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Wednesday, January 27, 2016

Sony positions itself for IoT with Altair buy

English: Official logo of Altair Semiconductor
English: Official logo of Altair Semiconductor (Photo credit: Wikipedia)
By Nick Flaherty www.flaherty.co.uk

Sony may have been selling off parts of its semiconductor business over the last few years, but it is back on the consolidation trail with a key buy of wireless innovator Altair Semiconductor.

Altair, based in Israel, originally started developing WiMax chipsets, but moved to 4G when WiMax stalled and 4G LTE took over. With 4G well established in silicon, the focus now is on 5G specifications, which include 10Gbit/s download speeds and a challenging 1ms round trip link latency that is aimed at devices in the Internet of Things (IoT).

Both these specifications are music to the ears of Sony, which is looking to combine the bits of its semiconductor business it kept - CMOS image sensors and GPS navigation chips - with wireless links, and Altair has truly leading edge expertise in these areas. The current 4G modem chips and software stand out for their low power consumption, high performance and competitive cost. 

The $212m Altair deal is expected to complete quickly, closing in early February. This is a lot quicker than the re-structuring of its own electronic component business, which is due to complete in April this year. This brings together the semiconductor, battery and storage technologies into  Sony Semiconductor Solutions.

This is part of Sony's vision of more and more "things" equipped with cellular chipsets in a connected environment in which "things" can reliably and securely access network services that leverage the power of cloud computing, it says. It is aiming not only to expand Altair's existing business, but also to move forward with research on and development of new sensing technologies. 

www.sony.net/electronics

Wednesday, January 20, 2016

Microchip underbids for Atmel and wins

By Nick Flaherty www.flaherty.co.uk

Microchip Technology has booted Dialog Semiconductor out of its deal to buy Atmel with a lower offer but more cash.


Microchip today signed a definitive agreement to acquire Atmel for $8.15 per share in a $3.56bn combination of cash and shares. This compares to the $4.6bn offer from Dialog, although Microchip's cash offer of $7 a share is significantly higher.  
This potentially puts Dialog at risk of being acquired itself. A $137m termination fee will help, but still leaves Dialog vulnerable in this time of manic mergers.  
"Our Board of Directors determined, after consultation with our financial advisor and outside legal counsel, that the transaction with Microchip is a superior proposal for Atmel's stockholders under the terms of our merger agreement with Dialog Semiconductor plc that we terminated today.  Under the Microchip transaction, Atmel stockholders will receive a much higher cash consideration per share compared to the Dialog deal, as well as the opportunity for further upside through the ownership of stock of Microchip," said Steven Laub, President and CEO of Atmel.
Microchip bought Micrel in May last year, and this deal takes out Atmel as a major competitor, consolidating customer business in Microchip as there was more common product lines between the two compared to the Dialog deal (as in the chart on the left). The combination of Atmel and Microchip will have revenue of around $4bn (compared to $3.5bn for the Dialog/Atmel combination), and this will lead to similar estimated cost savings of $170m from April 2018. However, the deal still needs to be approved by Atmel's shareholders, so its not a done deal yet.
"We are delighted to welcome Atmel employees to Microchip and look forward to closing the transaction and working together to realize the benefits of a combined team pursuing a unified strategy.  As the semiconductor industry consolidates, Microchip continues to execute a highly successful consolidation strategy with a string of acquisitions that have helped to double our revenue growth rate compared to our organic revenue growth rate over the last few years.  The Atmel acquisition is the latest chapter of our growth strategy and will add further operational and customer scale to Microchip," said Steve Sanghi, President and CEO of Microchip. 
The transaction has been approved by the Board of Directors of each company and is expected to close in the second quarter of calendar year 2016, subject to approval by Atmel's stockholders, regulatory approvals and other customary closing conditions. 

Tuesday, January 19, 2016

Top 25 passwords still the main security vulnerability

By Nick Flaherty www.flaherty.co.uk

Despite years of problems, passwords remain the major vulnerability for systems and that is set to get even worse with the smart home and the Internet of Things. Webcams and other smart devices are frequently compromised by weak passwords.

The latest top 25 passwords from Splash Data in 2015 (compared to 2014) will have you holding your head in amazement and despair for the future of the industry, as it seems only the length of the password that is changing:


1. 123456 (Unchanged)
2. password (Unchanged)
3. 12345678 (Up 1)
4. qwerty (Up 1)
5. 12345 (Down 2)
6. 123456789 (Unchanged)
7. football (Up 3)
8. 1234 (Down 1)
9. 1234567 (Up 2)
10. baseball (Down 2)
11. welcome (New)
12. 1234567890 (New)
13. abc123 (Up 1)
14. 111111 (Up 1)
15. 1qaz2wsx (New)
16. dragon (Down 7)
17. master (Up 2)
18. monkey (Down 6)
19. letmein (Down 6)
20. login (New)
21. princess (New)
22. qwertyuiop (New)
23. solo (New)
24. passw0rd (New)
25. starwars (New)


"Given all the recent and historical news on data breaches of personal e-mail accounts, social media accounts and even phone account passwords, it is every wonder therefore that we are still using password combinations that are incredibly easy to guess," said Richard Cassidy, Technical Director for Europe at Alert Logic. "The challenge is Cyber Criminals are well aware that many of their targets still fail to employ a strong password policy and as such will “pre-load” their dictionary attacks for brute-force access with the combinations listed; which in turn means almost instant access to a substantial number of users personal data. Passwords such as these are dangerous because they are the first attempted combinations in the arsenal of attackers brute-force access tools."

"Unfortunately however, even with complex passwords we are almost fighting a losing battle; this is because cyber criminals can access botnet ecosystems to crack encrypted files or password protected data (through hashes of the password, or direct brute force attack) or make use of underground “cracking rigs” that use GPU’s Processors in rigs that can quite literally attempt billions of combinations per second. This means your average 8 character password (mandated by many online systems today) can be cracked in days. A great deal of research has gone into the minimum password length recommended; all users should be choosing passwords of at least 12 characters (alphanumeric with special characters) that are completely random and that would challenge even the most sophisticated decryption rigs for service out there on the cyber criminal underground," he said.
Overall there are two approaches to protecting your data, says Cassidy. First is access to data stores (e-mail, social media, online file sharing) with a minimum of 12 character passwords and second, encrypted key data files with strong cipher algorithms. 

Part of the challenge is devising and managing passwords, says Andy Green, Technical Specialist at Varonis. “People are bad at coming up with their own passwords," he said. "For convenience, we make them obvious or short or both. Hackers are good and getting better all the time at breaking them, either though brute force guessing or dictionary-style attacks if the hackers have access to the password hash. Keep in mind that a password with only six characters can be one of around 200 billion combinations – not a large number in the current era of big data. By increasing your password by only two characters, you’ve increased the possible combinations to almost a quadrillion – which will result in a serious computation challenge for attacker. 

He has some tips. "Sure, you should have at least 8 characters, but better yet use the ‘correct horse battery staple’ method. What’s that?  Essentially, it’s a memory trick where each letter of the password represents a word in a story. So  ’I just wrote a comment about passwords for the press’ becomes ‘Ijwacapftp’.  That’s an unguessable password  for hackers but one that you’ll never forget!”


Wednesday, January 13, 2016

RF360 to be a major new player in the Internet of things

By Nick Flaherty www.flaherty.co.uk

Qualcomm and TDK form Joint Venture for RF Front-End modules

Qualcomm and TDK have formed a joint venture for RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more.

TDK's highly integrated Rf module with diplexers
Majority owned by Qualcomm, RF360 will be nominally based in Singapore with its headquarters in Munich, Germany, and combine TDK’s capabilities in micro-acoustic RF filtering, packaging and module integration technologies and Qualcomm’s expertise in advanced wireless technologies to serve customers with leading-edge RF solutions into fully integrated systems.

In addition to creating RF360 Holdings, Qualcomm and TDK will expand their collaboration around key technology fields, including sensors and wireless charging.

“TDK is a leading electronic components manufacturer with cutting-edge expertise in RF filters and modules, and we are looking forward to deepening our collaboration and together accelerating innovation and better serving the ecosystem for next-generation mobile communications,” said Steve Mollenkopf, CEO of Qualcomm. “The joint venture’s RF filters will bolster Qualcomm RF360 front-end solutions to enable Qualcomm Technologies to deliver a truly complete solution to the ecosystem. This will enable us to expand our growth opportunity by allowing us to accelerate our strategy to provide OEMs across our business segments with fully integrated systems that will enable them to deliver at scale and on an accelerated timeframe.”

“The joint venture with Qualcomm is a win for both companies,” said Mr. Takehiro Kamigama, President and CEO of TDK. “This will further strengthen TDK’s position in key growth business segments and open new and exciting business opportunities. In this context, it was a major objective to ensure that our customers can continue to expect a seamless supply of discrete filters and duplexers, as well as modules.”

Module solutions will be essential to supporting this increasing complexity in the RF front end, with support for dozens of frequency bands for 2G, 3G and 4G LTE, while offering connectivity for wireless LAN, satellite navigation, Bluetooth, and more. In addition, the convergence of 4G mobile communications and the Iomeans that manufacturers of wireless solutions for mobile IoT devices must achieve new levels of miniaturization, integration and performance as well as add in 5G frequencies.

RF360 and QTI will design products from the modem/transceiver to the antenna in a fully integrated system using RF360's filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) to support the wide range of frequency bands being deployed in networks across the globe. 

RF360's modules will also include front-end components designed and developed by QTI using CMOS, SOI and GaAS Power Amplifiers, switches enhanced via the recent acquisition of Antenna Tuning and Envelope Tracking for power optimisation.

RF front end modules are a $18bn market by 2020, and even though TDK is a major player shipping over 25 million filter functions per day, it still is only $1bn of this. It holds design wins at all major handset OEMs, including leading premium tier smartphones, and TDK and RF360 say they are are committed to investing in capacity increases to meet the growing industry demand. 

In addition to the joint venture, Qualcomm and TDK have agreed to deepen their technological cooperation to cover a wide range of cutting-edge technologies for next-generation mobile communications, IoT and automotive applications, including passive components, batteries, wireless charging, sensors, MEMS and more.

Tuesday, January 12, 2016

New £50m UK compound semiconductor centre backed by wafer maker IQE

From SW Innovation News www.swinnovation.co.uk


Compound Semiconductor Applications Catapult centre aims to be world first to drive innovation in multi-billion pound embedded market

The centre is backed by wafer maker IQE and Cardiff University who set up the £20m Compound Semiconductor Centre, which will form a key resource to the new Catapult. The partnership will help transform leading edge research at Cardiff University’s new Institute for Compound Semiconductors (ICS)  to be built on the University’s new £300m Innovation Campus.
“The launch of the £50m Compound Semiconductor Catapult will help provide the critical mass to launch the first Compound Semiconductor hub of its kind in the World, taking great academic research and seamlessly turning it into high-volume manufacturing, securing a global industrial and manufacturing platform for Wales and the UK,” said Dr Drew Nelson, CEO and President of IQE.

In November, the Welsh Government announced a £12m funding package to support the construction, fit-out, and purchase of capital equipment for Cardiff University’s Institute for Compound Semiconductors (ICS). The UK’s Research Council Partnership Investment Fund has invested £17.3m to support the Institute.
    The Catapult for semiconductors will be the 11th Catapult centre. Catapults already exist in:

    They are overseen by Innovate UK and join entrepreneurs, engineers and scientists with state-of-the-art facilities that allow them to create new products and services.

    Monday, January 11, 2016

    ST launches 100W USB-C controller

    By Nick Flaherty www.flaherty.co.uk

    Low power microcontrollers and an efficient high power process technology are coming together for STMicroelectronics, allowing a controller for the reversible USB Type-C connector that can support up to 100W of power and data rates up to 10Gbit/s.

    Manufactured using ST’s 20V process technology, the STUSB16 interface IC integrates short-circuit, over-voltage, over-current protection, eliminating the need for external circuitry. Additionally, it offers plug power support (VCONN) with up to 600mA programmable current capability and, per the USB Power Delivery specification, it integrates Bi-Phase Mark Coded (BMC) Physical Layer (PHY) coding and decoding logic.

    ST sees a huge potential market for a connector with this power range, clearing the “Rat’s Nest” of cables in the office and living room currently used to charge and connect computers, smartphones, tablets, TVs, set-top boxes, gaming platforms, and a broad range of consumer, industrial, and IoT smart devices.

    Interoperability is a key issue, as has already been shown by some of the early Type-C connectors. "Knowing well the frustration of being surrounded by numerous different cables with very limited interoperability, ST is working aggressively to build a strong and flexible portfolio of USB Type-C and power delivery solutions that include our STM32 microcontroller, ESD protection devices, and power-management products," said Andrea Onetti, Group Vice President and General Manager Volume MEMS Division, STMicroelectronics. “The new STUSB16 family embeds higher levels of circuit protection and a customer-configurable non-volatile memory, which enables IC configuration at power-up without software support. Overall, the ST portfolio delivers a low BOM cost and flexible hardware/software solution capable of meeting every power-profile requirement and customization need.”

    ST has enabled the migration to the USB Type-C port through the simple addition of an STUSB16 companion chip to existing MCU-based designs, while minimizing MCU-resource requirements compared to alternate solutions. Together these features simplify software development and reduce time-to-market while allowing customers to focus on their own added-value differentiators.

    The first member of the STUSB16 family, the STUSB1600QTR, is sampling to lead customers now at $0.95 in 1000 quantities so will be even more cost effective for higher volumes.


    Updated: Amazon pushes the trend for vertical integration

    By Nick Flaherty www.flaherty.co.uk

    The launch of ARM-based embedded chips by a subsidiary of e-commerce giant Amazon has highlighted the growing trend back towards vertical integration: a year on from the first family of processors, the Consumer Electronics Show (CES) offers a glimpse of how these devices are being used.

    Amazon bought Annapurna Labs back in January 2015, and the Israel-based company has now launched the Alpine series of platform-on-chip and subsystems product line that enables original equipment manufacturers and service providers to deliver next-generation digital services for home gateways, WiFi routers and storage devices.

    In  January 2016, Annapurna launched 32bit and 64bit chips with the ARMv7 and 64-bit ARMv8 architectures and a rich set of peripherals for high performance for UHD video streaming, secure storage, application virtualization, and cloud applications, all of which are provides by Amazon Web Services (AWS) for its own e-commerce and video-on-demand services. Amazon is now offering the chips to other OEMs and service providers, although the chances of selling them to large data centre operators such as Facebook or Microsoft is small.

    This highlights the trend back to having control of the silicon as a key element of a global business plan. For many years electronics companies such as Sony, Hitachi and Panasonic have been reducing the amount of semiconductor activity within their vertically integrated organisations on the basis that it allows the systems divisions to buy the best-in-class devices rather than the ones from the vertical organisations.

    That changed with fabless chip design becoming mainstream, allowing equipment companies to buy teams of designers, which on the whole are cheaper than having to build a chip making plant.  Apple buying PA Semiconductor (who were behind the original StrongArm high performance chips) to acquire the designers of its own ARM-based A-series chips was a very clear demonstration of this trend.

    Software companies such as Facebook have moved into hardware with open source designs for data centre equipment, so expect more moves into the silicon side of the data centre, as Facebook has a vested interest in making sure that key components are not supplied by a key competitor.
    Instead the Alpine chips will appeal to other embedded designers of Wi-Fi routers, NAS, and gateways for the connected home that enable them to support a wide range of devices and rapidly deliver innovative in-home services to consumers.
    Today, in-home gateways and Wi-Fi routers are severely limited by the lack of network and compute resources, constraining what services can be offered on devices in the home and forcing consumers to acquire multiple devices for networking, storage, media management, backup, and internet connectivity. This is because the standard processor for an in-home networking or storage device has limited general-purpose compute capability and depends significantly on hardware acceleration and deep software optimizations to reach target performance. This architecture slows delivery of new services to consumers by requiring changes to hardware or months of software optimizations to accommodate new features.
    Alpine helps to eliminate these challenges for service providers and OEMs by providing up to four cores of high performance general–purpose compute, advanced storage interfaces, PCIe Gen3, and multimode Ethernet connectivity of up to 10G to allow Alpine-based products to support many devices with services needed in the connected home including storage management, multimedia, IoT management, and cloud connectivity. With enterprise-class performance and features like DDR4 and 2MB of L2 cache, Alpine enables service providers and OEMs to rapidly roll out new consumer services, leverage open source or third-party applications, and meet performance demands without the need for hardware acceleration or custom software optimizations.
    "In the fast-growing home application marketplace, new use cases and consumer needs are rapidly invented and adopted. To stay competitive, OEMs and service providers therefore need to quickly add support for the new features that give consumers the ability to enjoy the latest applications without changing hardware or waiting for months to get updated software," said Gary Szilagyi, Vice President of Annapurna Labs. "Our Alpine platform-on-chip and subsystems product line gives service providers and OEMs a high-performance platform on which they can design hardware that will support growing consumer demands for innovative services, fast connectivity, and many connected devices."
    Annapurna maintains Alpine support in the Linux and FreeBSD open source projects. These standard open source operating systems allow third parties to easily run their applications and drivers on the Alpine platform and quickly qualify updated software on Alpine-based products. Multiple third party applications for the home segment run on the Alpine platform, including video streaming, security, and cloud connectivity. Drivers for components used in home devices have been ported and tested to run on Alpine including drivers for Wi-Fi chips, multimode Ethernet PHYs, and Ethernet switches.
    The Alpine platform works with a variety of standard open source libraries and development models including Data Plane Development Kit (DPDK), OpenWRT, and open source hypervisor and container frameworks. Running DPDK on Alpine delivers 10G performance with low resource usage to enable high throughput on the network, while still running many services on the devices. Alpine platform’s support for common open-source hypervisor and container frameworks allows isolation of applications from critical networking and storage services enabling rapid application deployment and upgrades without impacting basic services.
    Home gateway, Wi-Fi router, and NAS product designs based on Alpine are currently available from multiple original device manufacturers (ODMs) to give OEMs and service providers a choice of partners and to speed the development of new products and product refreshes. In addition, Annapurna offers a hardware development kit (HDK) for Alpine-based designs, which includes schematics files, layout files, thermal guidelines, and a bill of material (BoM). The HDK enables OEMs to leverage their own in-house resources, contract manufacturers, or other ODMs.
    The Alpine platform is designed to bring enterprise-class reliability to the home by integrating thermal sensors, and parity/error correcting code (ECC) on internal buses, external buses, and memory. Further, Alpine provides power savings with configurable core power states, PCIe power states for on-chip components, and support for multiple wake up methods including Wake on LAN (WoL), wake on event, and wake on interrupt.
    "There is significant growth in the home Wi-Fi segment with most of the demand occurring on high-performance routers. As a leading provider in this segment, we are committed to providing our customers with high performing solutions," said Tenlong Deng, Vice President of ASUS Networking & Wireless Devices Business Unit. "The increased demand for new applications and use models requires additional compute and more flexibility. We are collaborating with Annapurna on these technologies and believe that they have one of the most advanced and flexible silicon solutions in the marketplace."
    "In the home network, consumers are asking for more services like media processing, HD video streaming, better security, and tighter integration of cloud services. Our router, gateway, and NAS product lines provide exceptional user experience and integrate many of the services needed by our customers," said Richard Jonker, General Manager & Vice President at NETGEAR. "Our recently announced ReadyNAS 214 is based on Annapurna's Alpine quad-core and packs in a rich set of services including PLEX media server with live transcoding capabilities, a private cloud for the home, 5 levels of security and a seamless backup solution for all connected devices. Using the Alpine quad core chip, we are able to run all of these services at very high performance. We like the Annapurna architecture and plan to collaborate with Annapurna on future projects."
    "We offer rich functionality and applications in our NAS devices. With the powerful dual and quad-core Alpine processors product line, our customers can benefit from high-performance NAS products with cutting-edge solutions," said Meiji Chang, General Manager of QNAP Systems. "We have launched the dual-core 2-bay TS-231+ and 4-bay TS-431+, and the 5-bay quad-core TS-531P NAS products that support Docker and Linux container virtualization. Our NAS products also support PLEX media server for affordable optional multimedia applications. We are working closely with Annapurna Labs to further strengthen our product portfolio in 2016."
    "We believe in building powerful, high-value storage solutions for homes and businesses that need to manage rapid data growth nowadays," said Jones Tsai, Hardware Design Director of Synology, an award winning NAS provider. "We have launched several products including the Synology DiskStation DS2015xs, DS1515, DS715, and DS416 using the Alpine chips. These enable our customers to enjoy features such as excellent encryption performance and built-in 10G support at a competitive price, making sure they are provided with a very effective approach to file management, sharing, and protection."



    Monday, January 04, 2016

    ST teams with ClevX for wireless security for IoT

    By Nick Flaherty www.flaherty.co.uk

    Claim World’s First Wireless User-Authentication Technology Platform for IoT-Device Security
    STMicroelectronics has teamed up with US encrypted flash-drive supplier ClevX to allow encrypted portable storage that is accessed with Bluetooth Smart wireless user authentication.
    This means users can interact with secure portable storage (full-disk, XTS-AES 256-bit encryption) from their smartphones or wearable devices where all user data on the drive is encrypted and can be locked/unlocked using single- or multi-factor authentication. The technology is ideally suited for consumer and industrial applications such as healthcare, home automation and security, secure-access control systems, and portable data storage by providing a secure central repository for data.
    “IoT-device authentication has long required trade-offs among security, convenience and mobility. The ClevX DataLock BT-secured portable storage provides the capability to actually enjoy the best of all worlds,” said Luca Difalco, VP of Marketing at STMicroelectronics’ Americas Region. “While we’re demonstrating the capability in an easy-to-use hardware-encrypted secure USB-Drive, the elegance and versatility of the solution is provided by an application that we can add to our BlueNRG device to make lock-down security accessible via Bluetooth Smart.”
    ST and ClevX have reference designs for secure portable storage media, including Flash, hard-disk, and solid-state disk drives. These designs use ST’s BlueNRG Bluetooth Smart chips and ARM Cortex-M0+-based STM32L0 microcontroller that includes an AES encryption engine.The designs and software are immediately available for licensing and partnerships, including both ST/ClevX-based hardware and firmware in addition to the related smartphone and wearables apps.

    The ST/ClevX reference designs are OS-host agnostic. USB drives with the DataLock BT technology operate across all computer platforms and embedded systems while providing various easy-to-use security layers (including a wireless lock/unlock mechanism, phone as an authentication factor, phone + PIN, or phone + PIN + userID/location/time). The reference designs support USB Remote Management, which can be critical for corporate deployments and remote password resets, drive disabling and erasing, and successful implementation of corporate-wide policies. 
    “With the sensitive personal and corporate information that people carry on their USB drives, loss can easily lead to substantial financial penalties and undesired public disclosure,” said Lev Bolotin, Founder and CEO of ClevX. “Using ST and ClevX technologies, the DataLock BT Security solution protects data on a USB. Consumers, healthcare workers, mobile professionals, and corporations can improve their productivity and security on-the-go by using their phones to authenticate themselves to their USB drives and change security options, as required.”
    Founded in 2005, ClevX is a Seattle-based IP/Technology development and licensing company with a secure, portable USB storage platform that is OS-agnostic, hardware-encrypted and bootable, as well as FIPS 140-2 Level 3 Certified devices and portable software applications.