Smart and Zigbee 3.0 software stacks
    • Advanced sleep and latency management circuitry
    • Compliant with Bluetooth 4.2 specification
    • Expansive set of IO including precision A/D convertors
      • Support for UART, SPI, Quad-SPI and Serial Control interfaces for interfacing to external nonvolatile memories, peripheral ICs, and sensors
    • On-chip, multi-channel ADC for measuring sensor inputs, battery level, and more
    • On-chip AES 256 encryption engines with support for RSA, MD5, ECC and secure element
    • Native wireless charging support for A4WP and Airfuel
    The devices are sampling now, but whether the WICED branding survives the Avago merger remains to be seen.


    Low-Power Floating Point Processor Core for Intelligent Connected Devices

    By Nick Flaherty www.flaherty.co.uk


    How important is floating point performance for the Internet of Things? So far, most of the processing requirement has been on fixed point, mainly to keep the power consumption down as floating point is notoriously power hungry. However, the increasing need for security means there is more demand for low power encryption all the way down to the sensor node. This presents a significant challenge for the system developer. 
    French processor core designer Cortus has developed a single precision floating point IP core aimed at embedded systems requiring good floating point computational performance while also delivering small silicon area and low power dissipation. The FPS26 is the third in a family of products based on the Cortus v2 instruction set. 
    Once you have the floating point capability, which gives 10x the performance over an integer core, then new applications become possible such as MIMO for reliable (lower power) wireless connections and machine vision to reduce the amount of data that is sent over the network. Growing numbers of controllers in solar energy and industrial control requiring floating point algorithms, many applications require floating point operations executed in hardware to achieve their performance goals. Complex matrix inversion is a challenging computation in MIMO with challenges around precision, quantisation and scaling which can be mitigated by using floating point to reduce the overall power consumption.

    The FPS26 IP core provides single precision floating point performance for applications such as industrial control, machine vision and MIMO wireless systems


    “For companies developing intelligent ‘things’ requiring floating point algorithms, our FPS26 core offers outstanding computational performance while efficiently using silicon area”, says Michael Chapman President & CEO of Cortus. “It is an excellent fit with the industrial internet of things and with power control applications”.

    Although historically embedded software has been dominated by fixed-point operations, there are cases where values may have large dynamic ranges and floating point computation is required or advantageous. Examples include matrix inversion in MIMO baseband processing, matrix multiplication and fast Fourier transforms (FFTs).

    The FPS26 has a Harvard architecture, sixteen 32-bit registers and a 5-stage pipeline. It offers an IEEE 754 single precision hardware floating point unit, a pipelined parallel multiplier and a hardware divider. It supports the AXI4-Lite bus as well as Cortus APS peripherals. The small size of FPS26 makes it highly suitable for cost sensitive applications. The CPU starts at around 0.192 square mm using a 90nm technology. Using the Linpack benchmark FPS26 delivers 9.7 times better floating point performance than the APS25 integer core.

    Up to eight co-processors can be added to an FPS26 core and the co-processor interface allows licensees to add custom coprocessors, for example to accelerate computations in cryptography or signal processing, without knowing details of the internals of the core. Co-processor instructions can be inserted into C-code appearing as function calls so that all the code can be developed in C, which was a key requirement of the processor design.
    The instructions are 16, 24 and 32 bits in length ensuring leading code density and the pipeline features out-of-order execution enabling nearly all integer instructions to execute in a single cycle, including loads and stores. Interrupts are fully vectored and the architecture ensures a minimum of software overhead in task switches. All cores interface to Cortus’ peripherals including Ethernet 10/100 MAC, USB 2.0 Device and USB 2.0 OTG via the efficient APS bus. They also share the simple vectored interrupt structure which ensures rapid, real time interrupt response, with low software overhead.

    The APS tool chain and IDE (for C and C++) is available to licensees free of charge, and can be customised and branded for final customer use. Ports of various RTOSs are available such as FreeRTOS, Micrium uC/OSII, Micrium uC/OSIII & TargetOS.

    To date well over 800 million devices have been manufactured containing Cortus processor cores.


    Tuesday, December 08, 2015

    Farewell Freescale

    By Nick Flaherty www.flaherty.co.uk


    Nearly a year on from the initial announcement, the merger of NXP and Freescale Semiconductor completed yesterday.

    The results of the deal, announced in March 2015, is billed as creating a high performance mixed signal chip maker with revenue of over $10 billion, trading as NXP Semiconductor. This now makes NXP the market leader in automotive semiconductor solutions and in general purpose microcontroller (MCU) products, although how the two competing ARM-based lines of general purpose microcontrollers will shake out remains to be seen.

    Security and the Internet of Things (IoT) will be key areas of growth, and combine both NXP and Freescale hardware and software design expertise. 

    “Through this merger we have created an industry powerhouse focused on the high growth opportunities in the Smarter World, capitalizing on the emerging opportunities offered by the accelerating demand for connectivity, processing and security. Today’s formation of the new NXP is a transformative step on our journey to become the industry leader in high performance mixed signal solutions,” said Rick Clemmer, CEO of NXP. “This merger enables us to deliver more complete solutions to our customers as we are emerging as the leader in the Secure Connections – and the supporting infrastructure – for the Smarter World domain. As a result, we reiterate today that we fully expect to continue to significantly out-grow the overall market, drive world-class profitability and generate even more cash, allowing us to continue creating significant value for NXP’s shareholders.”

    So it's a fond farewell to Motorola's Semiconductor Products Sector (SPS) and the foray into private-equity and the fab-lite approach (which mapped well to NXP!)