Silicon Motion Technology has launched a single-chip SSD with a PCIe Gen 3 NVMe 1.3 interface for high-performance mission critical applications.
The FerriSSD SM689 supports PCIe Gen 3x4 interface while the SM681 supports PCI Gen 3x2 interface - exhibiting sequential read speed of up to 1.45GB/s and sequential write speed of up to 650MB/s. Both products can support multiple capacity configurations ranging from 16GB to 256GB and include enterprise-grade advanced data integrity and reliability capabilities using Silicon Motion’s proprietary end-to-end data protection, ECC and data caching technologies.
These sit alongside the PATA (SM601) and SATA (SM619) single chip SSDs for embedded computing applications in industrial, commercial, enterprise and automotive end-markets. The SSDs are customizable via firmware, and offer enhanced reliability and robust data integrity features that are essential for the extreme operating environments of these applications.
"The FerriSSD storage solutions are popular with automotive and industrial designers, allowing them to replace a hard disk drive with reliable solid-state alternatives," said Nelson Duann, Senior Vice President of Marketing and OEM Business at Silicon Motion. "The addition of a PCIe NVMe interface will enable significantly better performance for applications such as AI and autonomous driving.”
The SM689 and SM681 include end-to-end data path protection, which applies error correction code (ECC) to the SRAM and DRAM buffers as well as to the primary NAND Flash memory array, as well as a DRAM data cache to ensure data programming and enable data redundancy without delaying host processor operations. A Hybrid Zone enables a single disk to be partitioned into single-level cell (SLC) and multi-level cell/three-level cell (MLC/TLC) zones, enabling faster access speeds and data retention.
Intelligent Scan/DataRefresh protects against the higher data loss from operating at high temperatures while Silicon Motion's NANDXtend technology incorporates a proprietary 4th generation high-performance LDPC ECC engine with RAID, ensuring better data integrity even in extreme physical environments
The single chip package measures 16mm x 20mm (SM689) and 11.5mm x 13mm (SM681) and supports industrial temperatures from -40 to 85 degrees Celsius. Densities ranging from 16GB to 256GB at launch, and the family in in production.